Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCJ-HR Series
SMCJ-HR Series
Uni-directional
Description
RoHS
Pb
e3
Bi-directional
The SMCJ-HR High Reliability series is designed
specifically to protect sensitive electronic equipment from
voltage transients induced by lightning and other transient
voltage events.
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Features
• SMT for minimal board
footprint
• Low profile package
• Built-in strain relief
•
V
BR
@T
J
= V
BR
@25°C x (1+αT x
(T
J
- 25))
(αT:Temperature Coefficient)
Value
1500
6.5
200
3.5/5.0
-65 to 150
15
75
Unit
W
W
A
V
°C
°C/W
°C/W
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Peak Pulse Power Dissipation at
T
A
=25ºC by
10/1000µs
waveform
(Fig.1)(Note 1), (Note 2)
Power Dissipation on infinite heat
sink at T
L
=50
O
C
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
only (Note 4)
Operating Junction and Storage
Temperature Range
Typical Thermal Resistance Junction
to Lead
Typical Thermal Resistance Junction
to Ambient
Symbol
P
PPM
P
M(AV)
I
FSM
V
F
T
J
, T
STG
R
uJL
R
uJA
• Glass passivated chip
junction
• 1500W peak pulse power
capability at
10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical I
R
≤ 1µA for V
R
>
11.10V
• High Temperature
soldering guaranteed:
260°C/40 seconds at
terminals
• UL Recognized compound
meeting flammability
rating V-0
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°
C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
•
2nd level interconnect is
Pb-free per IPC/JEDEC
J-STD-609A.01
Applications
SMCJ-HR components are ideal for the protection of I/O
Interfaces, V
CC
bus and other vulnerable circuits used in
Telecom, Computer, Industrial and Consumer electronic
Notes:
1. Non-repetitive current pulse , per Fig. 3 and derated above T
A
= 25
O
C per Fig. 2.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
component only, duty cycle=4 per minute maximum.
Functional Diagram
Bi-directional
Cathode
Uni-directional
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/28/18
Anode
1
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCJ-HR Series
Electrical Characteristics
Part
Number
(Uni)
SMCJ5.0A-HR
SMCJ6.0A-HR
SMCJ6.5A-HR
SMCJ7
.0A-HR
SMCJ7
.5A-HR
SMCJ8.0A-HR
SMCJ8.5A-HR
SMCJ9.0A-HR
SMCJ10A-HR
SMCJ11A-HR
SMCJ12A-HR
SMCJ13A-HR
SMCJ14A-HR
SMCJ15A-HR
SMCJ16A-HR
SMCJ17A-HR
SMCJ18A-HR
SMCJ20A-HR
SMCJ22A-HR
SMCJ24A-HR
SMCJ26A-HR
SMCJ28A-HR
SMCJ30A-HR
SMCJ33A-HR
SMCJ36A-HR
SMCJ40A-HR
SMCJ43A-HR
SMCJ45A-HR
SMCJ48A-HR
SMCJ51A-HR
SMCJ54A-HR
SMCJ58A-HR
SMCJ60A-HR
SMCJ64A-HR
SMCJ70A-HR
SMCJ75A-HR
SMCJ78A-HR
SMCJ85A-HR
SMCJ90A-HR
SMCJ100A-HR
SMCJ110A-HR
SMCJ120A-HR
SMCJ130A-HR
SMCJ150A-HR
SMCJ160A-HR
SMCJ170A-HR
Note:
1. For bidirectional type having V
R
of 10 volts and less, the I
R
limit is double.
2. 100% High Temperature Storage Life test and Reflow Simulation.
3. 100% HTRB(High Temperature Reverse Bias). For Unidirectional, 150C/100%VR/96hours,
for Bidirectional, 150C/100%VR/192hrs(96hours for each direction for Bidirectional).
