†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
**SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
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2
SMS05T1 Series
TYPICAL CHARACTERISTICS
10
P
PP
, PEAK PULSE POWER (kW)
% OF RATED POWER OR I
PP
110
100
90
80
70
60
50
40
30
20
10
0
1
0.1
0.01
0.1
1
10
100
1000
t
p
, PULSE DURATION (ms)
0
25
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (°C)
Figure 1. Non−Repetitive Peak Pulse Power
versus Pulse Time
Figure 2. Power Derating Curve
110
100
90
PERCENT OF I
PP
80
70
60
50
40
30
20
10
0
c−t
t
d
= I
PP
/2
V
C
, CLAMPING VOLTAGE (V)
WAVEFORM
PARAMETERS
t
r
= 8
ms
t
d
= 20
ms
50
45
40
35
30
25
20
15
10
5
0
5
10
15
t, TIME (ms)
20
25
30
0
0
5
10
15
20
25
SMS05
SMS24
WAVEFORM
PARAMETERS
t
r
= 8
ms
t
d
= 20
ms
SMS15
SMS12
I
PP
, PEAK PULSE CURRENT (A)
Figure 3. Pulse Waveform
Figure 4. Clamping Voltage versus
Peak Pulse Current
300
5
V
F
, FORWARD VOLTAGE (V)
PULSE
WAVEFORM
t
r
= 8
ms
t
d
= 20
ms
8 X 20
ms
SURGE
C, CAPACITANCE (pF)
4
250
200
SMS05
150
100
SMS12
50
0
SMS15
T
J
= 25°C
3
2
1
0
0
5
10
15
20
I
F
, FORWARD CURRENT (A)
SMS24
0
5
10
15
20
25
V
R
, REVERSE VOLTAGE (V)
Figure 5. 8 x 20
ms
V
F
Figure 6. Typical Capacitance (SMS05 Series)
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3
SMS05T1 Series
PACKAGE DIMENSIONS
SC−74 (SC−59ML)
CASE 318F−05
ISSUE N
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.37
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
6
5
1
2
4
H
E
E
3
b
e
q
0.05 (0.002)
A1
A
L
C
DIM
A
A1
b
c
D
E
e
L
H
E
q
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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