NTC SMD Thermistors
NC 12 – NC 20 (PdPtAg Termination)
Chip thermistors are a high quality and low cost device espe-
cially developed for surface mounting applications. They are
widely used for temperature compensation but can also
achieve temperature control of printed circuits. Its silver -
palladium - platinum metallization provides a high degree of
resistance to dewetting of the terminations during soldering
(typically 260°C / 15 s). Parts are suitable for hybrid assem-
bly process, not suitabel for lead free soldering.
NC 20
IEC SIZE : 1206
3.2 (.126)
±
0.4 (.016)
1.6 (.063)
±
0.25 (.010)
0.5 (.020)
... 1.5 (.059)
0.2 (.008) min
0.2 (.008) min
0.2 (.008) min
Types
NC 12
IEC SIZE : 0805
2 (.079)
±
0.3 (.012)
DIMENSIONS:
millimeters (inches)
1.25 (.049)
±
0.2 (.008)
0.5 (.020)
... 1.3 (.051)
0.2 (.008) min
Terminations
Marking
Climatic category
Operating temperature
Tolerance on Rn (25°C)
Maximum dissipation at 25°C
Thermal dissipation factor
Thermal time constant
Resistance - Temperature characteristics: pages 29 to 33.
Silver – palladium – platinum metallization
On packaging only
40/125/56
-55°C to +150°C
±3%*, ±5%, ±10%, ±20%
0.12 W
2 mW/°C
5s
0.24 W
4 mW/°C
7s
FEATURES
• Fast thermal response
•
•
•
•
Commercial, Industrial and Automotive Applications
PdPtAg Termination
Suitable for hybrid assembly
AEC-Q200 qualified
APPLICATIONS
• LCD compensation
•
•
•
•
•
•
•
•
•
Battery packs
Mobile phones
CD players
Heating systems
Air-conditioning systems
Refrigeration
Temperature control of Switch Mode Power Supplies
Compensation of pressure sensors
Protection of power transistors in various electronic circuits
and more
HOW TO ORDER
NC 20
K0
0103
M
BA
Type
NC12 (0805)
NC20 (1206)
Material Code
K
(See tables
pages 15)
Resistance
10,000 Ω
(See tables page 15)
Tolerance
H (±3%)*
J (±5%)
K (±10%)
M (±20%)
Suffix: Packaging
– –: Bulk (5000 pcs/reel)
NC20 BA: Plastic tape (180mm diam. reel, 3000 pcs/reel)
BE: Plastic tape (1/2 reel, 1500 pcs/reel)
BC: Plastic tape (330mm diam. reel), 10,000 pcs/reel)
NC12 BB: Cardboard tape (180mm diam. reel, 4000 pcs/reel)
BF: Cardboard tape (1/2 reel, 2000 pcs/reel)
BD: Cardboard tape (330mm diam. reel, 10,000 pcs/reel)
* Optional tolerance, please contact factory
1
010617
NTC SMD Thermistors
NC 12 – NC 20 (PdPtAg Termination)
TABLE OF VALUES
NC 12
IEC SIZE : 0805
Types
Rn at 25°C
(Ω)
Material
Code
B (K)
NC 20
IEC SIZE : 1206
(
B/B
(1) ± 5%
(2) ± 3%
)
at 25°C
(%/°C)
Types
Rn at 25°C
(Ω)
Material
Code
B (K)
(
B/B
(1) ± 5%
(2) ± 3%
)
at 25°C
(%/°C)
NC 12 KC 0 180
NC 12 KC 0 220
NC 12 KC 0 270
NC 12 KC 0 330
NC 12 KC 0 390
NC 12 KC 0 470
NC 12 KC 0 560
NC 12 KC 0 680
NC 12 KC 0 820
NC 12 KC 0 101
NC 12 MC 0 121
NC 12 MC 0 151
NC 12 MC 0 181
NC 12 MC 0 221
NC 12 MC 0 271
NC 12 MC 0 331
NC 12 MC 0 391
