*** Resistance value measured with ≤10 % rated current at 25 °C ambient.
**** Melting I
2
t calculated at 0.001 second pre-arcing time.
Reliability Testing
H
No.
1
2
3
4
5
6
7
8
Bending
Solderability
Thermal shock
Moisture resistance
Salt spray
Mechanical vibration
Mechanical shock
Life
Test
Agency Recognition
n
Surface mount packaging for automated assembly
SF-0603FPxxxF Series - Fast Acting Precision Surface Mount Fuses
Fusing Time
Resistance
(Ω) Typ.***
2.20
1.30
1.10
0.48
0.185
0.112
0.069
0.048
0.037
0.031
0.026
0.021
0.0176
0.0148
0.0125
0.0095
Rated
Voltage
Interrupting
Rating
DC 65 V
DC 35 V 50 A
AC 65 V 13 A
DC 35 V 35 A
AC 65 V 13 A
DC 35 V
DC 35 V 35 A
AC 24 V 50 A
Typical
I t (A
2
s) ****
0.0006
0.0014
0.0016
0.0040
0.0120
0.0210
0.0420
0.0520
0.0710
0.10
0.14
0.24
0.33
0.49
0.63
1.10
2
Requirement
≤1 A: DCR change ≤ ±10 %
>1 A: DCR change ≤ ±20 %
Minimum 95 % coverage
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No excessive corrosion
DCR change ≤ ±10 %
No excessive corrosion
Test Condition
2 mm
One dip at 255 °C for 5 seconds
100 cycles between -55 °C and +125 °C
10 cycles
48 hour exposure, 5 % salt solution
0.4 inch D.A. or 30 G between
5-3000 Hz
1500 G, 0.5 ms, half-sine shocks
75 % rated current for 2000 hours at
ambient temperature between
+20 °C and +30 °C
Test Reference
Refer to STP
document
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
Refer to STP
document
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
No electrical “opens” during testing
Voltage drop change shall be less
than ±10 % of initial value
UL File Number .................................................... E198545
http://www.ul.com/ Follow link to Online Certificates Directory,
then enter UL File No. E198545, or
click here
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU
June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm
or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applica-
tions and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SinglFuse
™
SF-0603FPxxxF Series Applications
n
Portable memory
n
LCD monitors
n
Disk drives
n
PDAs
n
Digital cameras
n
MP3 players
n
Cell phones
n
Rechargeable battery packs
n
Battery chargers
n
Set-top boxes
n
Industrial controllers
n
Battery Management Systems (BMS)
n
LED lighting
n
Power tools
SF-0603FPxxxF Series - Fast Acting Precision Surface Mount Fuses
Environmental Characteristics
Operating Temperature.................................................................................................................................................................. -55 °C to +90 °C
Storage Conditions
Temperature .............................................................................................................................................................................. +5 °C to +35 °C
Humidity.........................................................................................................................................................................................40 % to 75 %
Shelf Life..........................................................................................................................................................2 years from manufacturing date
ESD Classification (HBM)............................................................................................................................................................................ Class 6
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SinglFuse™
Product Designator
SF - 0603 FP 015 F - 2
Construction
CuNi/Sn
PCB
SMD Footprint
1608 = (EIA 0603) size
RATED CURRENT (A)
= 0.150
= 1.500
= 0.200
= 1.750
= 0.250
= 2.000
= 0.375
= 2.500
= 0.500
= 3.000
= 0.750
= 3.500
= 1.000
= 4.000
= 1.250
= 5.000
Fuse Blow Type
FP = Fast acting precision
Rated Current
015 ~ 500 (150 mA ~ 5.0 A)
Structure Type
F = Thin film
1.6 ± 0.10
(.063 ± .004)
Cu/Sn
EPOXY
Packaging Type
- 2 = Tape & Reel
Packaging Quantity
0.80
(.031)
8,000 pieces per 7-inch reel
0.81 ± 0.10
(.032 ± .004)
Product Dimensions
1.6 ± 0.10
(.063 ± .004)
1.6 ± 0.10
(.063 ± .004)
0.80
(.031)
Recommended Pad Layout
0.80
(.031)
1.00
(.039)
MM
0.36 ± 0.10
DIMENSIONS:
0.36 ± 0.10
(.014 ± .004)
(.014 ± .004)
(INCHES)
0.30
0.81 ± 0.10 ± 0.10
(.012 ± .004)
(.032 ± .004)
1.00
(.039)
2.20
(.087)
1.00
(.039)
0.81 ± 0.10
(.032 ± .004)
0.36 ± 0.10
(.014 ± .004)
0.36 ± 0.10
(.014 ± .004)
0.36 ± 0.10
(.014 ± .004)
0.36 ± 0.10 0.10
0.36 ±
(.014(.014 ± .004)
± .004)
0.30 ± 0.10
(.012 ± .004)
2.20
0.36 ± 0.10
(.087)
(.014 ± .004)
2.20
(.087)
Current Rating
0.30 ± 0.10
(.012 ± .004)
Thermal Derating
Curve
140
0.36 ± 0.10
(.014 ± .004)
0.36 ± 0.10
120
(.014 ± .004)
0.36 ± 0.10
(.014 ± .004)
0.36 ± 0.10
(.014 ± .004)
DERATING (%)
100
80
60
40
20
0
-60
-40
-20
0
20
40
60
80
100
MAXIMUM OPERATING TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-0603FPxxxF Series - Fast Acting Precision Surface Mount Fuses
Solder Reflow Recommendations
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Ramp Up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Pb-Free Assembly
150 °C
200 °C
60~120 seconds
3 °C / second max.
