4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16
4通道 POWER 供应 管理 电路, PDSO16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | 0.150 INCH, SO-16 |
| Reach Compliance Code | unknow |
| Is Samacsys | N |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 1/5.5 V |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| DS1831ES | DS1831CS | DS1831D | DS1831DS | DS1831C | DS1831E | |
|---|---|---|---|---|---|---|
| 描述 | 4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 | 4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 | 4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 | 4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 | 4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 | 4-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 |
| 包装说明 | 0.150 INCH, SO-16 | 0.150 INCH, SO-16 | 0.300 INCH, DIP-16 | 0.150 INCH, SO-16 | 0.300 INCH, DIP-16 | 0.300 INCH, DIP-16 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
| 可调阈值 | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 |
| 信道数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 表面贴装 | YES | YES | NO | YES | NO | NO |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 |
| 封装代码 | SOP | SOP | - | - | DIP | DIP |
| 封装等效代码 | SOP16,.25 | SOP16,.25 | - | - | DIP16,.3 | DIP16,.3 |
| 电源 | 1/5.5 V | 1/5.5 V | - | - | 1/5.5 V | 1/5.5 V |
| 最大供电电流 (Isup) | 0.1 mA | 0.1 mA | - | - | 0.1 mA | 0.1 mA |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 1.27 mm | 1.27 mm | - | - | 2.54 mm | 2.54 mm |
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