IA
Features
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Applications
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NT
Lead free as standard
RoHS compliant*
Protects 1 line
Bidirectional configuration
ESD protection
Cell phones
PDAs and notebooks
Digital cameras
MP3 players and GPS
*R
oH
S
CO
M
PL
CD0402-TxxC – TVS Diode Array Series
General Information
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Transient Voltage Suppressor Array diodes for surge and ESD
protection applications, in 0402 chip package size format. The Transient Voltage
Supressor Array series offers a choice of voltage types ranging from 3 V to 36 V in a
bidirectional configuration. Bourns
®
Chip Diodes conform to JEDEC standards, are
easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
The Bourns
®
device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC
61000-4-5 (Surge) requirements.
Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Power (t
p
= 8/20 µs)
Operating Temperature
Storage Temperature
1
Symbol
P
PP
T
J
T
STG
Value
250
-55 ˚C to 150 ˚C
-55 ˚C to 150 ˚C
Unit
W
˚C
˚C
CD0402-
Parameter
Symbol
T3.3C
T05C
T08C
T12C
T15C
T24C
T36C
Unit
Min. Breakdown Voltage @ 1 mA
Working Peak Voltage
Maximum Clamping Voltage @ IP
2
Maximum Clamping Voltage
@ 8/20 µs VC @ IPP
2
Maximum Leakage Current @ VWM
Typical Capacitance @ 0 V, 1 MHz
Notes:
1. See Peak Pulse Power vs. Pulse Time.
2. See Pulse Wave Form.
3. Max. Leakage Current <500
µA
@ 2.8 V.
4. Max. Leakage Current <500 nA @ 3.3 V.
5. Max. Leakage Current <200 nA @ 5 V.
V
BR
V
WM
V
F
V
F
I
D
C
4.0
3.3
7.0
12.5 V
@ 20 A
75
3
6.0
5.0
11.0
8.5
8.0
13.4
13.3
12.0
19.0
29.7 V
@9A
1
50
16.7
15.0
24
35.7 V
@7A
1
40
26.7
24.0
43
55 V
@5A
1
30
40.0
36.0
64
84 V
@3A
1
25
V
V
V
V
µA
pF
14.7 V 19.2 V
@ 17 A @ 13 A
10
4
10
5
150
100
75
All devices are bidirectional. Electrical Characteristics apply in both directions.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD0402-TxxC – TVS Diode Array Series
Product Dimensions
This is a 0402 package with lead free 100 % Sn plating on the
bond pads. It weighs approximately 30 mg and has a flammability
rating of UL 94V-0.
Recommended Footprint
A
A
B
C
B
C
D
G
Dimensions (Nominal)
D
E
F
H
A
B
C
D
Dimensions
DIMENSIONS =
0.69
0.027
0.46
0.018
0.20
0.008
0.46
0.018
I
MILLIMETERS
(INCHES)
A
B
C
D
E
F
G
H
I
DIMENSIONS =
0.41 - 0.51
0.016 - 0.020
0.81 - 0.91
0.032 - 0.036
0.96 - 1.02
0.038 - 0.040
0.10
NOM.
0.004
0.35
NOM.
0.014
0.46 - 0.51
0.018 - 0.020
0.20
NOM.
0.008
0.076 - 0.127
0.003 - 0.005
0.401 - 0.411
0.014 - 0.018
MILLIMETERS
(INCHES)
How To Order
CD 0402 - T 05 C
Common Code
Chip Diode
Package
• 0402 = 0402 Chip Package
Model
T = Transient Voltage Supressor
Working Peak Reverse Voltage
3.3 = 3.3 V
RWM
(Volts)
05 = 5 V
RWM
(Volts)
08 = 8 V
RWM
(Volts)
12 = 12 V
RWM
(Volts)
15 = 15 V
RWM
(Volts)
24 = 24 V
RWM
(Volts)
36 = 36 V
RWM
(Volts)
Suffix
C = Bidirectional Diode
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD0402-TxxC – TVS Diode Array Series
Performance Graphs
Peak Pulse Power vs Pulse Time
10,000
Pulse Wave Form
120
I
PP
– Peak Pulse Current (% of I
PP
)
100
80
60
40
20
0
0
5
10
15
t – Time (µs)
20
25
30
t
d
= t
|
I
PP
/2
t
t
Test Waveform Parameters
t
t
= 8 µs
t
d
= 20 µs
e
t
P
PP
– Peak Pulse Current (W)
1,000
250 W, 8/20 µs Waveform
100
10
0.01
1
10
100
1,000
10,000
t
d
– Pulse Duration (µs)
Power Derating Curve
100
80
60
40
20
Average Power
0
0
25
50
75
100
125
150
Peak Pulse Power
8/20 µs
Overshoot & Clamping Voltage
35
% of Rated Power
5 Volts per Division
T
L
– Lead Temperature (°C)
25
15
5
-5
-90.000 ns
10.000 ns
ESD Test Pulse - 25 kilovolt, 1/30 ns (waveshape)
110.000
Typical Clamping Voltage vs. Peak Pulse Current
14
V
C
- Clamping Voltage - Volts
12
10
8
6
4
2
0
0
5
10
15
20
I
PP
– Peak Pulse Current - Amps
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD0402-TxxC – TVS Diode Array Series
Block Diagram
Typical Part Marking
There is no part marking on the back side of the devices. The part
number for the device is located on the Tape and Reel label.
Packaging
The surface mount product is packaged in an 8 mm x 4 mm Tape and Reel format per EIA-481 standard.
TOP SIDE VIEW
(INTO COMPONENT POCKET)
DIMENSIONS =
0.3
±
0.05
(.01
±
.002)
2.0
±
0.05
(.08
±
.002)
4.0
±
0.1
(.16
±
.004)
1.5
±
0.1/-0
(.06
±
.004/-0)
DIA.
1.75
±
0.1
(.07
±
.004)
MILLIMETERS
(INCHES)
R
0.3
MAX.
(0.01)
8.0
±
0.3
(.31
±
.01)
3.5
±
0.3
(.14
±
.01)
1.18
±
0.1
(.05
±
.004)
4.0
±
0.3
(.16
±
.01)
R 0.25 TYP.
(0.010)
0.76
±
0.1
(.03
±
.004)
1.52
±
0.1
(.06
±
.004)
ORIENTATION
OF COMPONENT
IN POCKET
BACKSIDE FACING UP
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0524 10/05
嵌入式系统
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