CYStech Electronics Corp.
High voltage switching (double) diodes
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 1/4
CMBD2004/A/C/SN3
Description
High voltage switching diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
•Fast
switching speed
•Low
forward voltage drop
•Small
plastic SMD package
Mechanical Data
•Case
: SOT-23, molded plastic
•Terminals
: Solderable per MIL-STD-202 Method 208
•Weight
: 0.008 grams(approx.)
Pinning
Pin
1
2
3
Description
CMBD2004 CMBD2004A CMBD2004C CMBD2004S
A
K1
A1
A1
NC
K2
A2
K2
K
A1,A2
K1,K2
K1,A1
Outline
SOT-23
3
1
2
(1) CMBD2004
(2)CMBD2004A
Marking:
Type
CMBD2004 N3
CMBD2004AN3
CMBD2004CN3
CMBD2004SN3
Marking Code
D53
DB8
DB7
DB6
(3)CMBD2004C
(4)CMBD2004S
Diode configuration and symbol
CMBD2004/A/C/SN3
CYStek Product Specification
CYStech Electronics Corp.
Absolute Maximum Ratings
(Ta=25℃, unless otherwise specified)
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 2/4
•
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150
°C
Junction Temperature Tj ............................................................................................................. +150
°C
•
Maximum Power Dissipation
Total Power Dissipation Ptot
(Note)
........................................................................................... 350 mW
•
Maximum Voltages and Currents
Repetitive Peak Reverse Voltage V
RRM
............................................................................................ 300 V
DC Blocking Voltage V
R
………………………………………………………………………….. 240V
RMS Reverse Voltage V
R
(
RMS)
…………………………………………………………………….. 170V
Continuous Forward Current I
F
(Note)
…………………………………………………………… 225 mA
Peak Repetitive Forward Current I
FRM
(Note)
………..………………………………………….625 mA.
Surge Non-repetitive Forward Current I
FSM
@ tp=1µs ........................................................................ 4A
@ tp=1s…….…………………………………………. 1A
•
Thermal Resistance, Junction to Ambient Air R
θJA
……………………………………….……357℃/W
Note : Parts mounted on FR-4 board. For double diodes, Ptot is the total power dissipation of both diodes.
Characteristics
(Ta=25°C)
Characteristic
Reverse Breakdown Voltage
Forward Voltage
(Note)
Symbol
V
BR
V
F
(1)
V
F
(2)
I
R
(1)
I
R
(2)
C
D
t
rr
Condition
I
R
=100µA
I
F
=20mA
I
F
=100mA
V
R
=240V,Tj=25℃
V
R
=240V,Tj=150℃
V
R
=0V, f=1MHz
I
F
=I
R
=30mA RL=100Ω
measured at IR=3mA
Min.
300
-
-
-
-
-
Max.
-
870
1000
100
100
5
50
Unit
V
mV
mV
nA
µA
pF
ns
Reverse Leakage Current
(Note)
Diode Capacitance
Reverse Recovery Time
Notes
:
Pulse test, tp=380µs, duty cycle<2%.
CMBD2004/A/C/SN3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Characteristics
1000
Instantaneous Forward Current---I
F
(mA)
Reverse Leakage Current---I
R
(μA)
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 3/4
Reverse Leakage Current vs Junction Temperature
100
100
10
10
1
1
0.1
0.1
0.01
0
1
Instantaneous Forward Voltage---V
F
(V)
2
0.01
0
100
Junction Temperature---Tj(℃)
200
Power Derating Curve
400
350
Power Dissipation---P
D
(mW)
300
250
200
150
100
50
0
0
50
100
150
200
Ambient Temperature---T
A
(℃)
CMBD2004/A/C/SN3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Diagram:
L
3
B
1
2
S
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 4/4
A
Marking:
L4_
DXX
V
G
C
D
K
3-Lead SOT-23 Plastic Surface Mounted
Package.
CYStek Package Code: N3
J
H
•
CMBD2004 N3 : Single Diode
(Marking Code D53)
•
CMBD2004AN3 : Common Anode. (Marking Code DB8)
•
CMBD2004CN3 : Common Cathode. (Marking Code DB7)
•
CMBD2004SN3 : Series Connected. (Marking Code DB6)
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.85
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CMBD2004/A/C/SN3
CYStek Product Specification
FPGA/CPLD
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