PL
IA
NT
SinglFuse
™
SF-0402F Series Features
n
Fast acting thin film chip fuse for overcurrent protection
n
1005 (EIA 0402) miniature footprint
n
Surface mount packaging for automated assembly
n
UL listed (UL 248-14)
n
RoHS compliant* and halogen free**
F
RE
E
LE
AD
*R
oH
S
C
OM
SF-0402F Series - Fast Acting Surface Mount Fuses
Resistance
Tolerance ±25 %
(mΩ)***
690
340
140
100
95
57
45
44
33
25
19
18
12
Electrical Characteristics
Model
SF-0402F0315
SF-0402F050
SF-0402F075
SF-0402F080
SF-0402F100
SF-0402F125
SF-0402F150
SF-0402F160
SF-0402F200
SF-0402F250
SF-0402F300
SF-0402F315
SF-0402F400
Rated Current
(Amps)
0.315
0.50
0.75
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Fusing Time
Rated
Voltage
Breaking
Capacity
Typical
I t (A
2
s)****
2
Open within 1
min. at 200 %
rated current
DC 32 V
DC32 V 35 A
*** Resistance value measured with less than 10 % of rated current.
****Typical I
2
t value measured at 10x rated current.
0.00203
0.00317
0.0049
0.00532
0.00724
0.01344
0.01356
0.01672
0.01983
0.03763
0.05427
0.06304
0.0896
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds
coating and marking
Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing
Thermal Shock .........................................
DR
< 10 % ..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
UL File Number .........................................E198545
http://www.ul.com/ Follow link to Online Certificates Directory, then enter UL File No. E198545,
or click here
Environmental Characteristics
Operating Temperature..................................................................................-20 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Moisture Sensitivity Level ........................................................................................................ 1
ESD Classification (HBM).............................................................................................. Class 6
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Asia-Pacific:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
SinglFuse
™
SF-0402F Series Applications
n
Portable memory
n
LCD monitors
n
Disk drives
n
PDAs
n
Digital cameras
n
DVDs
TEMPERATURE (°C)
n
Cell phones
n
Rechargeable battery packs
n
Battery chargers
n
Set top boxes
n
Industrial controllers
250
Peak: 250 +0/-5 °C
230 °C or higher
PRE-HEATING ZONE
200
SF-0402F Series - Fast Acting Surface Mount Fuses
150
180 °C
150 °C
Solder Reflow Recommendations
250
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
Peak: 250 +0/-5 °C
230 °C or higher
TEMPERATURE (°C)
200
180 °C
150
150 °C
PRE-HEATING ZONE
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
0.52 ± 0.05
(.020 ± .002)
1.0 ± 0.1
(.039 ± .004)
0.381
(.015)
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
Product Dimensions
230 °C or higher, 30 ± 10 seconds
SOLDERING ZONE:
1.0 ± 0.1
(.039 ± .004)
0.2 ± 0.1
1.0 ± 0.1
(.008 ± .004)
(.039 ± .004)
0.2 ± 0.1
0.381
(.008 ± .004)
(.015)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
0.25 ± 0.1
(.010 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.52 ± 0.05
(.020 ± .002)
0.25 ± 0.1
(.010 ± .004)
1.55
(.061)
0.558
(.022)
Recommended Pad Layout
0.381
(.015)
1.55
(.061)
0.558
(.022)
0.558
(.022)
0.35
PACKAGING: 10,000 pcs./reel
± 0.05
MM
DIMENSIONS:
(INCHES)
0.35 ± 0.05
(.014 ± .002)
1.55
(.061)
(.014 ± .002)
Thermal Derating Curve
0.25 ± 0.1
(.010 ± .004)
120
110
100
90
0.25 ± 0.1
(.010 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.25 ± 0.1
(.010 ± .004)
Construction & Material Content
OVERCOAT
PERCENT OF RATING (%)
Sn PLATING
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.