IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP48,.6 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDIP-T48 |
| 端子数量 | 48 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP48,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 |
| SN74LS481NP1 | SN74LS481JQP4 | SN74LS481JQ4 | SN74LS481JQ | SN74LS481N3 | SN74LS481NP3 | SN74LS481N1 | SN54LS481JQ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP48,.6 | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | QIP, QUIP48A,.6/.8 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDIP-T48 | R-XQIP-P48 | R-XQIP-P48 | R-XQIP-P48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-XQIP-P48 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | QIP | QIP | QIP | DIP | DIP | DIP | QIP |
| 封装等效代码 | DIP48,.6 | QUIP48A,.6/.8 | QUIP48A,.6/.8 | QUIP48A,.6/.8 | DIP48,.6 | DIP48,.6 | DIP48,.6 | QUIP48A,.6/.8 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | PIN/PEG | PIN/PEG | PIN/PEG | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD |
| uPs/uCs/外围集成电路类型 | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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