DATA SHEET
SE2622L: 2.4 GHz, 256 QAM Power Amplifier
Applications
DSSS 2.4 GHz WLAN (IEEE 802.11b)
OFDM 2.4 GHz WLAN (IEEE 802.11g)
OFDM 2.4 GHz WLAN (IEEE 802.11n)
OFDM 2.4 GHz WLAN (256 QAM)
Access points, PCMCIA, PC cards
Description
The SE2622L is a 2.4 GHz power amplifier designed for use in the
2.4 GHz ISM band for wireless LAN applications. The device
incorporates a power detector for closed loop monitoring of the
output power.
The SE2622L includes a digital enable control for device on/off
control.
The SE2622L temperature compensated power detector is highly
immune to mismatch at its output with less than 1.5 dB of
variation with a 2:1 mismatch. The device package and pinout for
the 16-pin QFN are shown in Figure 1. A block diagram of the
SE2622L is shown in Figure 2.
GND
VCC
Features
Single 3.3 V supply operation:
18 dBm, EVM =
35
dB, 256 QAM OFDM
20 dBm, EVM =
30
dB, 802.11n
23 dBm, ACPR <
32
dBc, 802.11b
Small signal gain: 31 dB typical
Integrated temperature compensated power detector
Digital power amplifier enable pin (V
EN
)
Lead Free, Halogen Free and RoHS compliant
Small footprint QFN (16-pin, 3
3
0.9 mm) package
(MSL1, 260
C
per JEDEC J-STD-020)
N/C
16
15
14
13
N/U
RF_IN 1
EN 2
GND
3
N/U 4
12
GND
11 RF_OUT/VCC
10 N/U
9 GND
Skyworks Green™
products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to
Skyworks
Definition of Green™,
document number
SQ04-0074.
5
GND
6
GND
7
DET
8
N/U
Y1122
Figure 1. SE2622L Pinout – 16-Pin QFN
(Top View)
VCC
EN
RF_IN
Input
Match
Inter-Stage
Match
Bias
Inter-Stage
Match
Detector
RF_OUT
VDET
Figure 2. SE2622L Block Diagram
ts042
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014
1
DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SE2622L are provided in Table 2. Recommended operating
conditions are specified in Table 3. Electrical specifications are
provided in Tables 4, 5, and 6.
Typical performance characteristics of the SE2622L are illustrated
in Figure 3.
Table 1. SE2622L Signal Descriptions
Pin
1
2
3
4
5,6
7
8
9
Name
RF_IN
EN
GND
N/U
GND
DET
N/U
GND
Description
Power amplifier RF input; DC block required
Digital pin used to power up and power down the IC
Ground
Not used
Ground
Analog power detector output
Not used
Ground
Pin
10
11
12
13
14
15
16
Paddle
Name
N/U
RF_OUT/VCC
GND
N/U
N/C
VCC
GND
GND
Not used
Power Amplifier RF output / Final stage collector
supply
Ground
Not used
No connect
Stages 1, 2 collector supply
Ground
Exposed die paddle; electrical and thermal ground
Description
Table 2. SE2622L Absolute Maximum Ratings (Note 1)
Parameter
Supply voltage on pins V
CC
Power amplifier enable
RF input power, RF_OUT terminated into 50
match
Storage temperature range
Electrostatic discharge:
Human Body Model (HBM), Class 1B
V
CC
V
EN
RF
IN
T
STG
ESD
500
V
40
Symbol
Minimum
0.3
0.3
Maximum
+4
+3.6
+10
+150
Units
V
V
dBm
C
Note 1:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION:
Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2622L Recommended Operating Conditions
Parameter
Supply voltage
Supply voltage on pins VCC3
Ambient temperature
V
CC
V
CC
3
T
A
Symbol
Minimum
3.0
3.0
–40
Maximum
3.6
3.6
85
Units
V
V
C
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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September 29, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202733C
DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Table 4. SE2622L Electrical Specifications: DC Characteristics (Note 1)
(V
CC
= V
CC3
= V
EN
= 3.3 V, T
A
= +25
C,
as Measured on Evaluation Board, Unless Otherwise Noted)
Parameter
Supply current (Sum of Vcc0, Vcc,
Vcc3)
Supply current (Sum of Vcc, Vcc3)
Supply current (Sum of Vcc, Vcc3)
Supply current
Logic high voltage
Logic low voltage
Input current logic high voltage
Input current logic low voltage
Enable pin input impedance
Symbol
Icc
-802.11b
Icc
-802.11g
I
CQ
I
OFF
V
ENH
V
ENL
I
ENH
I
ENL
Z
EN
Passive pull down
Test Condition
P
OUT
= +23 dBm, 11 Mbps CCK signal,
BT = 0.45, V
CC
= V
CC
3
= 3.3 V
Pout = +19 dBm, 54 Mbps OFDM signal,
Vcc = Vcc3 = 3.3 V
No RF
V
EN
= 0 V, No RF
1.3
0
300
<1
10
Min
Typical
250
175
125
2
10
V
CC
0.5
Max
Units
mA
mA
mA
A
V
V
A
A
kΩ
Note 1:
Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2622L Electrical Specifications: AC Characteristics (Note 1)
(V
CC
= V
CC3
= V
EN
= 3.3 V, f = 2.45 GHz, T
A
= +25
C,
as Measured on Evaluation Board, Unless Otherwise Noted)
Parameter
Frequency range
f
OFDM, 256 QAM, HT40,
35
dB EVM
OFDM, 256 QAM, HT20,
35
dB EVM
OFDM, 256 QAM, HT40,
38
dB EVM
Output power
P
OUT
OFDM, 64 QAM, HT20,
30
dB EVM
CCK signal, BT = 0.045, Mask
802.11n, HT20, all data rates, Mask
802.11n, HT40, all data rates, Mask
