4
MUR340SB - MUR360SB
Taiwan Semiconductor
3A, 400V-600V High Efficient Recovery Rectifier
FEATURES
●
●
●
●
Glass passivated chip junction
Ideal for automated placement
Ultrafast recovery time for high efficiency
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21 definition
KEY PARAMETERS
PARAMETER
I
F(AV)
V
RRM
I
FSM
T
J MAX
Package
Configuration
VALUE
3
400 - 600
75
175
UNIT
A
V
A
°C
APPLICATIONS
●
●
●
●
Switching mode power supply (SMPS)
Adapters
Monitor
TV
DO-214AA (SMB)
Single Die
MECHANICAL DATA
● Case: DO-214AA (SMB)
● Molding compound meets UL 94V-0 flammability rating
● Packing code with suffix "G" means green compound
(halogen-free)
● Part No. with suffix “H” means AEC-Q101 qualified
● Moisture sensitivity level: level 1, per J-STD-020
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
● Polarity: Indicated by cathode band
● Weight: 0.11 g (approximately)
DO-214AA (SMB)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Marking code on the device
Repetitive peak reverse voltage
Reverse voltage, total rms value
Maximum DC blocking voltage
Forward current
Surge peak forward current, 8.3 ms single half sine-wave
superimposed on rated load per diode
Junction temperature
Storage temperature
SYMBOL
V
RRM
V
R(RMS)
V
DC
I
F(AV)
I
FSM
T
J
T
STG
MUR340SB
MUR340SB
400
280
400
3
75
- 55 to +175
- 55 to +175
MUR360SB
MUR360SB
600
420
600
V
V
V
A
A
°C
°C
UNIT
1
Version:B1704
4
MUR340SB - MUR360SB
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
Junction-to-lead thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
SYMBOL
R
ӨJL
R
ӨJA
R
ӨJC
LIMIT
42
76
45
UNIT
°C/W
°C/W
°C/W
Thermal Performance Note:
Units mounted on recommended PCB (10mm x 10mm Cu pad test board)
ELECTRICAL SPECIFICATIONS
(T
A
= 25°C unless otherwise noted)
PARAMETER
CONDITIONS
I
F
= 1.5A, T
J
= 25°C
Forward voltage per diode
(1)
SYMBOL
TYP
1.01
1.12
MAX
1.10
1.25
1.00
1.05
10
250
-
50
UNIT
V
V
V
V
µA
µA
pF
ns
I
F
= 3.0A, T
J
= 25°C
I
F
= 1.5A, T
J
= 150°C
I
F
= 3.0A, T
J
= 150°C
V
F
0.92
1.05
-
Reverse current @ rated V
R
per diode
Junction capacitance
Reverse recovery time
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
(2)
T
J
= 25°C
T
J
= 150°C
1 MHz, V
R
=4.0V
I
F
=0.5A , I
R
=1.0A
I
RR
=0.25A
I
R
C
J
t
rr
-
40
-
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
R5
MUR3xxSB
(Note 1, 2)
H
R4
M4
Notes:
1. "xx" defines voltage from 400V (MUR340SB) to 600V (MUR360SB)
2. Whole series with green compound (halogen-free)
G
PACKING CODE
SUFFIX
PACKAGE
SMB
SMB
SMB
PACKING
850 / 7" Plastic reel
3,000 / 13" Paper reel
3,000 / 13" Plastic reel
EXAMPLE P/N
EXAMPLE P/N
MUR340SBHR5
PART NO.
MUR340SB
PART NO.
SUFFIX
H
PACKING
CODE
R5
PACKING CODE
SUFFIX
DESCRIPTION
Green compound
AEC-Q101 qualified
G
2
Version:B1704
4
MUR340SB - MUR360SB
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
4
AVERAGE FORWARD CURRENT (A)
1000
Fig.2 Typical Junction Capacitance
CAPACITANCE (pF)
A
Resistive or
inductive load
with heat sink
30
60
90
120
150
3
100
2
10
1
0
f=1.0MHz
Vsig=50mVp-p
1
1
10
REVERSE VOLTAGE (V)
100
LEAD TEMPERATURE (°C)
Fig.3 Typical Reverse Characteristics
INSTANTANEOUS REVERSE CURRENT (μA)
INSTANTANEOUS FORWARD CURRENT (A)
100
100
Fig.4 Typical Forward Characteristics
10
T
J
=150°C
10
1
T
J
=25°C
T
J
=150°C
T
J
=25°C
1
0.1
0.01
0.001
10
20
30
40
50
60
70
80
90 100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Pulse width 300μs
1% duty cycle
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
FORWARD VOLTAGE (V)
3
Version:B1704
4
MUR340SB - MUR360SB
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min
1.95
4.05
3.30
1.95
0.75
5.10
0.05
0.15
Max
2.20
4.60
3.95
2.65
1.60
5.60
0.20
0.31
Unit (inch)
Min
0.077
0.159
0.130
0.077
0.030
0.201
0.002
0.006
Max
0.087
0.181
0.156
0.104
0.063
0.220
0.008
0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
2.3
2.5
4.3
1.8
6.8
Unit (inch)
0.091
0.098
0.169
0.071
0.268
MARKING DIAGRAM
P/N
G
YW
F
= Marking Code
= Green Compound
= Date Code
= Factory Code
4
Version:B1704
4
MUR340SB - MUR360SB
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
5
Version:B1704
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