(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage Temperature Range
Operating Junction Temperature
Voltage Rate of Change (Rated V
R
)
ESD Rating:
Machine Model = C
Human Body Model = 3B
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
0.5
I
FSM
5.5
T
stg
T
J
dv/dt
−65 to +150
−65 to +125
1000
> 400
> 8000
°C
°C
V/ms
V
A
Value
30
Unit
V
A
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance − Junction−to−Ambient (Note 1)
Thermal Resistance − Junction−to−Lead
1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
Symbol
R
qJA
R
qJL
Value
206
150
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
(i
F
= 0.1 Amps, T
J
= 25°C)
(i
F
= 0.5 Amps, T
J
= 25°C)
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, T
C
= 25°C)
(V
R
= 15 V, T
C
= 25°C)
Symbol
v
F
0.375
0.43
I
R
130
20
mA
Value
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2%.
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
4
I R, REVERSE CURRENT (
μ
A)
1
1000
T
J
= 125°C
T
J
= 125°C
0.1
75°C
25°C
- 40°C
100
75°C
10
25°C
0
5
10
15
20
25
30
35
40
1
0.01
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
0.55
v
F
, INSTANTANEOUS VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current
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2
MBR0530, NRVB0530
180
160
C, CAPACITANCE (pF)
140
120
100
80
60
40
20
0
5
10
15
20
25
30
TYPICAL CAPACITANCE AT 0 V = 170 pF
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
1
AVERAGE FORWARD CURRENT (AMP)
0.875
0.75
0.625
0.5
0.375
0.25
0.125
0
60
SQUARE WAVE
=
p
=5
= 10
I
pk
/I
av
= 20
67
74
81
88
95
102
109
116
123 130
DC
LEAD TEMPERATURE (°C)
Figure 4. Current Derating (Lead)
P F(AV), AVERAGE POWER DISSIPATION (WATT)
0.35
0.315
0.28
0.245
0.21
0.175
0.14
0.105
0.07
0.035
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
I
pk
/I
av
= 20
= 10
=5
T
J
= 125°C
=
p
SQUARE WAVE
DC
I
F(AV)
, AVERAGE FORWARD CURRENT (AMP)
Figure 5. Power Dissipation
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3
MBR0530, NRVB0530
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
A
A1
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
c
D
E
H
E
L
q
MILLIMETERS
MIN
NOM
MAX
0.94
1.17
1.35
0.00
0.05
0.10
0.51
0.61
0.71
---
---
0.15
1.40
1.60
1.80
2.54
2.69
2.84
3.56
3.68
3.86
---
---
0.25
---
10
°
0
°
MIN
0.037
0.000
0.020
---
0.055
0.100
0.140
0.010
0
°
INCHES
NOM
0.046
0.002
0.024
---
0.063
0.106
0.145
---
---
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
---
10
°
H
E
2.36
0.093
4.19
0.165
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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