3.2x1.6mm SMD CHIP LED LAMP
KPC-3216SEC
SUPER BRIGHT ORANGE
Features
!
3.2mmx1.6mm SMT LED, 1.1mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL
Description
The Super Bright Orange source color devices are
made with DH InGaAlP on GaAs substrate Light
Emitting Diode.
FOR BACKLIGHT AND INDICATOR.
COLORS AND LENS TYPES AVAILABLE.
: 2000PCS / REEL.
!
VARIOUS
!
PACKAGE
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
±0.2(0.0079")
unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD0224
APPROVED: J. Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: JAN/25/2003
DRAWN: X.T.HU
PAGE: 1 OF 4
Selection Guide
Iv (m c d )
@ 20 m A
Min .
KPC-3216SEC
SUPER BRIGHT ORANGE ( InGaAlP)
WATER CLEAR
70
Ty p .
200
V i ew i n g
An g l e
2θ1/2
120°
Dic e
L en s Ty p e
Note:
1.
θ1/2
is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
A
=25°C
°
Sy m b o l
λ
peak
λ
D
∆λ
1/2
C
V
F
I
R
P ar am et er
Peak Wavelength
Dominate Wavelength
Spectral Line Half-width
Capacitance
Forward Voltage
Reverse Current
D ev i c e
Super Bright Orange
Super Bright Orange
Super Bright Orange
Super Bright Orange
Super Bright Orange
Super Bright Orange
Ty p .
610
601
29
30
2.0
2.5
10
Max .
Un its
nm
nm
nm
pF
V
uA
Tes t Co n d it io n s
I
F
= 2 0 m A
I
F
= 2 0 m A
I
F
= 2 0 m A
V
F
= 0 V;f= 1 M Hz
I
F
= 2 0 m A
V
R
= 5V
Absolute Maximum Ratings at T
A
=25°C
°
P ar am et er
Power dissipation
DC Forward Current
Peak Forward Current [1]
Reverse Voltage
Operating/Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Su p er B r ig h t Or an g e
75
30
195
5
-40
°
C To +85
°C
Un its
mW
mA
mA
V
SPEC NO: DSAD0224
APPROVED: J. Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: JAN/25/2003
DRAWN: X.T.HU
PAGE: 2 OF 4
Super Bright Orange
KPC-3216SEC
SPEC NO: DSAD0224
APPROVED: J. Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: JAN/25/2003
DRAWN: X.T.HU
PAGE: 3 OF 4
KPC-3216SEC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD0224
APPROVED: J. Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: JAN/25/2003
DRAWN: X.T.HU
PAGE: 4 OF 4
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