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MMC03105013R0FLF

产品描述MELF Resistors
产品类别无源元件   
文件大小344KB,共3页
制造商TT Electronics
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MMC03105013R0FLF概述

MELF Resistors

MMC03105013R0FLF规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
MELF Resistors
安装风格
Mounting Style
PCB Mount

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Resistors
Metal Glaze™ General Purpose
Surface Mount Power Resistor
Metal Glaze
General Purpose
Not Recommended for New Designs
Surface Mount Power Resistor
MM Series
Up to 2 watts
Up to 1000 volts
MM Series
to 2.2 megohm range
0.1 ohm
Up to 2 watts
150°C maximum operating temperature
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
High
temperature
dielectric
coating
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
60/40 Solder
over nickel barrier
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Electrical Data
Size
Code
Industry
Footprint
IRC
Type
Maximum
Working
Power
Voltage
Rating
1/2
400
Resistance
Range
(ohms)²
0.1 to 0.99
B
1206
MMA0204
1.0 to 1.0M
20 to 348K
0.1 to 0.99
F
2512
MMB0207
1
700
1.0 to 2.21M
20 to 348K
H
3610
MMC0310
2
1000
0.1 to 0.99
1.0 to 2.21M
Tolerance
(+%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
50, 100
100
50, 100
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tight Tolerance
Low Range
Standard
¹Not to exceed
P x R
²Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±0.5% +0.01Ω
±0.25% +0.01Ω
±0.5% +0.01Ω
±1% for R>100KΩ
±0.5% +0.01Ω
±0.25% +0.01Ω
Test Method
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±0.5% +0.01Ω
±0.5% +0.01Ω
±1% +0.01Ω
no mechanical damage
±0.5% +0.01Ω
no mechanical damage
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip for
60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
General Note
IRC reserves the right to make changes in product specification without notice or liability.
TT Electronics reserves the
own data and is
changes in product specification without notice or liability.
All information is subject to IRC’s
right to make
considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
MM Series Issue March 2009 Sheet 1 of 3
A subsidiary of
TT electronics plc
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus
Christi Texas
78411 USA
Telephone:
361 992 7900 •
Facsimile:
361 992 3377 •
Website: www.irctt.com
© TT Electronics plc
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