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74HCT368PW概述

Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S

74HCT368PW规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP
包装说明	PLASTIC, TSSOP-16
针数	16
Reach Compliance Code	unknown
其他特性	ONE FUNCTION WITH TWO BITS
控制类型	ENABLE LOW
系列	HCT
JESD-30 代码	R-PDSO-G16
JESD-609代码	e4
长度	5 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.006 A
湿度敏感等级	1
位数	6
功能数量	1
端口数量	2
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	INVERTED
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP16,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	5 V
Prop。Delay @ Nom-Sup	53 ns
传播延迟（tpd）	36 ns
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	4.4 mm

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INTEGRATED CIRCUITS

DATA SHEET

For a complete data sheet, please also download:

•

The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Information

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

74HC/HCT368

Hex buffer/line driver; 3-state;

inverting

Product speciﬁcation

File under Integrated Circuits, IC06

December 1990

74HCT368PW相似产品对比

	74HCT368PW	74HCT368D-T	74HC368D-T	74HCT368N	74HCT368PW-T	74HC368DB	74HCT368DB-T	74HC368DB-T	74HCT368DB
描述	Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers u0026 Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers u0026 Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers u0026 Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S	Buffers & Line Drivers HEX INVERT 4-BIT AND 2-BIT 3-S
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	TSSOP	SOIC	SOIC	DIP	TSSOP	SOIC	SOIC	SOIC	SOIC
包装说明	PLASTIC, TSSOP-16	SOP,	SOP,	DIP, DIP16,.3	PLASTIC, TSSOP-16	PLASTIC, SSOP-16	SSOP,	PLASTIC, SSOP-16	SSOP, SSOP16,.3
针数	16	16	16	16	16	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS
系列	HCT	HCT	HC/UH	HCT	HCT	HC/UH	HCT	HC/UH	HCT
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609代码	e4	e4	e4	e4	e4	e4	e4	e4	e4
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	6	6	6	6	6	6	6	6	6
功能数量	1	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2	2
端子数量	16	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	SOP	SOP	DIP	TSSOP	SSOP	SSOP	SSOP	SSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）	260	260	260	NOT APPLICABLE	260	260	260	260	260
传播延迟（tpd）	36 ns	36 ns	29 ns	36 ns	36 ns	29 ns	36 ns	29 ns	36 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	6 V	5.5 V	5.5 V	6 V	5.5 V	6 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	2 V	4.5 V	4.5 V	2 V	4.5 V	2 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	NO	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	NOT APPLICABLE	30	30	30	30	30
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)
长度	5 mm	-	-	21.6 mm	5 mm	6.2 mm	6.2 mm	6.2 mm	6.2 mm
湿度敏感等级	1	1	1	-	1	1	1	1	1
座面最大高度	1.1 mm	-	-	4.7 mm	1.1 mm	2 mm	2 mm	2 mm	2 mm
端子节距	0.65 mm	-	-	2.54 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
宽度	4.4 mm	-	-	7.62 mm	4.4 mm	5.3 mm	5.3 mm	5.3 mm	5.3 mm
Source Url Status Check Date	-	2013-06-14 00:00:00	2013-06-14 00:00:00	2013-06-14 00:00:00	2013-06-14 00:00:00	-	2013-06-14 00:00:00	2013-06-14 00:00:00	-

74HCT368PW

74HCT368PW在线购买

74HCT368PW概述

74HCT368PW规格参数

文档预览

74HCT368PW相似产品对比

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