NC 12 MC 0 471
NC 12 MC 0 561
NC 12 MC 0 681
NC 12 MC 0 821
NC 12 MC 0 102
NC 12 MC 0 122
NC 12 MC 0 152
NC 12 MC 0 182
NC 12 MC 0 222
NC 12 MC 0 272
NC 12 MC 0 332
NC 12 J 0 0332
NC 12 J 0 0392
NC 12 J 0 0472
NC 12 J 0 0562
NC 12 K 0 0682
NC 12 K 0 0822
NC 12 K 0 0103
NC 12 K 0 0123
NC 12 L 0 0153
NC 12 L 0 0183
NC 12 M 0 0223
NC 12 M 0 0273
NC 12 M 0 0333
NC 12 M 0 0393
NC 12 N 0 0473
NC 12 N 0 0563
NC 12 L 2 0683
NC 12 N 0 0823
NC 12 P 0 0104
NC 12 P 0 0124
NC 12 P 0 0154
NC 12 P 0 0184
NC 12 Q 0 0224
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,300
3,900
4,700
5,600
6,800
8,200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
KC
3470 ± 5%
– 3.9
NC 20 KC 0 100
NC 20 KC 0 120
NC 20 KC 0 150
NC 20 KC 0 180
NC 20 KC 0 220
NC 20 KC 0 270
NC 20 KC 0 330
NC 20 KC 0 390
NC 20 KC 0 470
NC 20 KC 0 560
NC 20 KC 0 680
NC 20 KC 0 820
NC 20 KC 0 101
NC 20 MC 0 121
NC 20 MC 0 151
NC 20 MC 0 181
NC 20 MC 0 221
NC 20 MC 0 271
NC 20 MC 0 331
NC 20 MC 0 391
NC 20 MC 0 471
NC 20 MC 0 561
NC 20 MC 0 681
NC 20 MC 0 821
NC 20 MC 0 102
NC 20 MC 0 122
NC 20 MC 0 152
NC 20 I 0 0182
NC 20 I 0 0222
NC 20 I 0 0272
NC 20 I 0 0332
NC 20 J 0 0392
NC 20 J 0 0472
NC 20 J 0 0562
NC 20 J 0 0682
NC 20 K 0 0822
NC 20 K 0 0103
NC 20 K 0 0123
NC 20 K 0 0153
NC 20 L 0 0183
NC 20 L 0 0223
NC 20 M 0 0273
NC 20 M 0 0333
NC 20 M 0 0393
NC 20 M 0 0473
NC 20 N 0 0563
NC 20 N 0 0683
NC 20 N 0 0823
NC 20 N 0 0104
NC 20 P 0 0124
NC 20 P 0 0154
NC 20 P 0 0184
NC 20 P 0 0224
NC 20 Q 0 0274
NC 20 Q 0 0334
NC 20 Q 0 0394
NC 20 Q 0 0474
NC 20 R 0 0564
NC 20 R 0 0684
NC 20 R 0 0824
NC 20 R 0 0105
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,900
4,700
5,600
6,800
8,200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
270,000
330,000
390,000
470,000
560,000
680,000
820,000
1,000,000
KC
3470 ± 5%
– 3.9
MC
3910 ± 3%
– 4.4
MC
3910 ± 3%
– 4.4
J
3480 ± 3%
– 3.9
I
3250 ± 5%
– 3.7
J
3480 ± 3%
– 3.9
K
3630 ± 3%
– 4.0
L
M
3790 ± 3%
3950 ± 3%
– 4.2
– 4.4
K
3630 ± 3%
– 4.0
L
M
3790 ± 3%
3950 ± 3%
– 4.2
– 4.4
N
L2
N
P
4080 ± 3%
3805 ± 3%
4080 ± 3%
4220 ± 3%
– 4.6
– 4.1
– 4.6
– 4.7
N
4080 ± 3%
– 4.6
P
4220 ± 3%
– 4.7
Q
4300 ± 3%
-4.7
Q
4300 ± 3%
– 4.7
R
4400 ± 3%
– 4.8
010617
2
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
Super 8 Plastic Tape Packaging:
The mechanical and dimensional reel characteristics are in
accordance with the IEC publication 286-3.
5.5 (.217)
±0.2
(.008)
Cover Tape
Max
3°
B0
Max
3°
30μ
±
5μ
T
K
R = 0.3 (.012) Max.
B1
F
D0
P2
P0
Max
3°
Max
3°
A0
Direction of
unreeling
Hole
A1
W
1 (.039)
-0
+0.2 (.008)
E
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Distance
Distance (center to center)
Distance (center to center)
Sizes of the
NC 12 (0805)
cavities
Symbol
W
T
P0
D0
E
F
P2
A0
B0
K
Value
8
0.4 max.
4
1.5
-0
1.75
3.5
2
1.5
2.4
1.4 max.