217 °C
60~150 seconds
260 °C
Tp
TP
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
TL
Tsmax
tp
tL
tp
Tc -5 °C
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
ts
MAX. RAMP
PREHEAT AREA
UP RATE = 3 °C/s
TC -5 °C
TEMPERATURE (°C)
TL
Tsmax
T
smin
tL
TEMPERATURE (°C)
Tsmin
25
Ts
TIME 25 °C TO PEAK
Time (t
p
)* within 5 °C of the
specified classification temperature 30 seconds*
(T
c
)
Ramp Down Rate (T
p
to T
L
)
Time 25 °C to Peak Temperature
25
TIME
TIME 25 °C TO PEAK
6 °C / second max.
8 minutes max.
TIME
Recommended Temperature Profile for Wave Soldering
260
10 sec. max.
10 sec. max.
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
TEMPERATURE (°C)
260
150
PREHEATING
Wave soldering is suitable for 0603 size models.
TEMPERATURE (°C)
150
PREHEATING
120 seconds
TIME
120 seconds
TIME
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-0603FPxxxF Series - Fast Acting Precision Surface Mount Fuses
3312 - 2 mm SMD Trimming Potentiometer
Average Pre-Arcing Time vs. Current Curves
1.25
1.25 A
A
1.00
1.00 A
A
0.75
0.75 A
A
0.50
0.50 A
A
0.375
0.375 A
A
0.25
0.25 A
A
0.20
0.20 A
A
0.15
0.15 A
A
1.50
1.50 A
A
1.75
1.75 A
A
2.00
2.00 A
A
2.50
2.50 A
A
3.00
3.00 A
A
3.50
3.50 A
A
4.00
4.00 A
A
5.00
5.00 A
A
Average I
2
t vs. t Curves
1
1
100
100
10
10
0.1
0.1
1
1
5.00 A
5.00 A
4.00 A
4.00 A
3.50 A
3.50 A
3.00 A
3.00 A
2.50 A
2.50 A
2.00 A
2.00 A
1.75 A
1.75 A
1.50 A
1.50 A
1.25 A
1.25 A
1.00 A
1.00 A
0.75 A
0.75 A
0.50 A
0.50 A
0.375
0.375 A
A
0.25 A
0.25 A
0.20 A
0.20 A
0.15 A
0.15 A
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
0.01
0.01
0.001
0.001
0.001
0.001
0.0001
0.0001
0.1
0.1
I
2
t (A
2
s)
I
2
t (A
2
s)
0.1
0.1
0.01
0.01
1
1
10
10
100
100
0.0001
0.0001
0.0001
0.0001
0.001
0.001
0.01
0.01
0.1
0.1
1
1
10
10
CURRENT (A)
CURRENT (A)
TIME (SECONDS)
TIME (SECONDS)
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. A 03/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-0603FPxxxF Series Tape and Reel Packaging Specifications
SF-0603FPxxxF Series
per EIA 481-2
8.10 ± 0.20
(.319 ± .008)
4.0 ± 0.10
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
2.0 ± 0.05
(.079 ± .002)
1.00 ± 0.10
(.039 ± .004)
1.80 ± 0.10
(.071 ± .004)
3.50 ± 0.05
(.138 ± .002)
1.75 ± 0.10
(.069 ± .004)
1.55 + 0.05
(.061 + .002)
0.60 ± 0.08
(.024 ± .003)
Tape Dimensions
W
P0
P1
P2
A0
B0
F
E1
D0
T
PACKAGING: Paper tape, 8,000 pcs. per reel
13.40 ± 0.50
(.539 ± .020)
0.8
0.6
0.4
0.2
2.20 ± 0.30
(.087 ± .012)
178.00 ± 1.00
(7.008 ± .039)
DIA.
60.20 ± 0.50
(2.370 ± .020)
DIA.
13.20 +0.3/-0.2
(.520 +.012/-.008)
DIA.
T
COVER
TAPE
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
