电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP21007R50FLF

产品描述MELF Resistors
产品类别无源元件   
文件大小437KB,共4页
制造商TT Electronics
下载文档 详细参数 全文预览

CHP21007R50FLF概述

MELF Resistors

CHP21007R50FLF规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
MELF Resistors
系列
Packaging
Reel
安装风格
Mounting Style
PCB Mount

文档预览

下载PDF文档
Resistors
Cylindrical High Power
Surface Mount Metal Glaze™
CHP
CHP Series
Surface Mount Metal Glaze
TM
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
Up to 2 watts
RoHS-compliant version available
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
AEC-Q200
150°C maximum operating temperature
Cylindrical High Power
Metal Glaze™
thick film element
fired at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
High
nickel barrier
temperature
Solder over
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
nickel barrier
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code
1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Maximum
m Change
Maximu
Change
As specified
Test Method
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.3
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
Test Method
Thermal Shock
Low Temperature Operation
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.5
(-65°C)
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Moisture Resistance
Exposure
Resistance to Bonding
High Temperature Exposure
±0.5% + 0.01 ohm
±1% for R>100K ohm
±1% for R>100KΩ
±0.5% +.01 Ω
MIL-R-55342H Par 3.12
MIL-PRF-55342H, §4.8.7
2.5 x
P x R
for 5 seconds
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
±1% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
Temperature Coefficient
Solderability
Life Test
Moisture Resistance
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.11
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
exert pull on chip contacts for 5 seconds
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
Solderability
Life Test
±1% +.01 Ω
IRC – defined
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
Chip mounted in center of 90mm long board, deflected 1mm so as to
(no mechanical damage)
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
95%
0.01 ohm
±1% +
minimum coverage
no mechanical damage
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC reserves the right to make changes in product specification
(no mechanical damage)
without notice or liability.
General Note
Terminal Adhesion
Strength (flex)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
IRC-defined
Device mounted in center of 90mm long board, deflected 1 mm to exert
pull on contacts for 5 seconds
General Note
• Facsimile: 361 992 3377 • Website: www.irctt.com
Telephone: 361 992 7900
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
CHP
BI Technologies
Series Issue March
Welwyn
3
IRC
2011 Sheet 1 of
A subsidiary of
TT electronics plc
http://www.ttelectronics.com/resistors
© TT Electronics plc
03.18
请教SDRAM存储问题
俺最近开发的产品上用了两片SDRAM,单芯片的容量为512Mbit,4个bank,每个bank容量是8192*512*32bit(也就是13根row,9根colum,每个单元32bit宽),而I/O(数据线)是16根,连接CPU(32bit指令) ......
6565 嵌入式系统
Image is too large for current RAM and RAMIMAGE settings
RAM AutoSize: RAM Start=8ad80000 RAM Size=fb280000 请问这里报RAM Size=fb280000, 是什么意思,有这么大么?...
liuyi17 嵌入式系统
电平变换的方法
1,总线收发器(Bus Transceiver): 常用器件: SN74LVTH245A(8位)、SN74LVTH16245A(16位) 特点:3.3V供电,需进行方向控制, 延迟:3.5ns,驱动:-32/64mA, 输入容限:5V 应用:数据 ......
fish001 微控制器 MCU
9B96 与 9D96
请问9B96和9D96有啥区别啊? 还有8962上的flash 和 ram都用完了, 除了换9B/ 9D有EPI外,有没有别的方法?还有哪些芯片可以外接ram和flash的?谢谢!...
tekkon 微控制器 MCU
TMS320LF2407A的奇怪问题
我用TMS32LF2407做了一个非常小的系统。全部工作就是用XF管脚控制一个LED的闪烁。我把程序烧进FLASH后,用防真器带着跑(MP/MC#=0),程序正常运行。但是我把防真器去掉,重新上电后,程序不能 ......
jerry_liu 微控制器 MCU
请问有测试ADC 各项指标的详细介绍的文档吗
请问有测试ADC 各项指标的详细介绍的文档吗,比方如何测试PSRR,如何测试SFDR等指标 ...
yanhui_man_jj 模拟电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1213  640  2480  1490  2574  7  47  44  55  21 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved