(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FSM
T
J
Value
40
Unit
V
1.0
40
−65
to +125
A
A
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
−
Junction−to−Lead
(T
L
= 25°C)
Symbol
R
qJL
Value
12
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(i
F
= 1.0 A, T
J
= 25°C)
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, T
J
= 25°C)
(Rated dc Voltage, T
J
= 100°C)
Symbol
V
F
i
R
Value
0.6
1.0
10
Unit
V
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
2
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
2
T
C
= 125°C
0.2
T
C
= 100°C
T
C
= 25°C
T
C
= -40°C
T
C
= -55°C
T
C
= 125°C
0.2
T
C
= 100°C
T
C
= 25°C
T
C
= -40°C
T
C
= -55°C
0.02
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.02
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRS140T3G, SBRS8140T3G
100
50
30
20
10
5
3
2
1
0.5
0.3
0.2
0.1
0.05
0.03
0.02
0.01
200
T
J
= 125°C
100°C
75°C
C, CAPACITANCE (pF)
180
160
140
120
100
80
60
40
20
0
4
8
12
16
20
24
28
32
36
40
0
0
4
8
12
16
20
24
28
32
36
40
NOTE: TYPICAL CAPACITANCE
AT 0 V = 160 pF
I R , REVERSE CURRENT (mA)
25°C
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
10
9
8
7
6
5
4
3
2
1
0
30
40
50
60
70
80
90 100
T
C
, CASE TEMPERATURE (°C)
110
120
130
DC
SQUARE WAVE
RATED VOLTAGE APPLIED
R
qJC
= 12°C/W
T
J
= 125°C
Figure 5. Current Derating (Case)
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
5
T
J
= 125°C
4
5
CAPACITANCE
LOAD
2
1
0
I
PK
I
AV
= 20
SQUARE
WAVE
π
DC
3
10
0
1
2
3
4
5
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Power Dissipation
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3
MBRS140T3G, SBRS8140T3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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