General Description ....................................................................................................................................................1
Features .......................................................................................................................................................................1
Figure 6. Operate Point, Release Point vs Ambient Temperature ......................................................................5
Figure 7. Operate Point, Release Point vs Supply Voltage .................................................................................5
Figure 8. Period vs Ambient Temperature ............................................................................................................5
Figure 9. Period vs Supply Voltage .......................................................................................................................5
Figure 10. Supply Current vs Ambient Temperature ...........................................................................................6
Figure 11. Supply Current vs Supply Voltage.......................................................................................................6
Description of Operations ..........................................................................................................................................7
Intermittent Operation at Power ON .......................................................................................................................10
Slide-by Position Sensing ........................................................................................................................................ 11
Position of the Hall Element (Reference) ............................................................................................................... 11
Footprint Dimensions (Optimize footprint dimensions to the board design and soldering condition) .......... 11
Ordering Information ................................................................................................................................................14
Physical Dimension, Tape and Reel Information ...................................................................................................15
Revision History .......................................................................................................................................................16
(Note 2) Mounted on 24mm x 20mm x 1.6mm glass epoxy board. Reduce 1.00mW per 1°C above 25°C
Caution:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Power Supply Voltage
Symbol
V
DD
Min
1.65
Typ
1.80
Max
3.60
Unit
V
Magnetic, Electrical Characteristics (Unless otherwise specified V
DD
=1.80V Ta=25°C)
Parameter
Symbol
B
opS
Operate Point
B
opN
B
rpS
Release Point
B
rpN
B
hysS
Hysteresis
B
hysN
Period
Output High Voltage
Output Low Voltage
Supply Current
Supply Current During Startup
Time
Supply Current During Standby
Time
T
p
V
OH
V
OL
I
DD(AVG)
I
DD(EN)
I
DD(DIS)
-
-
V
DD
-0.2
-
-
-
-
0.9
50
-
-
5
2.8
1.8
-
100
-
0.2
8
-
-
ms
V
V
µA
mA
µA
B
rpN
<B<B
rpS
I
OUT
=-0.5mA
(Note 3)
B<B
opN
, B
opS
<B
I
OUT
=+0.5mA
Average
During startup time value
During standby time value
(Note 3)
Min
-
-11.6
6.5
-
-
Typ
9.5
-9.5
8.6
-8.6
0.9
Max
11.6
Unit
Conditions
Output: OUT1
(React to the south pole)
Output: OUT2
(React to the north pole)
Output: OUT1
(React to the south pole)
Output: OUT2
(React to the north pole)
mT
-
-
mT
-6.5
-
mT
(Note 3) B = Magnetic Flux Density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (T
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