Output 1dB compression point
Input return loss
Small signal gain
Gain Variation over band
Harmonic
Rise and fall time
Stability
Tolerance to output load mismatching
P
1d
B
S
11
S
21
S
21
2f
3f
t
R
, t
F
STAB
VSVR
P
OUT
= +23 dBm, 54 Mbps OFDM signal,
64 QAM, VSWR = 6:1. All Phases
P
OUT
= +23 dBm, 54 Mbps OFDM signal,
64 QAM, VSWR = 10:1. All Phases
P
IN
=
25
dBm
P
IN
=
25
dBm, f = 2400 to 2500 MHz
P
OUT
= +23 dBm, CW
26
No modulation
+24.5
Symbol
Test Condition
Min
2400
+18
+19
+16
+20
+23
+23
+22
+27
12
31
1
50
50
0.5
10
34
dBm
dB
dB
dB
dBm/MHz
dBm/MHz
s
dBm
Typ
Max
2500
Units
MHz
All non-harmonically related outputs less
than
50
dBc/100 kHz
No damage
Note 1:
Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014
3
DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Table 6. SE2622L Electrical Specifications: Power Detector Characteristics (Note 1)
(V
CC
= V
CC3
= V
EN
= 3.3 V, f = 2.45 GHz, T
A
= +25
C,
as Measured on Evaluation Board, Unless Otherwise Noted)
Parameter
P
OUT
detect range
Detector voltage
Detector voltage
Detector voltage
Output impedance
DC load impedance
Symbol
PDR
VDET
VDET
VDET
PDZ
OUT
PDZ
LOAD
10
P
OUT
= +23 dBm
P
OUT
= +21 dBm
P
OUT
= No RF
Test Condition
Min
0
1.04
0.87
0.33
2.3
Typical
Max
P
1d
B
Units
dBm
V
V
V
k
k
Note 1:
Performance is guaranteed only under the conditions listed in this table.
1.2
1.1
1
0.9
V
DET
(V)
0.8
0.7
0.6
0.5
0.4
0.3
3
5
7
9
11
13
15
17
19
21
23
2400
2450
ts043
2500
25
Output Pow er (dBm )
Figure 3. SE2622L Power Detector Characteristics
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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September 29, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202733C
DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Evaluation Board Description
The SE2622L-EK1 Evaluation Board is used to test the
performance of the SE2622L-R PA. A typical application
Header
6
J3
1
2
3
4
5
6
VDET
VCC
VCC
VEN
schematic diagram is provided in Figure 4. Table 7 provides the
Bill of Materials (BOM) list for Evaluation Board components.
C4
1500 pF
C3
10 pF
C5
DNI
C6
DNI
VCC
Pad
C9
10 pF
C10
DNI
C11
4.7 μF
16
15
14
N/C
GND
GND
VCC
N/U
13
J1
SMA
RFIN
VEN
C2
DNI
1 RF_IN
2 EN
3
GND
4 N/U
U1
SE2622L
GND
RF_OUT/VCC
N/U
GND
12
L2
4.7 nH
C15
15 pF
L3
1.5 nH
J2
SMA
T1
11
10
T2
T5
T3
9
C14
1.8 pF
T4
C17
1.0 pF
C16
1.5 pF
GND
GND
DET
7
VCC
DNI = Do Not Install
C13
DNI
5
6
8
N/U
Notes:
VDET
C19
DNI
R1
DNI
T1: L = 0.9 mm, W = 0.424 mm
T1 length is measured from the outside
edge of the device lead to the middle
edge of the C14 land pad.
T2: L = 1.95 mm, W = 0.424 mm
T2 length is measured from the middle
edge of the C14 land pad to the inside
edge of the C15 land pad.
T3: L = 1.04 mm, W = 0.424 mm
T3 length is measured from the outside
edge of the TX line to the inside
edge of the C14 land pad.
T4: L = 1.04 mm, W = 0.424 mm
T4 length is measured from the outside edge
of the TX line to the inside edge of the C16
land pad. C16 is centered on the middle edge of
the right land pad of C15.
T5: L = 1.50 mm, W = 0.424 mm
T5 length is measured from the inside
edge of the C15 land pad to the inside
edge of the L3 land pad.
C17 is placed immediately after L3 with the
top land pad directly on the TX track.
L2 is placed 1.4 mm away from the device.
This dimension is measured from the outside
edge of the device lead to the middle edge of
the land pad of L2. The outer edge of the land
pad is aligned with the center of the TX track.
All trace dimensions are based on having a
ground plane immediately below the trace with
0.254 mm off FR406 as the substrate.
Y1118
Figure 4. SE2622L Evaluation Board Schematic
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Paths to ground should be made as short as possible.
The ground pad of the SE2622L-R has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device. Therefore, design the connection to the ground pad to
dissipate the maximum wattage produced by the circuit board.
Multiple vias to the grounding layer are required. For further
information, refer to the Skyworks Application Note,
PCB Design
Guidelines for High Power Dissipation Packages,
document
number 201211.
Bypass capacitors should be used on the DC supply lines. An RF
inductor is required on the VCC supply line to block RF signals
from the DC supply. Refer to the schematic drawing below for
further details.
The RF lines should be well separated from each other with
solid ground between traces to maximize input-to-output
isolation.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202733C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 29, 2014
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