Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | BGA |
| 包装说明 | CSP-240 |
| 针数 | 240 |
| Reach Compliance Code | compliant |
| 具有ADC | YES |
| 地址总线宽度 | 26 |
| 位大小 | 32 |
| 最大时钟频率 | 20 MHz |
| DAC 通道 | YES |
| DMA 通道 | NO |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-XBGA-B240 |
| JESD-609代码 | e0 |
| 长度 | 13 mm |
| I/O 线路数量 | 81 |
| 端子数量 | 240 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | -20 °C |
| PWM 通道 | NO |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | LFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 速度 | 20 MHz |
| 最大供电电压 | 2.05 V |
| 最小供电电压 | 1.75 V |
| 标称供电电压 | 1.9 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 13 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| HD6417709SBP167B | HD6417709SHF200B | HD6417709SF167B | SH7709S | HD6417709S | HD6417709SF100B | HD6417709SBP100B | HD6417709SBP133B | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series | Renesas 32-Bit RISC Microcomputer Super RISC engine Family/SH7700 Series |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | QFP | QFP | - | - | QFP | BGA | BGA |
| 包装说明 | CSP-240 | PLASTIC, HQFP-208 | PLASTIC, LQFP-208 | - | - | LFQFP, | CSP-240 | CSP-240 |
| 针数 | 240 | 208 | 208 | - | - | 208 | 240 | 240 |
| Reach Compliance Code | compliant | compli | compliant | - | - | compli | compli | compli |
| 具有ADC | YES | YES | YES | - | - | YES | YES | YES |
| 地址总线宽度 | 26 | 26 | 26 | - | - | 26 | 26 | 26 |
| 位大小 | 32 | 32 | 32 | - | - | 32 | 32 | 32 |
| 最大时钟频率 | 20 MHz | 66.67 MHz | 66.67 MHz | - | - | 66.67 MHz | 20 MHz | 66.67 MHz |
| DAC 通道 | YES | YES | YES | - | - | YES | YES | YES |
| DMA 通道 | NO | YES | YES | - | - | YES | NO | YES |
| 外部数据总线宽度 | 16 | 32 | 32 | - | - | 32 | 16 | 32 |
| JESD-30 代码 | S-XBGA-B240 | S-PQFP-G208 | S-PQFP-G208 | - | - | S-PQFP-G208 | S-XBGA-B240 | S-XBGA-B240 |
| JESD-609代码 | e0 | e0 | e0 | - | - | e0 | e0 | e0 |
| 长度 | 13 mm | 28 mm | 28 mm | - | - | 28 mm | 13 mm | 13 mm |
| I/O 线路数量 | 81 | 81 | 81 | - | - | 81 | 81 | 81 |
| 端子数量 | 240 | 208 | 208 | - | - | 208 | 240 | 240 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | - | - | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | - | - | -20 °C | -20 °C | -20 °C |
| PWM 通道 | NO | NO | NO | - | - | NO | NO | NO |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | LFBGA | FQFP | LFQFP | - | - | LFQFP | FBGA | LFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | FLATPACK | FLATPACK | - | - | FLATPACK | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 3.56 mm | 1.7 mm | - | - | 1.7 mm | 3.56 mm | 1.4 mm |
| 速度 | 20 MHz | 200 MHz | 167 MHz | - | - | 100 MHz | 20 MHz | 133 MHz |
| 最大供电电压 | 2.05 V | 2.15 V | 2.05 V | - | - | 1.95 V | 1.95 V | 2.05 V |
| 最小供电电压 | 1.75 V | 1.85 V | 1.75 V | - | - | 1.55 V | 1.55 V | 1.65 V |
| 标称供电电压 | 1.9 V | 2 V | 1.9 V | - | - | 1.7 V | 1.7 V | 1.8 V |
| 表面贴装 | YES | YES | YES | - | - | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | GULL WING | GULL WING | - | - | GULL WING | BALL | BALL |
| 端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | BOTTOM | QUAD | QUAD | - | - | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 13 mm | 28 mm | 28 mm | - | - | 28 mm | 13 mm | 13 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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