SMT POWER INDUCTORS
Shielded Drum Core - PF0464NL/PF0465NL Series
Height:
PF0464: 3mm Max - PF0465: 4mm Max
Footprint:
7.2mm x 7.2mm Max
Current Rating:
PF0464: up to 4.5A - PF0465: up to 3.5A
Inductance Range:
1.5µH to 100µH
Electrical Specifications @ 25°C — Operating Temperature -40°C to +125°C
1, 6
Part
2,3
Number
Inductance
@0A
D C
(μH ±20%)
Inductance
@Irated
(
μH
TYP)
1.2
2.4
3.1
4.0
4.8
5.8
6.9
8.0
9.6
12.0
14.4
17.6
21.6
26.4
31.2
37.6
44.8
54.4
65.6
80.0
2.6
4.0
5.0
5.8
6.9
8.0
9.6
12.0
14.4
17.6
21.6
26.4
31.2
37.6
44.8
54.4
65.6
80.0
Irated
5
(A)
4.50
3.00
2.60
2.40
2.25
2.10
1.85
1.70
1.55
1.40
1.32
1.20
1.05
0.97
0.86
0.80
0.73
0.65
0.60
0.54
3.50
2.90
2.50
2.30
2.20
2.00
1.70
1.60
1.50
1.30
1.20
1.10
1.00
0.95
0.85
0.75
0.70
0.65
DCR
(m
Ω)
TYP
9
17
19
24
26
36
38
41
52
55
69
85
104
132
142
197
216
235
291
401
16
19
21
25
27
29
39
44
62
68
75
94
101
112
154
188
261
286
MAX
12
22
25
30
33
45
48
52
66
75
90
113
132
165
180
238
270
300
370
505
20
24
26
31
34
37
50
55
78
86
95
118
128
140
195
234
324
350
Saturation
6
Current I
S A T
-20% (A)
Heating
7
Current I
D C
+40°C(A)
Core Loss
8
Factor
(K2)
660
850
990
1100
1300
1400
1500
1700
1800
2000
2200
2500
2800
3000
3300
3600
3900
4400
4800
5300
790
970
1100
1200
1300
1400
1600
1700
1900
2100
2300
2500
2800
3000
3300
3700
4000
4500
SFR
(MHz)
>40
>40
>40
>40
>40
>40
35
32
26
24
22
21
19
18
14
14
13
12
11
10.5
>40
>40
>40
>40
35
32
26
24
22
21
19
18
17
14
13
12
11
10.5
PF0464NL S
ERIES
PF0464.152NL
1.5
PF0464.302NL
3.0
PF0464.392NL
3.9
PF0464.502NL
5.0
PF0464.602NL
6.0
PF0464.732NL
7.3
PF0464.862NL
8.6
PF0464.103NL
10
PF0464.123NL
12
PF0464.153NL
15
PF0464.183NL
18
PF0464.223NL
22
PF0464.273NL
27
PF0464.333NL
33
PF0464.393NL
39
PF0464.473NL
47
PF0464.563NL
56
PF0464.683NL
68
PF0464.823NL
82
PF0464.104NL
100
PF0465NL S
ERIES
PF0465.332NL
3.3
PF0465.502NL
5.0
PF0465.622NL
6.2
PF0465.732NL
7.3
PF0465.862NL
8.6
PF0465.103NL
10
PF0465.123NL
12
PF0465.153NL
15
PF0465.183NL
18
PF0465.223NL
22
PF0465.273NL
27
PF0465.333NL
33
PF0465.393NL
39
PF0465.473NL
47
PF0465.563NL
56
PF0465.683NL
68
PF0465.823NL
82
PF0465.104NL
100
4.50
3.00
2.60
2.40
2.25
2.10
1.85
1.70
1.55
1.40
1.32
1.20
1.05
0.97
0.86
0.80
0.73
0.65
0.60
0.54
3.50
2.90
2.50
2.30
2.20
2.00
1.70
1.60
1.50
1.30
1.20
1.10
1.00
0.95
0.85
0.75
0.70
0.65
5.50
4.25
3.80
3.55
3.20
3.10
2.95
2.90
2.40
2.35
2.10
1.85
1.70
1.50
1.45
1.25
1.15
1.10
1.00
0.85
4.65
4.10
3.90
3.50
3.30
3.20
2.80
2.60
2.25
2.10
2.00
1.75
1.70
1.60
1.35
1.25
1.05
1.00
NOTES FROM TABLE:
(See page 43)
Mechanical
.284
7,20
MAX
MAX
Schematic
.104
2,65
REF
A
SUGGESTED
PAD LAYOUT
.472
12,00
1
2
Date Code
PF046x
.XXX
.284
7,20
MAX
.287
7,30
REF
.301
7,65
.630
± .012
16,00
± 0,30
.079 REF
2,00
PF0464
PF0465
Weight............................0.5
grams .........0.7 grams
Tape & Reel
....................1200/reel ............900/reel
“A” (height - in./mm)
....0.118/3,00 ........0.158/4,00
B
Tape & Reel
Layout
.293
7,45
USER DIRECTION
OF FEED
PF0464
PF0465
“B” height - (in./mm).
