电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1X1003R00FLF

产品描述MELF Resistors
产品类别无源元件   
文件大小454KB,共4页
制造商TT Electronics
下载文档 详细参数 全文预览

CHP1X1003R00FLF概述

MELF Resistors

CHP1X1003R00FLF规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
MELF Resistors
系列
Packaging
Reel
安装风格
Mounting Style
PCB Mount

文档预览

下载PDF文档
Resistors
Cylindrical High Power
Surface Mount Metal Glaze™
CHP
CHP Series
Surface Mount Metal Glaze
TM
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
Up to 2 watts
RoHS-compliant version available
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
AEC-Q200
150°C maximum operating temperature
Cylindrical High Power
Metal Glaze™
thick film element
fired at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
High
nickel barrier
temperature
dielectric
coating
nickel barrier
Solder over
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code
1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Maximum
m Change
Maximu
Change
As specified
Test Method
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.3
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
Test Method
Thermal Shock
Low Temperature Operation
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.5
(-65°C)
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Moisture Resistance
Exposure
Resistance to Bonding
High Temperature Exposure
±0.5% + 0.01 ohm
±1% for R>100K ohm
±1% for R>100KΩ
±0.5% +.01 Ω
MIL-R-55342H Par 3.12
MIL-PRF-55342H, §4.8.7
2.5 x
P x R
for 5 seconds
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
±1% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
Temperature Coefficient
Solderability
Life Test
Moisture Resistance
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.11
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
exert pull on chip contacts for 5 seconds
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
Solderability
Life Test
±1% +.01 Ω
IRC – defined
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
Chip mounted in center of 90mm long board, deflected 1mm so as to
(no mechanical damage)
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
95%
0.01 ohm
±1% +
minimum coverage
no mechanical damage
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC reserves the right to make changes in product specification
(no mechanical damage)
without notice or liability.
General Note
Terminal Adhesion
Strength (flex)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
IRC-defined
Device mounted in center of 90mm long board, deflected 1 mm to exert
pull on contacts for 5 seconds
General Note
• Facsimile: 361 992 3377 • Website: www.irctt.com
Telephone: 361 992 7900
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
CHP
BI Technologies
Series Issue March
Welwyn
3
IRC
2011 Sheet 1 of
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
© TT Electronics plc
06.18
【MSP430 编译器使用经验】IAR的调试功能
我们可以自己建立自己的工程了,但这一步只是开发中的第一小步。今天就来说说开发中举足轻重的另外一件事:调试。 其实调试本身也并不难,楼主总结,调试关键在于两件事,一是运行,二是观察 ......
sjtitr 微控制器 MCU
自己做QMC5883L地磁模块
大家好,我现在在做一块地磁模块,原理图是按照数据手册和现成模块来的,焊接好之后,配置寄存器读写成功,但是读取三轴地磁数值时,读取不到,读取基本为0,请问这是因为什么?是焊接的原因? ......
yyh666 PCB设计
如何改变wince文件对话框的大小?
wince的filedialog默认全屏显示,而文件列表却很小,请问如何改变?...
chenls 嵌入式系统
【沁恒RISC-V内核 CH582】3- IO外部中断的使用
CH582的中断也有一个中断控制器,缩写是PFIC。应该和ARM里的NVIC有点相似,管理中断的优先级和使能。 本次只用最基本的外部中断功能。使用按键触发中断,控制LED等的翻转。 包括2个部分 ......
manhuami2007 国产芯片交流
说说如何选择最合适你的ARM开发板
第一,要注意硬件资源(包括:CPU、ROM、RAM、各种接口)其中NanD Flash、Nor Flash和SDRAM的大小一定要满足自已开发的要求。 第二,软件资源对一个初学者来说一定注意的,因为不同的 ......
huangmeifang 嵌入式系统
【SINA31评测】No.1.果照哪里有?速度戳进来。
最近在玩Ubuntu和Linux 手上也有一套平台 正好论坛有A31平台的评测的活动 正好撸来简单比较一下 如果触及厂家的敏感处,请管管帮忙直接修改 在@okhxyyo 的帮助下,昨天拿到这套SINLINX芯 ......
ljj3166 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2403  530  2236  325  197  6  28  43  22  27 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved