Switching Voltage Regulators High Voltage Step-Down Controller With 40uA Quiescent Current
参数名称 | 属性值 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ADI(亚德诺半导体) |
包装说明 | HTSSOP, |
针数 | 10 |
制造商包装代码 | 05-08-1664 |
Reach Compliance Code | compliant |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 60 V |
最小输入电压 | 4 V |
标称输入电压 | 12 V |
JESD-30 代码 | S-PDSO-G10 |
JESD-609代码 | e3 |
长度 | 3 mm |
功能数量 | 1 |
端子数量 | 10 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HTSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
表面贴装 | YES |
切换器配置 | SINGLE |
最大切换频率 | 460 kHz |
技术 | CMOS |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
LTC3824MPMSE#PBF | LTC3824IMSE#TR | LTC3824MPMSE#TRPBF | LTC3824IMSE#PBF | |
---|---|---|---|---|
描述 | Switching Voltage Regulators High Voltage Step-Down Controller With 40uA Quiescent Current | Switching Voltage Regulators LTC3824 - High Voltage Step-Down Controller With 40- A Quiescent Current | Switching Voltage Regulators High Voltage Step-Down Controller With 40uA Quiescent Current | Switching Voltage Regulators 60V, 100% Duty Cycle Controller |
是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
包装说明 | HTSSOP, | HTSSOP, | HTSSOP, | LEAD FREE, PLASTIC, MSOP-10 |
Reach Compliance Code | compliant | not_compliant | compliant | compliant |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 60 V | 60 V | 60 V | 60 V |
最小输入电压 | 4 V | 4 V | 4 V | 4 V |
标称输入电压 | 12 V | 12 V | 12 V | 12 V |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
JESD-609代码 | e3 | e0 | e3 | e3 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 10 | 10 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HTSSOP | HTSSOP | HTSSOP | HTSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | 235 | NOT SPECIFIED | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
表面贴装 | YES | YES | YES | YES |
切换器配置 | SINGLE | SINGLE | SINGLE | SINGLE |
最大切换频率 | 460 kHz | 460 kHz | 460 kHz | 460 kHz |
技术 | CMOS | CMOS | CMOS | CMOS |
端子面层 | MATTE TIN | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | MATTE TIN (SN) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | NOT SPECIFIED | 30 |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
Brand Name | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc |
是否无铅 | 含铅 | - | 含铅 | 含铅 |
针数 | 10 | - | 10 | 10 |
制造商包装代码 | 05-08-1664 | - | 05-08-1664 | 05-08-1664 |
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