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CM1230-J2CP

产品描述ESD Suppressors / TVS Diodes 2-Ch ESD Protection
产品类别分立半导体    二极管   
文件大小243KB,共8页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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CM1230-J2CP概述

ESD Suppressors / TVS Diodes 2-Ch ESD Protection

CM1230-J2CP规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
零件包装代码CSP
包装说明S-PBGA-B4
针数4
制造商包装代码567AW
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性HIGH RELIABILITY
最大钳位电压9.8 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码S-PBGA-B4
JESD-609代码e1
湿度敏感等级1
元件数量1
端子数量4
封装主体材料PLASTIC/EPOXY
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
认证状态Not Qualified
表面贴装YES
技术AVALANCHE
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

文档预览

下载PDF文档
CM1230
2, 4, and 8-Channel
Low-Capacitance ESD
Protection Array
Product Description
The CM1230 is a family of 2, 4 and 8 channel, very low capacitance
ESD protection diode arrays in a CSP form factor. It is ideal for
protecting systems with high data and clock rates or for circuits that
need low capacitive loading. Each channel consists of a pair of ESD
diodes that act as clamp diodes to steer ESD current pulses to either the
positive or negative supply rail. A Zener diode is integrated between the
positive and negative supply rails. The V
CC
rail is protected from ESD
strikes and eliminates the need for a bypass capacitor to absorb positive
ESD strikes to ground. Each channel can safely dissipate ESD strikes of
±8
kV, meeting the Level 4 requirement of the IEC61000−4−2
international standard as well as
±15
kV air discharges per the
IEC61000−4−2 specification. Using the MIL−STD−883 (Method
3015) specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than
±15
kV.
This device is well−suited for next generation wireless handsets that
implement high−speed serial interface solutions for the LCD display
and camera interfaces. In these designs, a tolerance above 1.5 pF
cannot be tolerated when high data rates are transferred between the
baseband choppiest and the LCD driver/controller Is. Higher
capacitive loading normally causes the rise and fall times to slow
which hampers the functionality of circuit and operation of the
wireless handset. The CM1230 incorporates
OptiGuardt
which
results in improved reliability at assembly. The CM1230 is available in
a s p a c e
−s
a v i n g , l o w p r o f i l e C h i p S c a l e P a c k a g e w i t h
RoHS−compliant, lead−free finishing.
Features
http://onsemi.com
WLCSP4
CP SUFFIX
CASE 567CS
WLCSP6
CP SUFFIX
CASE 567BB
WLCSP10
CP SUFFIX
CASE 567BG
MARKING DIAGRAM
L MG
G
CSP−4
L30 MG
G
CSP−6
L308 MG
G
CSP−10
Lxxx
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
CM1230−02CP
(Note 1)
CM1230−J2CP
(Note 1)
CM1230−04CP
CM1230−08CP
Package
Shipping
CSP−4
3,500/Tape & Reel
(Pb−Free)
CSP−4
3,500/Tape & Reel
(Pb−Free)
CSP−6
3,500/Tape & Reel
(Pb−Free)
CSP−10 3,500/Tape & Reel
(Pb−Free)
Two, Four, and Eight Channels of ESD Protection
Provides ESD Protection to IEC61000−4−2 Level 4
±8
kV Contact Discharge &
±15
kV Air Discharge
Low Loading Capacitance of 0.8 pF Typical
Minimal Capacitance Change with Temperature and Voltage
Channel I/O to GND Capacitance Difference of 0.02 pF Typical is
Ideal for Differential Signals
Channel I/O to I/O Capacitance 0.15 pF Typical
Zener Diode Protects Supply Rail and Eliminates the Need for
External By−pass Capacitors
Each I/O Pin Can Withstand Over 1000 ESD Strikes*
Available in 4, 6 and 10 Bump Chip Scale Packages (CSP)
OptiGuardt
Coated for Improved Reliability at Assembly
These Devices are Pb−Free and are RoHS Compliant
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*Standard test condition is IEC61000−4−2 level 4 test
circuit with each (A
OUT
/B
OUT
) pin subjected to
±12
kV contact discharge for 1000 pulses. Dis-
charges are timed at 1 second intervals and all 1000
strikes are completed in one continuous test run.
1. CM1230−02CP and CM1230−J2CP are the same
mechanical package. Only difference is the Pin 1
orientation (‘+’ mark) on the tape and reel.
Applications
I/O Port Protection for Mobile Handsets, Notebook Computers,
DSCs, MP3 Players, PDAs, etc. Including USB, 1394 and Serial ATA
LCD and Camera Data Lines in Wireless Handsets that
Handheld PCs/PDAs
use High−speed Serial Interfaces
LCD and Camera Modules
Wireless Handsets
©
Semiconductor Components Industries, LLC, 2012
January, 2012
Rev. 4
1
Publication Order Number:
CM1230/D

CM1230-J2CP相似产品对比

CM1230-J2CP CM1230-02CP CM1230-04CP
描述 ESD Suppressors / TVS Diodes 2-Ch ESD Protection ESD Suppressors / TVS Diodes 2 Ch. ESD Protection ESD Suppressors / TVS Diodes 4 Ch. ESD Protection
Brand Name ON Semiconductor ON Semiconductor ON Semiconductor
是否无铅 不含铅 不含铅 不含铅
零件包装代码 CSP CSP CSP
包装说明 S-PBGA-B4 S-PBGA-B4 R-PBGA-B6
针数 4 4 6
制造商包装代码 567AW 567AW 567BB
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
其他特性 HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
最大钳位电压 9.8 V 9.8 V 9.8 V
配置 SINGLE SINGLE SINGLE
二极管元件材料 SILICON SILICON SILICON
二极管类型 TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码 S-PBGA-B4 S-PBGA-B4 R-PBGA-B6
JESD-609代码 e1 e1 e1
元件数量 1 1 1
端子数量 4 4 6
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 SQUARE SQUARE RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
极性 UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
技术 AVALANCHE AVALANCHE AVALANCHE
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
端子形式 BALL BALL BALL
端子位置 BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
湿度敏感等级 1 1 -
Base Number Matches 1 1 -
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