Although Belden makes every reasonable effort to ensure their accuracy at the time of this publication, information and specifications described here in are subject to error or omission and to change without
notice, and the listing of such information and specifications does not ensure product availability.
Belden provides the information and specifications herein on an "ASIS" basis, with no representations or warranties, whether express, statutory or implied. In no event will Belden be liable for any damages
(including consequential, indirect, incidental, special, punitive, or exemplary damages) whatsoever, even if Belden has been advised of the possibility of such damages, whether in an action under contract,
negligence or any other theory, arising out of or in connection with the use, or inability to use, the information or specifications described herein.
All sales of Belden products are subject to Belden's standard terms and conditions of sale.
Belden believes this product to be in compliance with all applicable environmental programs as listed in the data sheet. The information provided is correct to the best of Belden's knowledge, information and belief
at the date of its publication. This information is designed only as a general guide for the safe handling, storage, and any other operation of the product itself or the one that it becomes a part of. The Product
Disclosure is not to be considered a warranty or quality specification. Regulatory information is for guidance purposes only. Product users are responsible for determining the applicability of legislation and
regulations based on their individual usage of the product.
许多MEMS器件，像加速度计、机械共振器件等，都需要在真空环境下才能实现设计功能。然而检验封装腔体是否达到了所要求的真空程度一直一来都是个棘手的问题。密歇根大学Khalil Najafi教授研究小组的研究人员最近开发出一种用微机械制造方法实现，可以在封装的封帽上完成皮拉尼真空测量的方案。使用这种方法可以完成封装的氦气检漏测试，该成果已发表在IEEE Transactions on Advan...[详细]
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
