5.1 mA, SILICON, CURRENT REGULATOR DIODE, DO-7
DCR258 | DCR250 | DCR252 | DCR253 | DCR251 | DCR257 | DCR256 | DCR255 | DCR254 | |
---|---|---|---|---|---|---|---|---|---|
描述 | 5.1 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 5.1 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 6.2 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 6.8 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 5.6 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 10 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 9.1 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 8.2 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 | 7.5 mA, SILICON, CURRENT REGULATOR DIODE, DO-7 |
是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | Microsemi | Microsemi | Microsemi | - | Microsemi | Microsemi | Microsemi | Microsemi |
包装说明 | - | HERMETIC SEALED, GLASS PACAKGE-2 | HERMETIC SEALED, GLASS PACAKGE-2 | HERMETIC SEALED, GLASS PACAKGE-2 | O-LALF-W2 | HERMETIC SEALED, GLASS PACAKGE-2 | O-LALF-W2 | HERMETIC SEALED, GLASS PACAKGE-2 | HERMETIC SEALED, GLASS PACAKGE-2 |
Reach Compliance Code | - | unknow | unknow | unknow | compli | unknow | compli | unknown | unknow |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | - | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED |
外壳连接 | - | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
配置 | - | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
二极管元件材料 | - | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
二极管类型 | - | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE | CURRENT REGULATOR DIODE |
JEDEC-95代码 | - | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 |
JESD-30 代码 | - | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
最大限制电压 | - | 3.67 V | 4.46 V | 4.9 V | 4.03 V | 7.2 V | 6.55 V | 5.9 V | 5.4 V |
元件数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
封装主体材料 | - | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS |
封装形状 | - | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
封装形式 | - | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
最大功率耗散 | - | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称调节电流 (Ireg) | - | 5.1 mA | 6.2 mA | 6.8 mA | 5.6 mA | 10 mA | 9.1 mA | 8.2 mA | 7.5 mA |
表面贴装 | - | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | - | FIELD EFFECT | FIELD EFFECT | FIELD EFFECT | FIELD EFFECT | FIELD EFFECT | FIELD EFFECT | FIELD EFFECT | FIELD EFFECT |
端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | - | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
端子位置 | - | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
零件包装代码 | - | - | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 |
针数 | - | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
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