0.2 A, 200 V, SILICON, SIGNAL DIODE
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microsemi |
| 零件包装代码 | DIE |
| 包装说明 | DIE-2 |
| 针数 | 2 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 配置 | SINGLE |
| 二极管元件材料 | SILICON |
| 二极管类型 | RECTIFIER DIODE |
| JESD-30 代码 | X-XUUC-N1 |
| JESD-609代码 | e0 |
| 元件数量 | 1 |
| 端子数量 | 1 |
| 最大输出电流 | 0.2 A |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大重复峰值反向电压 | 200 V |
| 表面贴装 | YES |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |

| CD5195 | CD483B | CD486B | CD485B | CD645 | CD5196 | CD5194 | |
|---|---|---|---|---|---|---|---|
| 描述 | 0.2 A, 200 V, SILICON, SIGNAL DIODE | 0.2 A, 80 V, SILICON, SIGNAL DIODE | 0.2 A, SILICON, SIGNAL DIODE | 0.2 A, SILICON, SIGNAL DIODE | 0.4 A, 270 V, SILICON, SIGNAL DIODE | 0.2 A, 250 V, SILICON, SIGNAL DIODE | 0.2 A, SILICON, SIGNAL DIODE |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| 零件包装代码 | DIE | DIE | DIE | DIE | DIE | DIE | DIE |
| 包装说明 | DIE-2 | DIE-2 | DIE-2 | DIE-2 | DIE-2 | DIE-2 | DIE-2 |
| 针数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Reach Compliance Code | unknow | unknow | unknow | compli | unknow | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| 二极管类型 | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| JESD-30 代码 | X-XUUC-N1 | X-XUUC-N1 | X-XUUC-N1 | X-XUUC-N1 | X-XUUC-N1 | X-XUUC-N1 | X-XUUC-N1 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大输出电流 | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.4 A | 0.2 A | 0.2 A |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大重复峰值反向电压 | 200 V | 80 V | 250 V | 200 V | 270 V | 250 V | 80 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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