
EEPROM I2C BUS 400KHz 2Kbit 2.5-5.5V
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 11 weeks |
| Samacsys Description | ROHM - BR24A02F-WME2 - SERIAL EEPROM, 400KHZ, SOP-8 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 100000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 5 mm |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 1.78 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000002 A |
| 最大压摆率 | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| BR24A02F-WME2 | BR24A04FJ-WME2 | BR24A16F-WME2 | BR24A02FVM-WMTR | BR24A01AF-WME2 | BR24A08F-WME2 | BR24A04F-WME2 | BR24A02FJ-WME2 | BR24A01AFJ-WME2 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM I2C BUS 400KHz 2Kbit 2.5-5.5V | EEPROM I2C BUS(2-Wre) 4K SOP-J8 EEPROM | EEPROM I2C BUS 400KHz 16Kbit 2.5-5.5V | EEPROM I2C BUS 400KHz 2Kbit 2.5-5.5V | EEPROM I2C BUS 400KHz 1Kbit 2.5-5.5V | EEPROM I2C BUS 400KHz 8Kbit 2.5-5.5V | EEPROM I2C BUS 400KHz 4Kbit 2.5-5.5V | EEPROM I2C BUS 400KHz 2Kbit 2.5-5.5V | EEPROM I2C BUS 400KHz 1Kbit 2.5-5.5V |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | SOP-8 | SOP-J8 | SOP-8 | MSOP-8 | SOP-8 | SOP-8 | SOP-8 | SOP-J8 | SOP-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | 11 weeks | 10 weeks | 11 weeks | 10 weeks | 11 weeks | 11 weeks | 11 weeks | 11 weeks | 11 weeks |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | 1010DDMR | 1010MMMR | 1010DDDR | 1010DDDR | 1010DMMR | 1010DDMR | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 5 mm | 4.9 mm | 5 mm | 2.9 mm | 5 mm | 5 mm | 5 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 2048 bit | 2048 bit | 8192 bit | 2048 bit | 1024 bit | 4096 bit | 2048 bit | 2048 bit | 1024 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 1024 words | 256 words | 128 words | 512 words | 256 words | 256 words | 128 words |
| 字数代码 | 256 | 256 | 1000 | 256 | 128 | 512 | 256 | 256 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X8 | 256X8 | 1KX8 | 256X8 | 128X8 | 512X8 | 256X8 | 256X8 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | VSSOP | SOP | SOP | SOP | SOP | LSOP |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | 1.78 mm | 1.775 mm | 1.78 mm | 0.9 mm | 1.71 mm | 1.78 mm | 1.78 mm | 1.775 mm | 1.65 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
| 最大压摆率 | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 3.9 mm | 4.4 mm | 2.8 mm | 4.4 mm | 4.4 mm | 4.4 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | - |
| 厂商名称 | ROHM(罗姆半导体) | ROHM(罗姆半导体) | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
| 零件包装代码 | SOIC | SOIC | SOIC | - | - | SOIC | SOIC | SOIC | - |
| 针数 | 8 | 8 | 8 | - | - | 8 | 8 | 8 | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | - |
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