4. Each lot of parts will pass group B test requirement.
Part
Number
(Bi)
SMCJ5.0CA-HR
SMCJ6.0CA-HR
SMCJ6.5CA-HR
SMCJ7
.0CA-HR
SMCJ7
.5CA-HR
SMCJ8.0CA-HR
SMCJ8.5CA-HR
SMCJ9.0CA-HR
SMCJ10CA-HR
SMCJ11CA-HR
SMCJ12CA-HR
SMCJ13CA-HR
SMCJ14CA-HR
SMCJ15CA-HR
SMCJ16CA-HR
SMCJ17CA-HR
SMCJ18CA-HR
SMCJ20CA-HR
SMCJ22CA-HR
SMCJ24CA-HR
SMCJ26CA-HR
SMCJ28CA-HR
SMCJ30CA-HR
SMCJ33CA-HR
SMCJ36CA-HR
SMCJ40CA-HR
SMCJ43CA-HR
SMCJ45CA-HR
SMCJ48CA-HR
SMCJ51CA-HR
SMCJ54CA-HR
SMCJ58CA-HR
SMCJ60CA-HR
SMCJ64CA-HR
SMCJ70CA-HR
SMCJ75CA-HR
SMCJ78CA-HR
SMCJ85CA-HR
SMCJ90CA-HR
SMCJ100CA-HR
SMCJ110CA-HR
SMCJ120CA-HR
SMCJ130CA-HR
SMCJ150CA-HR
SMCJ160CA-HR
SMCJ170CA-HR
Marking
UNI
GDE
GDG
GDK
GDM
GDP
GDR
GDT
GDV
GDX
GDZ
GEE
GEG
GEK
GEM
GEP
GER
GET
GEV
GEX
GEZ
GFE
GFG
GFK
GFM
GFP
GFR
GFT
GFV
GFX
GFZ
GGE
GGG
GGK
GGM
GGP
GGR
GGT
GGV
GGX
GGZ
GHE
GHG
GHK
GHM
GHP
GHR
BI
BDE
BDG
BDK
BDM
BDP
BDR
BDT
BDV
BDX
BDZ
BEE
BEG
BEK
BEM
BEP
BER
BET
BEV
BEX
BEZ
BFE
BFG
BFK
BFM
BFP
BFR
BFT
BFV
BFX
BFZ
BGE
BGG
BGK
BGM
BGP
BGR
BGT
BGV
BGX
BGZ
BHE
BHG
BHK
BHM
BHP
BHR
Reverse
Stand off
Voltage
V
R
(Volts)
5.0
6.0
6.5
7
.0
7
.5
8.0
8.5
9.0
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17
.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
33.0
36.0
40.0
43.0
45.0
48.0
51.0
54.0
58.0
60.0
64.0
70.0
75.0
78.0
85.0
90.0
100.0
110.0
120.0
130.0
150.0
160.0
170.0
Breakdown
Voltage V
BR
(Volts) @ I
T
MIN
6.40
6.67
7
.22
7
.78
8.33
8.89
9.44
10.00
11.10
12.20
13.30
14.40
15.60
16.70
17
.80
18.90
20.00
22.20
24.40
26.70
28.90
31.10
33.30
36.70
40.00
44.40
47
.80
50.00
53.30
56.70
60.00
64.40
66.70
71.10
77
.80
83.30
86.70
94.40
100.00
111.00
122.00
133.00
144.00
167
.00
178.00
189.00
MAX
7
.00
7
.37
7
.98
8.60
9.21
9.83
10.40
11.10
12.30
13.50
14.70
15.90
17
.20
18.50
19.70
20.90
22.10
24.50
26.90
29.50
31.90
34.40
36.80
40.60
44.20
49.10
52.80
55.30
58.90
62.70
66.30
71.20
73.70
78.60
86.00
92.10
95.80
104.00
111.00
123.00
135.00
147
.00
159.00
185.00
197
.00
209.00
Maximum Maximum Maximum
Test
Agency
Peak
Reverse
Current Clamping
Approval
Voltage V
C
Pulse
Leakage I
R
I
T
@ I
pp
Current I
pp
@ V
R
(mA)
(V)
(A)
(µA)
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17
.0
18.2
19.9
21.5
23.2
24.4
26.0
27
.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77
.4
82.4
87
.1
93.6
96.8
103.0
113.0
121.0
126.0
137
.0
146.0
162.0
177
.0
193.0
209.0
243.0
259.0
275.0
163.0
145.7
134.0
125.0
116.3
110.3
104.2
97
.4
88.3
82.5
75.4
69.8
64.7
61.5
57
.7
54.4
51.4
46.3
42.3
38.6
35.7
33.1
31.0
28.2
25.9
23.3
21.7
20.6
19.4
18.2
17
.3
16.1
15.5
14.6
13.3
12.4
11.9
11.0
10.3
9.3
8.5
7
.8
7
.2
6.2
5.8
5.5
800
800
500
200
100
50
20
10
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
2
16
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/28/18
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCJ-HR Series
Screen Process
100% vision inspection
100%High Temperature Storage Life (168hrs,150C)
100% X-RAY inspection
100% Temperature cycle test (-55-150C, 20 cycles, dwell time 15 min)
100% Reflow (2X)
100% surge test (2x)
100% HTRB(150C, Bias=VR(80% breakdown voltage), 96hrs),for Bi-
direction products, 96hrs for each direction
Final electrical test( 100% 3 sigma limit, 100% dynamic test and PAT
limit)
MIL
-STD-750 method 2074
MIL
-STD-750 method 1031
MIL
-STD-750 method 2076
MIL
-STD-750 method 1051
JEDEC J-STD-020
MIL
-STD-750 method 4066
MIL–STD–750 method 1038
MIL
-STD-750 method 4016.4021.4011
Note: Up-screen program can be specified by customer’s request via contacting Littlefuse service
Group B Test Requirement
Screen
Surge test
Method
10/1000
µ
s Peak
Pluse Waveform
