Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | QFP |
| 包装说明 | PLASTIC, LQFP-208 |
| 针数 | 208 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.3 |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 32 |
| 最大时钟频率 | 66.67 MHz |
| DAC 通道 | YES |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e0 |
| 长度 | 30 mm |
| I/O 线路数量 | 96 |
| 端子数量 | 208 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | -20 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1.7 mm |
| 速度 | 167 MHz |
| 最大供电电压 | 2.05 V |
| 最小供电电压 | 1.75 V |
| 标称供电电压 | 1.9 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 30 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| HD6417729RF167B | HD6417729RBP167B | HD6417729RHF200B | SH7729R | HD6417729R | HD6417729RBP100B | HD6417729RBP133B | HD6417729RF133B | HD6417729RF100B | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | - | - | 符合 | 不符合 | 不符合 |
| 零件包装代码 | QFP | BGA | QFP | - | - | BGA | BGA | QFP | QFP |
| 包装说明 | PLASTIC, LQFP-208 | LFBGA, | PLASTIC, HQFP-208 | - | - | LFBGA, | CSP-240 | LFQFP, | LFQFP, |
| 针数 | 208 | 240 | 208 | - | - | 240 | 240 | 208 | 208 |
| Reach Compliance Code | compliant | unknow | compli | - | - | unknow | compli | compli | unknow |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 具有ADC | YES | YES | YES | - | - | YES | YES | YES | YES |
| 位大小 | 32 | 32 | 32 | - | - | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 66.67 MHz | 66.67 MHz | 66.67 MHz | - | - | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz |
| DAC 通道 | YES | YES | YES | - | - | YES | YES | YES | YES |
| DMA 通道 | YES | YES | YES | - | - | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G208 | S-PBGA-B240 | S-PQFP-G208 | - | - | S-PBGA-B240 | S-PBGA-B240 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e0 | - | e0 | - | - | - | e1 | e0 | e0 |
| 长度 | 30 mm | 13 mm | 30.6 mm | - | - | 13 mm | 13 mm | 30 mm | 30 mm |
| I/O 线路数量 | 96 | 96 | 96 | - | - | 96 | 96 | 96 | 96 |
| 端子数量 | 208 | 240 | 208 | - | - | 240 | 240 | 208 | 208 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | - | - | 75 °C | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | - | - | -20 °C | -20 °C | -20 °C | -20 °C |
| PWM 通道 | NO | NO | NO | - | - | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFBGA | FQFP | - | - | LFBGA | LFBGA | LFQFP | LFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, FINE PITCH | - | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 260 | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | FLASH | FLASH | FLASH | - | - | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.7 mm | 1.4 mm | 3.56 mm | - | - | 1.4 mm | 1.4 mm | 1.7 mm | 1.7 mm |
| 速度 | 167 MHz | 167 MHz | 200 MHz | - | - | 100 MHz | 133 MHz | 133 MHz | 100 MHz |
| 最大供电电压 | 2.05 V | 2.05 V | 2.15 V | - | - | 1.95 V | 2.05 V | 2.05 V | 1.95 V |
| 最小供电电压 | 1.75 V | 1.75 V | 1.85 V | - | - | 1.55 V | 1.65 V | 1.65 V | 1.55 V |
| 标称供电电压 | 1.9 V | 1.9 V | 2 V | - | - | 1.7 V | 1.8 V | 1.8 V | 1.7 V |
| 表面贴装 | YES | YES | YES | - | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | BALL | GULL WING | - | - | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.5 mm | - | - | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | QUAD | - | - | BOTTOM | BOTTOM | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 20 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 30 mm | 13 mm | 30.6 mm | - | - | 13 mm | 13 mm | 30 mm | 30 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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