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5962-9471601H9X

产品描述Flash Module, 128KX32, 150ns, CQFP68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
产品类别存储   
文件大小388KB,共16页
制造商Microsemi
官网地址https://www.microsemi.com
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5962-9471601H9X概述

Flash Module, 128KX32, 150ns, CQFP68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

5962-9471601H9X规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Microsemi
零件包装代码QFP
包装说明QFP,
针数68
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最长访问时间150 ns
其他特性ALSO CONFIGURABLE AS 512K X 8
备用内存宽度16
JESD-30 代码S-CQFP-G68
JESD-609代码e4
长度22.36 mm
内存密度4194304 bit
内存集成电路类型FLASH MODULE
内存宽度32
功能数量1
端子数量68
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织128KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QFP
封装形状SQUARE
封装形式FLATPACK
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
编程电压5 V
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度3.51 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层GOLD
端子形式GULL WING
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度22.36 mm
Base Number Matches1

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White Electronic Designs
FEATURES
n
n
WF128K32-XXX5
128K
X
32 5V FLASH MODULE, SMD 5962-94716
Access Times of 50*, 60, 70, 90, 120, 150ns
Packaging:
• 66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•
68 lead, Hermetic CQFP (G2U), 22.4mm (0.880
inch) square, 3.56mm (0.140 inch) high
(Package 510)
68 lead, Hermetic CQFP (G2L), 22.4mm (0.880
inch) square, 4.06mm (0.160 inch) high (Pack
age 528)
n
100,000 Erase/Program Cycles Typical, 0°C to +70°C
n
n
n
n
n
Organized as 128Kx32
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Pins for Low Noise Operation
Control Time
n
Low Power CMOS, 1mA Standby Typical
•
n
Built-in Decoupling Caps and Multiple Ground
n
Page Program Operation and Internal Program
n
• 68 lead, Hermetic CQFP (G1U)
1
, 23.9mm (0.940
inch) square, 3.56mm (0.140 inch) high
(Package 519)
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940
inch) square, 4.06mm (0.160 inch) high
(Package 524)
n
Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG1UX5
1
- 5 grams typical
WF128K32-XG1TX5 - 5 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note 1: Package Not Recommended For New Design
Note: For programming information refer to Flash Programming 1M5
Application Note.
* The access time of 50ns is available in Industrial and Commercial
temperature ranges only.
FIG. 1
PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
V
CC
CS
4
WE
4
I/O
27
A
4
A
5
A
6
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
PIN DESCRIPTION
I/O
0-31
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
May 2003 Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

 
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