Condition
Maximum Clamping
Voltage (V
C
) @ Peak
Plus Current (I
PP
)
Applied Voltage
100% V
R
@150°C
I
R
@V
R
, V(
BR
)@I
T
Requirement
Sample size 45 perform 10x
Accept 0 failures
Sample size 45
340 hours (680 hours for
bi-direction products, each
direction 340 hours)
Accept 0 failures
Sample size 45
Accept 0 failures
Burn - In
(HTRB)
MIL -STD-750,
Method 1038.5
Electrical test
--
I-V Curve Characteristics
Uni-directional
Bi-directional
I
pp
Vc V
BR
V
R
I
R
V
F
I
T
V
Vc V
BR
V
R
I
T
I
R
I
R
I
T
V
R
V
BR
Vc
V
I
pp
I
pp
P
PPM
V
R
V
BR
V
C
I
R
V
F
Peak Pulse Power Dissipation (I
PP
x V
C
)
-- Max power dissipation
Stand-off Voltage
-- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage
-- Maximum voltagethat flows though the TVS at a specified test current (I
T
)
Clamping Voltage
-- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current)
Reverse Leakage Current
-- Current measured at V
R
Forward Voltage Drop for Uni-directional
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/28/18
3
17
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCJ-HR Series
Ratings and Characteristic Curves
(T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Voltage Transients
Figure 2 - Peak Pulse Power Rating
100
P
PPM
-Peak Pulse Power (kW)
Voltage Across TVS
Voltage or Current
Current Through TVS
10
0.31x0.31" (8.0x8.0mm)
Copper Pad Area
1
0.000001
Time
0.00001
0.0001
0.001
t
d
-Pulse Width (sec.)
Figure 3 - Pulse Derating Curve
100
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
80
60
40
20
0
TVS Diode Arrays
(SPA
™
Family of Products)
150
I
PPM
- Peak Pulse Current, % I
RSM
Figure 4 - Pulse Waveform
tr=10µsec
Peak Value
IPPM
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
100
Half Value
IPPM
IPPM
2
( )
10/1000µsec. Waveform
as defined by R.E.A
50
0
25
50
75
100
125
150
175
0
td
T
A
-Ambient temperature (ºC)
0
1.0
2.0
t-Time (ms)
3.0
4.0
Figure 5 - Typical Junction Capacitance
100000
10000
1000
100
Bi-directional @V
R
Bi-directional V=0V
Uni-directional V=0V
Figure 6 - Steady State Power Dissipation Derating
Curve
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
Cj (pF)
Uni-directional @V
R
10
1
1.0
Tj=25C
f=1.0MHz
Vsig=50mVp-p
10.0
100.0
1000.0
P
M(AV)
, Steady Sate Power Dissipation
(W)
V
BR
- Reverse Breakdown Voltage (V)
0
25
(Power Dissipation on Infinite Heat Sink )
50
75
100
125
150
T
A
-
TL-Lead Temperature (˚C)
(ºC)
Ambient Temperature
175
4
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/28/18
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCJ-HR Series
Figure 7 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional Only
I
FSM
- Peak Forward Surge Current (A)
200
180
160
140
120
100
80
60
40
20
0
1
10
Number of Cycles at 60 Hz
100
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Time (min to max) (t
s
)
Lead–free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
280°C
High Temp. Storage
JESD22-A103
JESD22-A108
JESD22-A106
JEDEC-J-STD-020, Level 1
JESD22-A101
JESD22-B106
Temperature (T)
T
P
Ramp-up
t
p
Critical Zone
T
L
to T
P
T
L
T
s(max)
t
L
T
s(min)
Ramp-down
Preheat
t
s
25˚C
t 25˚C to Peak
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Time (t)
Environmental Specifications
Physical Specifications
Weight
Case
Polarity
Terminal
0.007 ounce, 0.21 grams
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Color band denotes positive end
(cathode) except Bidirectional.
Matte Tin-plated leads, Solderable per
JESD22-B102
HTRB
Thermal Shock
MSL
H3TRB
RSH
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/28/18
5
19
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