电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1206H683K5GAC

产品描述Multilayer Ceramic Capacitors MLCC - SMD/SMT
产品类别无源元件   
文件大小2MB,共23页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1206H683K5GAC在线购买

供应商 器件名称 价格 最低购买 库存  
C1206H683K5GAC - - 点击查看 点击购买

C1206H683K5GAC概述

Multilayer Ceramic Capacitors MLCC - SMD/SMT

C1206H683K5GAC规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
KEMET(基美)
产品种类
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
终端
Termination
Standard
电容
Capacitance
0.068 uF
电压额定值 DC
Voltage Rating DC
50 VDC
电介质
Dielectric
C0G (NP0)
容差
Tolerance
10 %
外壳代码 - in
Case Code - in
1206
外壳代码 - mm
Case Code - mm
3216
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 200 C
产品
Product
General Type MLCCs
长度
Length
3.2 mm
封装 / 箱体
Package / Case
1206 (3216 metric)
端接类型
Termination Style
SMD/SMT
宽度
Width
1.6 mm
电容-nF
Capacitance - nF
68 nF
电容-pF
Capacitance - pF
68000 pF

Class
Class 1
单位重量
Unit Weight
0.000571 oz

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 200°C, C0G Dielectric, 10 – 200 VDC
(Industrial Grade)
Overview
KEMET’s High Temperature surface mount C0G Multilayer
Ceramic Capacitors (MLCCs) are constructed of a robust
and proprietary C0G/NP0 base metal electrode (BME)
dielectric system that offers industry-leading performance
at extreme temperatures up to 200°C. These devices are
specifically designed to withstand the demands of harsh
industrial environments such as down-hole oil exploration
and automotive/avionics engine compartment circuitry.
KEMET’s High Temperature C0G capacitors are temperature
compensating and are well suited for resonant circuit
applications or those where Q and stability of capacitance
characteristics are required. They exhibit no change in
capacitance with respect to time and voltage and boast a
negligible change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±30ppm/ºC
from −55°C to +200°C. In addition, these capacitors exhibit
high insulation resistance with low dissipation factor at
elevated temperatures up to 200°C. They also exhibit low ESR
at high frequencies and offer greater volumetric efficiency
over competitive high temperature precious metal electrode
(PME) and BME ceramic capacitor devices.
These devices are Lead (Pb)-Free, RoHS and REACH
compliant without the need of any exemptions.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1210
H
124
Capacitance
Code (pF)
Two significant digits +
number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – 0.99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
J
Capacitance
Tolerance
1
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
5
Voltage
8 = 10 V
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
G
Dielectric
A
Failure Rate/
Design
A = N/A
C
Termination Finish
2
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin
minimum
TU
Packaging/
Grade (C-Spec)
See
“Packaging
C-Spec
Ordering
Options
Table”
below
Case Size
Specification/
(L" x W")
Series
0402
0603
0805
1206
1210
1812
2220
H = High
Temperature
(200°C)
G = C0G
1
2
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001_C0G_200C_SMD • 7/29/2016
1
如何用USART发送10位ADC结果
AVR单片机,USART最多传送9位的数据,而ADC是10位的,要把AD转换结果用USART发送到PC机,该怎么做?...
像见 嵌入式系统
求推荐能用在水下的传感器
有一道工序要在小水池中进行,那么工件到位的检测就成了问题,而只有在确定夹具中有工件后才能进行下一个动作,各位大侠有耐水的传感器推荐么,这方面真的是小白啊 !http://cache.soso.com/img ......
liberty 传感器
RFIC 设计挑战及设计流程分析
近年来,移动通信的市场需求增长迅速,当前的移动通信系统已经可以使用成熟的信号处理技术来获取更 高的信息传输速率。下一代无线系统的设计难度将增大,主要体现在对多标准和可重配置性的支持 ......
xtss 无线连接
这两个三极管电路图的区别
下面这两个电路图的区别是什么?为什么一个有声音,另一个没声音?怎么分析? ...
elecfans2018 模拟电子
用SD储存卡读写单片机
我现在想用DS卡读写单片机,但是我不知道怎么开始,不知道卡座什么要不要的,需要哪些硬件啊...
ylf175300 51单片机
普通ARM板子,为啥烧了内核后还要烧文件系统?
个人还没有超过PC那种linux系统的思考范围,不明白为啥烧了内核以后还要烧文件系统。文件系统不是由内核自己建立的?...
sleepdragon1986 ARM技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 885  1846  2239  793  1360  32  24  34  2  10 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved