NT
Features
n
Two resistance-matched PTCs in a
ceramic housing
n
Narrow resistance tolerance
n
RoHS compliant*
*R
oH
S
Model CMF-SD is currently available,
although not recommended for new
designs. Model
CMF-SDP
is
recommended.
C
OM
PL
IA
LE
AD
F
RE
E
CMF-SD Series - Telecom CPTC Resettable Fuses
Time to
Trip @
Imax / 230
VAC
Seconds
<4.5
<
0.3
<
0.3
<
0.2
<
0.2
<
0.2
<
0.2
<
0.1
<
0.1
<
0.1
<
0.1
Electrical Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Model
CMF-SD10
CMF-SD25
CMF-SD25-10
CMF-SD35
CMF-SD35-10
CMF-SD35A
CMF-SD35A-10
CMF-SD50
CMF-SD50-10
CMF-SD50A
CMF-SD50A-10
Induction
Voltage
Withstand
VAC
600
600
600
600
600
600
600
600
600
600
600
Rated
Voltage
Volts
220
230
220
230
230
230
230
230
230
230
230
Rated
Resistance
(RN) @ 25°C
Ohms Tolerance
10
±20 %
25
±20 %
25
±10 %
35
±20 %
35
±10 %
35
±20 %
35
±10 %
50
±20 %
50
±10 %
50
±20 %
50
±10 %
Resistance
Matching in
Housing
Ohms
±1.0
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
± 0.5
Hold
Current
Amps @ 25 °C
0.150
0.130
0.130
0.100
0.100
0.100
0.100
0.090
0.090
0.090
0.090
Trip
Current
Amps @ 25 °C
0.360
0.260
0.260
0.200
0.200
0.200
0.200
0.190
0.190
0.190
0.190
Imax @
230 VAC
Amps
1
2.8
2.5
3
3
2.5
2.5
3
3
3
3
Test Procedures And Requirements For Model CMF-SD Series
Primary
Test
Protection
Test Condition
Requirements
Mains Power Contact - ITU-T K.20, K.21.... None .............. 230 V rms, 10 ohms, 15 Min. .....................................................(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. .....(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21 ............ GDT................ 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ........(Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700
μs,
25 ohms, 1.0 kV, 10 Tests, every 1 Min. .................(Ri-Rf) / Ri < ±10 %
Lightning Surge ................................................................... 10/1000
μs,
40 ohms, 1.0 kV, 30 Tests, every 3 Min. ................(Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R final
Typical Part Marking
How to Order
Represents total content. Layout may vary.
PART
IDENTIFICATION:
10 = CMF-SD10
25 = CMF-SD25
35 = CMF-SD35
50 = CMF-SD50
35A = CMF-SD35A
50A = CMF-SD50A
25K = CMF-SD25-10
35K = CMF-SD35-10
50K = CMF-SD50-10
35AK = CMF-SD35A-10
50AK = CMF-SD50A-10
MANUFACTURER'S
TRADEMARK
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
YEAR CODE:
6 = 2016
CMF - SD 35 A -10 - 2
Product Designator
Style
SD = Surface Mount Dual Pkg.
Rated Resistance (RN)
10, 25, 35, 50 (25, 35, 50 Ohms)
Reduced Footprint and Height
Option*
Resistance Tolerance Option
Blank = Standard (20 %)
-10 = 10 %
Packaging Options
- 2 = Tape & Reel
*Reduced footprint and height option currently
unavailable for Model CMF-SD25.
3 5 6G
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
F
Applications
Used as a secondary overcurrent protection
device in:
n
Customer Premise Equipment (CPE)
n
Central Office (CO)
n
Access equipment
A
E
D
E
D
C
C
CMF-SD Series - Telecom CPTC Resettable Fuses
B
H
Product Dimensions
A
F
G
B
Recommended Pad Layout
Dim.
B
H
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
9.00
MAX.
(.354)
10.80
(.425) MAX.
10.20
(.402) MAX.
4.88 - 5.28
(.192 - .208)
2.41 - 2.61
(.095 - .103)
0.5
(.020) MAX.
2.5
(.098)
1.0
(.039)
1
B
2
2
G
F
G
D
D
E
E
F
CMF-SD35A
CMF-SD50A
7.15
MAX.
(.281)
8.50
(.355) MAX.
8.10
(.319) MAX.
3.25 - 3.65
(.128 - .144)
2.41 - 2.61
(.095 - .103)
0.5
(.020) MAX.
2.5
(.098)
1.0
(.039)
A
A
1
3
3
C
H
C
H
A
B
4
4
F
G
E
C
D
C
DIMENSIONS:
MM
(INCHES)
0.15
(.006)
D
COPLANARITY:
(Reduced value available on request.)
Packaging Options - Tape and Reel:
E
F
G
H
1
1
3
3
2
2
4
4
CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 =
400 pcs. per
E
reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
B
D
C
1
Solder Reflow Recommendations
2
300
250
200
B
150
100
50
0
Dim.
A
B
C
D
E
A
Preheating
3
4
Soldering
F
G
Cooling
Temperature (ϒ
C)
C
H
D
E
1
2
G
1
4
160–220
D
E
10–20
Time (seconds)
120
A
3
F
2
F
G
H
C
H
3
4
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
10.0
(.394)
8.80
(.346)
3.20
(.126)
2.00
(.079)
2.60
(.102)
5.00
(.197)
7.60
(.299)
10.0
(.394)
DIMENSIONS:
CMF-SD35A
CMF-SD50A
8.00
(.315)
7.05
(.278)
2.75
(.108)
2.00
(.079)
2.51
(.099)
3.45
(.136)
5.95
(.234)
8.15
(.321)
MM
(INCHES)
Solder reflow
•
•
1
•
•
•
Devices are not designed to be wave soldered to the bottom side of the
board.
Gluing the devices is not recommended.
2
Recommended reflow methods: IR, vapor phase oven, hot air oven.
Recommended maximum paste thickness is 0.25 mm (.010 inch).
4
3
Note:
•
Devices can be cleaned using standard industry methods and solvents.
Rework
•
If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
A device should not be reworked.
CMF-SD SERIES, REV. P, 03/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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