Tolerance
±0.2
±0.1
±0.1
±0.1
±0.05
±0.1
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
NC 20 (1206)
A0
B0
K
1.95
3.55
1.5 max.
ø180 (7.09)
- 2 (.079)
+0
Direction of unreeling
ø 12.75 (.502)
- 0
ø 62 (2.44)
±
1.5 (.059)
+ 0.15 (.006)
Reel
Upper side
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Reel
according to
ISO/DIS 3639-2
+ 0.5 (.020)
Bottom side
ø 20.5 (.087)
- 0
QUANTITY PER REEL
Type
NB20
NC20
Suffix
BA
BE
BC
Description
Plastic tape (180mm diam. reel)
Plastic tape (1/2 reel)
Plastic tape (330mm diam. reel)
Qty Per Reel
3,000 pcs
1,500 pcs
10,000 pcs
3
010617
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
8mm Paper Tape Packaging:
The mechanical and dimensional reel characteristics
are in accordance with the IEC publication 286-3.
BOTTOM
COVER
TAPE
T
D
0
P
2
TOP
COVER
TAPE
B
0
G
T
1
T
1
CAVITY SIZE
SEE NOTE 1
A
0
CENTER LINES
OF CAVITY
P
1
User Direction of Feed
P
0
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
0.20mm (0.008)
E
1
F
E
2
W
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Distance
Distance (center to center)
Distance (center to center)
Cover tape thickness
Distance
Distance
Component pitch
0805/0603
0402
Symbol
W
T
P
0
D
0
E
1
F
P
2
T
1
E
2
G
P
1
Value
8
1.1 max.
4
1.5
-0/+0.1
1.75
3.5
2
0.10 max.
6.25 min.
0.75 min.
4
2
Tolerance
-.0.1/+0.3
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.1
ø180 (7.09)
- 2 (.079)
+0
Direction of unreeling
ø 12.75 (.502)
- 0
ø 62 (2.44)
±
1.5 (.059)
+ 0.15 (.006)
Reel
Upper side
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Reel
according to
ISO/DIS 3639-2
+ 0.5 (.020)
Bottom side
ø 20.5 (.087)
- 0
QUANTITY PER REEL
Type
NB12
NC12
NB21
Suffix
BB
BF
BD
Description
Cardboard tape (180mm diam. reel)
Cardboard tape (1/2 reel)
Cardboard tape (330mm diam. reel)
Qty Per Reel
4,000 pcs
2,000 pcs
10,000 pcs
010617
4
Surface Mounting Guide
Chip Thermistor – Application Notes
STORAGE
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Wave
300
Preheat
250
200
150
100
50
Natural
Cooling
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
P/N
NC
NB
Termination
Type
AgPdPt
Nickel Barrier
Solder
Tin/Lead
60/40
60/40
Solder
Temp ºC
260 ± 5
260 ± 5
Immersion
Time Seconds
15 max
30 ± 1
Solder Temp.
T
230ºC
to
250ºC
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
D2
Reflow
300
250
200
150
100
50
220ºC
to
250ºC
Preheat
Natural
Cooling
RECOMMENDED
SOLDERING PAD
LAYOUT
D1
D3
Solder Temp.
D4
Dimensions in
mm (inches)
D5
REFLOW SOLDERING
Case
Size
0402
1min
1min
10 sec. max
(Minimize soldering time)
P/N
NB23
NB21
NB12
NB20
D1
1.70
(.067)
2.30
(.091)
3.00
(.118)
4.00
(.157)
D2
0.60
(.024)
0.80
(.031)
1.00
(.039)
1.00
(.039)
D3
0.50
(.020)
0.70
(.028)
1.00
(.039)
2.00
(.079)
D4
0.60
(.024)
0.80
(0.31)
1.00
(.039)
1.00
(.039)
D5
0.50
(.020)
0.75
(.030)
1.25
(.049)
2.50
(.098)
0
0603
0805
300
250
200
150
100
50
0
0
1206
Temperature °C
WAVE SOLDERING
Case
Size
50
100
150
200
250
Time (s)
300
0603
0805
1206
P/N
NB21
NB12
NB20
D1
3.10
(.122)
4.00
(.157)
5.00
(.197)
D2
1.20
(.047)
1.50
(.059)
1.50
(.059)
D3
0.70
(.028)
1.00
(.039)
2.00
(.079)
D4
1.20
(.047)
1.50
(.059)
1.50
(.059)
D5
0.75
(.030)
1.25
(.049)
1.60
(.063)
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
5
Microchip MCU
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