PL
IA
NT
SinglFuse
™
SF-0603S Series Features
n
Slow blow thin film chip fuse for overcurrent protection
n
1608 (EIA 0603) miniature footprint
n
Surface mount packaging for automated assembly
n
UL listed (UL 248-14)
n
RoHS compliant* and halogen free**
F
RE
E
LE
AD
*R
oH
S
C
OM
SF-0603S Series - Slow Blow Surface Mount Fuses
Electrical Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Model
SF-0603S050
SF-0603S063
SF-0603S070
SF-0603S080
SF-0603S100
SF-0603S125
SF-0603S150
SF-0603S160
SF-0603S200
SF-0603S250
SF-0603S300
SF-0603S315
SF-0603S400
SF-0603S500
SF-0603S600
SF-0603S040
Rated Current
(Amps)
0.40
0.50
0.63
0.70
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
5.00
6.00
Fusing Time
Resistance
(mΩ) Typ.***
350
232
150
148
113
67
50
42
40
27
19.5
16
15
11
8
6
Rated Voltage
DC 50 V
Breaking Capacity
DC 50 V /
AC 35 V
50 A
Typical
I t (A
2
s) ****
0.004
2
Open within 5 sec.
at 250 % rated
current
DC 32 V
DC 32 V /
AC 35 V
50 A
0.009
0.017
0.023
0.024
0.026
0.057
0.081
0.086
0.115
0.200
0.210
0.279
0.326
0.622
2.700
*** Resistance value was measured with less than 10 % of rated current.
****Typical I
2
t value is measured at 10x rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours
Fusing Time .............................................. Within 5 seconds........................................250 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm, 1 time, 30 seconds
Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds
coating and marking
Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing
Thermal Shock .........................................
DR
< 10 % ..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
UL File Number .........................................E198545
http://www.ul.com/ Follow link to Online Certificates Directory, then enter UL File No. E198545,
or
click here
Environmental Characteristics
Operating Temperature..................................................................................-20 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Moisture Sensitivity Level ........................................................................................................ 1
ESD Classification (HBM)..............................................................................................
Class 6
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Asia-Pacific:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
SinglFuse
™
SF-0603S Series Applications
n
Portable memory
n
LCD monitors
n
Disk drives
n
PDAs
n
Digital cameras
n
DVDs
TEMPERATURE (°C)
n
Cell phones
n
Rechargeable battery packs
n
Battery chargers
n
Set top boxes
n
Industrial controllers
250
Peak: 250 +0/-5 °C
230 °C or higher
200
SF-0603S Series - Slow Blow Surface Mount Fuses
150
180 °C
150 °C
PRE-HEATING ZONE
Solder Reflow Recommendations
250
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
Peak: 250 +0/-5 °C
230 °C or higher
TEMPERATURE (°C)
200
180 °C
150
150 °C
PRE-HEATING ZONE
90 ± 30 Seconds
100
30 ± 10 Seconds
1.6 ± 0.1
(.063 ± .004)
SOLDERING ZONE
50
HEATING TIME
0.8 ± 0.1
(.031 ± .004)
1.02
(.040)
1.09
(.043)
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE:
Product Dimensions
230 °C or higher, 30 ± 10 seconds
1.6 ± 0.1
(.063 ± .004)
0.3 ± 0.2
(.012 ± .008)
1.6 ± 0.1
(.063 ± .004)
0.3 ± 0.2
(.012 ± .008)1.02
(.040)
0.45 ± 0.1
(.018 ± .004)
Recommended Pad Layout
1.02
(.040)
2.54
(.010)
0.8 ± 0.1
(.031 ± .004)
0.35 ± 0.2
(.014 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.8 ± 0.1
(.031 ± .004)
0.35 ± 0.2
(.014 ± .008)
2.54
(.010)
1.09
(.043)
1.09
(.043)
0.45
PACKAGING: 5,000 pcs./reel
± 0.1
DIMENSIONS:
(.018 ± .004)
0.45 ± 0.1
(.018 ± .004)
MM
(INCHES)
2.54
(.010)
Thermal Derating Curve
0.35 ± 0.2
0.35 ± 0.2
(.014 ± .008)
120
(.014 ± .008)
Construction & Material Content
0.35 ± 0.2
(.014 ± .008)
0.35 ± 0.2
(.014 ± .008)
Sn PLATING
OVERCOAT
PERCENT OF RATING (%)
110
100
90
80
-20
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Microchip MCU
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