USBLC6-2SC6Y
Automotive very low capacitance ESD protection
Datasheet
production data
Features
■
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2 data lines protected
Protects V
BUS
Very low capacitance: 2.5 pF
Very low leakage current: 10 nA
SOT23-6L package
RoHS compliant
AEC-Q101 qualified
I/O1
1
1
6
SOT23-6L
USBLC6-2SC6Y(JEDEC MO178AB)
Figure 1.
Functional diagram
Benefits
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I/O1
Very low capacitance between lines to GND for
optimized data integrity and speed
Low PCB space consumption
Enhanced ESD protection. ISO10605 up to
25 kV guaranteed at device level
ESD protection of V
BUS
High reliability offered by monolithic integration
Fast response time
Consistent D+ / D- signal balance:
– Very low capacitance matching tolerance
I/O to GND = 0.015 pF
– Compliant with USB 2.0 requirements
GND
2
5
V
BUS
I/O2
3
4
I/O2
Applications
■
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USB 2.0 ports up to 480 Mb/s (high speed)
Compatible with USB 1.1 low and full speed
High-speed datalines in smart junction boxes
Ethernet port: 10/100 Mb/s
Video line protection
Complies with the following standards
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Description
The USBLC6-2SC6Y is a monolithic device
dedicated to ESD protection of high speed
interfaces, such as USB 2.0, Ethernet links and
video lines.
The very low line capacitance secures a high level
of signal integrity without compromising in
protecting sensitive chips against the most
stringent characterized ESD strikes.
ISO10605: C = 150 pF, R = 330
– 25 kV (air discharge)
– 15 kV (contact discharge)
ISO10605: C = 330 pF, R = 330
– 15 kV (air discharge)
– 15 kV (contact discharge)
ISO7637-3
– Pulse 3a: Vs = -150 V
– Pulse 3b: Vs = +100 V
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TM:
Transil is a trademark of STMicroelectronics
September 2012
This is information on a product in full production.
Doc ID 023201 Rev 2
1/9
www.st.com
9
Characteristics
USBLC6-2SC6Y
1
Characteristics
Table 1.
Symbol
Absolute ratings
Parameter
ISO 10605 (C = 150 pF, R = 330
):
Air discharge
Contact discharge
ISO 10605 (C = 300 pF, R = 330
):
Air discharge
Contact discharge
Value
Unit
V
PP(1)
Peak pulse voltage
25
15
15
15
-55 to +150
-40 to +150
260
kV
T
stg
T
j
T
L
Storage temperature range
Operating junction temperature range
Lead solder temperature (10 seconds duration)
°C
°C
°C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2.
Electrical characteristics (definitions)
I
I
F
Symbol
V
BR
=
I
RM
=
V
RM
=
I
PP
=
C
LINE
=
Parameter
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Peak pulse current
Line capacitance
V
F
V
CL
V
BR
V
RM
I
RM
V
Slope: 1/R
d
I
PP
Table 2.
Symbol
I
RM
V
BR
V
F
Electrical characteristics (T
amb
= 25 °C)
Parameter
Leakage current
Breakdown voltage between V
BUS
and GND
Forward voltage
Test conditions
V
RM
= 5.25 V
I
R
= 1 mA
I
F
= 10 mA
I
PP
= 1 A, 8/20 µs
Any I/O pin to GND
6
1.1
12
17
2.5
V
R
= 1.65 V
0.015
1.2
V
R
= 1.65 V
0.04
1.7
pF
3.5
pF
Min.
Typ.
10
Max.
150
Unit
nA
V
V
V
V
V
CL
Clamping voltage
I
PP
= 5 A, 8/20 µs
Any I/O pin to GND
Capacitance between I/O and GND
Interline capacitance matching
between I/O and GND
Capacitance between I/O
Interline capacitance matching
between I/O
C
i
/o-GND
C
i
/o-GND
C
i/o-i/o
C
i/o-i/o
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Doc ID 023201 Rev 2
USBLC6-2SC6Y
Characteristics
Figure 3.
C(pF)
3.0
Capacitance versus voltage
(typical values)
Figure 4.
C(pF)
2.8
Line capacitance versus frequency
(typical values)
2.5
CO = I/O - GND
F = 1MHz
VOSC = 30mVRMS
Tj = 25°C
Cj = I/O - I/O
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
2.0
VOSC = 30mVRMS
Tj = 25°C
VLINE = 0 V to 3.3 V
1.5
1.0
0.5
0.4
Data line voltage (V)
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.2
0.0
1
10
F(MHz)
100
1000
Figure 5.
Relative variation of leakage
current versus junction
temperature (typical values)
Figure 6.
Frequency response
I
RM
[T
j
] / I
RM
[T
j
=25°C]
100
V
BUS
=5V
0.00
S21(dB)
-5.00
-10.00
10
-15.00
T
j
(°C)
1
25
50
75
100
125
-20.00
100.0k
1.0M
F(Hz)
10.0M
100.0M
1.0G
Figure 7.
ESD response to ISO10605,
C= 150 pF, R = 330
(+15
kV air
discharge)
Figure 8.
ESD response to ISO10605,
C = 150 pF, R = 330
(-15
kV air
discharge)
Vin
Vin
Vout
Vout
ESD SURGE
TEST BOARD
IN
OUT
USBLC6-2SC6
ESD SURGE
TEST BOARD
IN
OUT
USBLC6-2SC6
+5 V
+5 V
Doc ID 023201 Rev 2
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Application and design guidelines
Figure 9.
Analog crosstalk results
dB
0.00
USBLC6-2SC6Y
- 30.00
- 60.00
- 90.00
F (Hz)
- 120.00
100.0k
1.0M
10.0M
100.0M
1.0G
2
Application and design guidelines
More information is available in the STMicroelectronics Application note AN2689,
“Protection of automotive electronics from electrical hazards, guidelines for design and
component selection”.
3
Ordering information scheme
Figure 10. Ordering information scheme
USB
LC
6 - 2
SC6 Y
Product designation
Low capacitance
Breakdown voltage
6 = 6.1 V
Number of lines protected
2 = 2 lines
Package
SC6 = SOT23-6L
Automotive grade
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Doc ID 023201 Rev 2
USBLC6-2SC6Y
Package information
4
Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Table 3.
SOT23-6L dimensions
Dimensions
Ref.
Millimeters
Min.
c
Inches
Min.
Typ.
Max.
0.057
0.006
0.051
0.020
0.008
0.118
0.069
0.037
Typ.
Max.
A1
θ
A
A1
A2
b
0.90
0
0.90
0.30
0.09
2.80
1.50
0.95
2.60
0.30
0°
1.45 0.035
0.15
0
L
H
A
E
1.30 0.035
0.50 0.012
0.20 0.004
3.05
0.11
e
D
b
c
D
e
E
e
1.75 0.059
A2
H
L
3.00 0.102
0.60 0.012
10°
0°
0.118
0.024
10°
Figure 11. SOT23-6L footprint
0.60
1.20
3.50
2.30
0.95
1.10
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