Intel
®
RealSense™ Camera SR300
Embedded Coded Light 3D Imaging System
with Full High Definition Color Camera
Product Datasheet
Intel Production Part Numbers: MM#943228, H89061-XXX
†
†
(X) Numeric characters representing configuration or programmed firmware at manufacturing
June 2016
Revision 1.0
Document: 334531-001
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
This document contains information on products, services and/or processes in development. All information provided here is
subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and
roadmaps.
The products and services described may contain defects or errors known as errata which may cause deviations from published
specifications. Current characterized errata are available on request.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-
4725 or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Intel RealSense are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others
Copyright © 2016, Intel Corporation. All rights reserved.
2
334531-001
Contents
1
2
Description and Features ....................................................................................9
Overview ....................................................................................................... 10
2.1
2.2
2.3
3
4
Components ........................................................................................ 10
Storage and Operating Conditions ........................................................... 11
Handling Conditions .............................................................................. 11
Component Specification .................................................................................. 12
Functional Specification ................................................................................... 13
4.1
Embedded 3D Imaging System .............................................................. 13
4.1.1
Depth Video Data Capture Flow ................................................. 14
4.1.2
Infrared Video Data Capture Flow .............................................. 14
Camera Video Stream Formats ............................................................... 15
Camera Video Stream Modes ................................................................. 16
Update ............................................................................................... 17
5.1.1
Update Limits ......................................................................... 17
Recovery............................................................................................. 17
Depth Camera Functions ....................................................................... 18
6.1.1
Projector Power Settings .......................................................... 19
6.1.2
Filter Option Settings ............................................................... 19
6.1.3
Preset Settings ....................................................................... 19
6.1.4
Auto Range (AR) ..................................................................... 20
Color Camera Functions ........................................................................ 21
6.2.1
Standard Functions .................................................................. 21
6.2.2
Extended Functions ................................................................. 21
Control Persistence ............................................................................... 22
Privacy ............................................................................................... 22
USB Composite Device .......................................................................... 24
7.1.1
Device Endpoints..................................................................... 24
7.1.2
System Endpoints ................................................................... 24
7.1.3
Typical Power Consumption ...................................................... 25
Infrared Projector Interference ............................................................... 25
Placement ........................................................................................... 26
Grounding ........................................................................................... 27
8.2.1
Motherboard Receptacle ........................................................... 27
Attachment and Alignment .................................................................... 28
System Through-Holes .......................................................................... 28
8.4.1
Cover Material Transmission ..................................................... 29
Thermals............................................................................................. 29
4.2
4.3
5
5.1
5.2
6
6.1
Firmware Update ............................................................................................ 17
Client Software ............................................................................................... 18
6.2
6.3
6.4
7
7.1
System Interoperability ................................................................................... 24
7.2
8
8.1
8.2
8.3
8.4
8.5
System Integration ......................................................................................... 26
334531-001
3
8.6
8.7
8.8
9
9.1
9.2
9.3
9.4
10
10.1
8.5.1
Thermal Interface Material (TIM) ............................................... 30
8.5.2
Passive Heat Spreader ............................................................. 30
Electrical ............................................................................................. 31
8.6.1
Receptacle ............................................................................. 32
8.6.2
High Speed Cable Assembly ...................................................... 32
8.6.3
System Receptacle .................................................................. 34
Power Sequence Timings ....................................................................... 34
Acoustics ............................................................................................ 36
UPC (USB Port Capabilities) ................................................................... 37
PLD (Physical Device Location) ............................................................... 37
Recovery Device Interface ..................................................................... 38
9.3.1
DSM (Device Specific Method) ................................................... 38
Power Resource ................................................................................... 39
System Assembly ................................................................................. 40
10.1.1 Attaching Cable Assembly......................................................... 41
10.1.2 Pressure Force Allowed Areas .................................................... 41
Removal and Replace ............................................................................ 42
Cleaning ............................................................................................. 42
System BIOS.................................................................................................. 37
System Assembly and Rework .......................................................................... 40
10.2
10.3
11
12
13
14
15
16
Labeling ........................................................................................................ 43
Mechanical Drawing......................................................................................... 44
Regulatory Compliance .................................................................................... 47
SR300 Cable Drawings..................................................................................... 49
SR300 USB Adapter ........................................................................................ 50
15.1
Design Reference ................................................................................. 51
Schematic Checklist ........................................................................................ 53
4
334531-001
List of Figures
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
2-1: Component Locations (Front View) .................................................... 10
2-2: Component Locations (Rear View) ..................................................... 10
2-3: Electrostatic Discharge Caution ......................................................... 11
4-1: Embedded 3D Imaging System ......................................................... 13
4-2: Depth Video Data Flow .................................................................... 14
4-3: IR Video Data Flow ......................................................................... 14
6-1: Privacy Image Output ..................................................................... 23
7-1: Interference................................................................................... 25
8-1: Front Facing Camera Placement ........................................................ 26
8-2: No Ground or Electrical Contact ........................................................ 27
8-3: Receptacle Ground Bar Motherboard Connections ................................ 27
8-4: Attachment Area and Alignment Pins ................................................. 28
8-5: Through-Hole Design Considerations ................................................. 28
8-6: Thermocouple Test Locations ........................................................... 30
8-7: Passive Heat Spreader..................................................................... 31
9-1: PLD System Design Considerations ................................................... 38
10-1: Plastic Protective Liner ................................................................... 40
10-2: Attaching Cable Assembly .............................................................. 41
10-3: Cable Plug Orientation ................................................................... 41
10-4: Pressure Force Allowed Areas ......................................................... 42
11-1: Product Labeling ........................................................................... 43
14-1: Cable Mechanical Drawing .............................................................. 49
15-1: SR300 Adapter 3D ........................................................................ 50
15-2: SR300 Adapter 2D ........................................................................ 51
15-3: SR300 USB Adapter Schematics ...................................................... 51
334531-001
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