. . . 0.150/3,80 . . . . 0.205/5,20
Dimensions:
Inches
mm
Unless otherwise specified,
all tolerances are ± .004
0,10
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai
86 21 54643211 / 2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
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33
SPM2007 (11/07)
SMT POWER INDUCTORS
Shielded Drum Core Series
Notes from Tables
(pages 27 - 42)
1. Unless otherwise specified, all testing is made at
100kHz, 0.1VAC.
2. Optional Tape & Reel packaging can be ordered by
adding a "T" suffix to the part number (i.e. P1166.102NL
becomes P1166.102NLT). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. The "NL" suffix indicates an RoHS-compliant part
number. Non-NL suffixed parts are not necessarily
RoHS compliant, but are electrically and mechanically
equivalent to NL versions. If a part number does not
have the "NL" suffix, but an RoHS compliant version is
required, please contact Pulse for availability.
4. Temperature of the component (ambient plus
temperature rise) must be within specified operating
temperature range.
5. The rated current (Irated) as listed is either the satura-
tion current or the heating current depending on which
value is lower.
6. The saturation current, Isat, is the current at which
the component inductance drops by the indicated
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
7. The heating current, Idc, is the DC current required
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
Part No.
PG0085/86
PG0087
PG0040/41
P1174
PF0601
PF0464
PF0465
P1166
P1167
PF0560NL
P1168/69
P1170/71
P1172/73
PF0552NL
PF0553NL
Trise Factor
(K0 )
2.3
5.8
0.8
0.8
4.6
3.6
3.6
1.9
2.1
5.5
4.8
4.3
5.6
8.3
7.1
Core Loss Factor
(K1)
5.29E-10
15.2E-10
2.80E-10
6.47E-10
14.0E-10
24.7E-10
33.4E-10
29.6E-10
42.2E-10
136E-10
184E-10
201E-10
411E-10
201E-10
411E-10
8. In high volt*time (Et) or ripple current applications, addi-
tional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
Estimated Temperature Rise:
Trise
= [Total loss (mW) / K0]
.833
(
o
C )
Total loss
= Copper loss + Core loss (mW)
Copper loss
= I
RMS
2
x DCR (Typical) (mW)
Irms
= [I
DC
2
+
ΔI
2
/12]
1/2
(A)
Core loss
= K1 x f (kHz)
1.23
x Bac(Ga)
2.38
(mW)
Bac (peak to peak flux density)
= K2 x
ΔI
(Ga)
[= K2/L(µH) x Et(V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
K2 is a core size and winding dependant value and
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
Core Loss / K1 (mW)
3.00E+10
2.50E+10
2.00E+10
1.50E+10
1.00E+10
0.50E+10
0
0
CoreLoss/K1 Vs Flux Density
100KHz
200KHz
300KHz
400KHz
500KHz
700KHz
1.0MHz
500
1000
where
DB
= K2 x
DI
[= K2/L(µH) x Et(V-µSec)]
DB
(Gauss)
1500
2000
2500
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai
86 21 54643211 / 2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
www.pulseeng.com
43
SPM2007 (11/07)
嵌入式系统
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