PTCTZ
www.vishay.com
Vishay BCcomponents
SMD PTC Thermistors For Overload Protection
FEATURES
•
•
•
•
•
•
Compact resettable overload protection
Low mounting height
Suitable for reflow soldering
Small ceramic diameter for faster response
Low heat transfer to substrate
Flat terminations for stable positioning and good
solderability
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
QUICK REFERENCE DATA
VALUE
PARAMETER
Resistance value at 25 °C
Tolerance on
R
25
value
Maximum overload current
I
ol
(V
max.
dependent)
Maximum holding current
(I
nt
)
Maximum voltage
(RMS or DC)
Maximum trip time at 1 A
Switching temperature
(T
sw
)
Operating temperature
range at max. voltage
Storage temperature
Maximum continuous
power at 25 °C
STANDARD
TYPES
(1)
2 to 500
TELECOM
TYPES
(1)
10 to 70
UNIT
Ω
%
A
APPLICATIONS
Over-temperature/over-load protection:
• Telecom
-Central Office Switching (C.O.)
-Subscriber Terminal Equipment (T.E.)
-Set-top Box
-Modems
• General industry and automotive
-Low power overload protection
-Inrush current limitation
± 10; ± 15; ± 20
2 to 10
50 to 500
(at 25 °C)
16 to 400
50 to 100
(at 70 °C)
220 to 600
V
RMS
s
0.8 to 6
105 to 140
-40 to 85
-40 to 155
2
DESCRIPTION
The component consists of a high performance PTC
ceramic mounted in a lead frame with lead (Pb)-free tin
plated contacts. The terminations are joined to the Ag plated
ceramic by a high melting solder. The ceramic is covered
with a protective high temperature silicone layer.
°C
W
MARKING
• All SMD PTCs are marked with a 3-digit type number
(XXX) and a date code (YYWW)
Note
(1)
Customized products are available on request in the indicated
nominal
R
25
range. Larger 8 mm ceramics for lower resistance
values or higher voltages are in use in the PTCCZ08 series.
ELECTRICAL DATA AND ORDERING INFORMATION
RESISTANCE
R
25
(Ω)
TOL.
(%)
MATCHING V
max.
(Ω)
(V)
MAX.
MAX.
70
25 TRIP-TIME I
ol
at T
25
V
max. sw
°C
°C
°C
at 1 A (s)
(A)
(mA) (mA) (mA)
100
100
50
70
100
100
70
70
60
-
100
270
270
130
220
250
250
250
175
150
650
300
3.0
3.0
0.8
1.3
1.5
1.5
1.4
1.0
0.8
6.0
1.8
2.0
2.0
2.0
2.0
1.5
2.0
1.5
0.7
0.7
8.0
3.0
105
105
105
110
115
115
105
125
125
140
115
I
nt
at
I
t
at
OPERATING
STORAGE
TEMP.
TEMP.
RANGE
RANGE
AT MAX.
VOLTAGE
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-25 to 85
-40 to 70
-40 to 85
-40 to 85
-25 to 125
-25 to 125
-25 to 125
-25 to 125
-25 to 125
-25 to 125
-25 to 125
-40 to 155
-40 to 125
-40 to 155
-40 to 155
CATALOG NUMBER
SAP ORDERING
CODE
PTCTZ3NR100GTT
(2)
PTCTZ3MR100GTT
(2)
PTCTZ3NR400HTT
PTCTZ3MR250HTT
(2)
PTCTZ3NR150KTT
(2)
PTCTZ3MR150KTT
(2)
PTCTZ3MR200KTT
(2)
PTCTZ3MR350MTT
(2)
PTCTZ3MR500MTT
PTCTZ3NR339CTT
PTCTZ3NR949ETT
TYPE NR
MARKING
TELECOM AND INDUSTRIAL TYPES
10
20
-
245 165
10
20
0.5
245 165
40
25
no
265 80
25
20
1
265 120
15 to 20
-
-
300 150
15 to 20
-
0.5
300 150
20
20
0.5
300 120
35
+15 / -20
1
425 110
50
20
1
425 90
GENERAL INDUSTRIAL TYPES
3.3
25
-
24 400
9.4
25
-
60 150
012
016
002
005
004
003
018
009
019
013
011
Note
(2)
These types pass ITU-K20-21-45 telecommunication protection recommendation
Revision: 27-Nov-15
Document Number: 29068
1
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PTCTZ
www.vishay.com
PTC OUTLINES
PTC SMD ceramic size: 6.5 mm
0
7.3
- 0.2
Vishay BCcomponents
DIMENSIONS
in millimeters
2
3
8.0
2
0.2
1
1.2
1
3.45
± 0.15
3.6 ± 0.1
10°
max.
0.6
7.6 ± 0.25
10 ± 0.25
+ 0.6
0
3
2
DIMENSIONS OF SOLDER LANDS
in millimeters
2
2.8
4 ± 0.2
5
4 ± 0.1
11
PACKAGING
TYPE
PTCTZ
QUANTITY
1500
CARRIER TAPE
PS conductive blister tape acc. IEC60286-3
WIDTH
16 mm
PITCH
12 mm
REEL DIAMETER
330 mm
MATERIAL INFORMATION
REF.
1
2
3
DESCRIPTION
Ceramic
Metalization
Lead frame
MATERIAL AND REMARKS
BaTiO
3
doped
NiCr Ag layer (vacuum deposition)
Ni plated phosphor bronze material covered by matte tin layer
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes
which can be used are reflow (infrared and convection heating) and vapor phase. The maximum temperature of 260 °C during
10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
Reflow soldering
Vapor phase soldering
T
(°C)
300
260 °C
250
200
150
100
50
0
0
50
2 K/s
245 °C
215 °C
180 °C
130 °C
10 s
T
(°C)
10 s
40 s
300
250
215 °C
200
150
100
50
0
100
150
200
t (s)
250
0
180 °C
130 °C
100 °C
External
preheating
Internal preheating,
e.g. by infrared,
max. 2 K/s
Forced
cooling
20 s to 40 s
50
100
150
200
Typical values (solid line)
Process limits (dotted lines)
Typical values (solid line)
Process limits (dotted lines)
t (s)
250
MOUNTING CONDITIONS
A flat pick-up area of minimum 10 mm
2
and low weight allows for fast placement.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue
of perspiration can influence component behavior at high temperatures.
Handling forces applied to the component should be limited to 5 N in any condition.
Revision: 27-Nov-15
Document Number: 29068
2
For technical questions, contact:
nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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www.vishay.com
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Disclaimer
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Revision: 08-Feb-17
1
Document Number: 91000