USBULC6-2N4
Ultralow capacitance ESD protection for high speed interface
Features
■
■
■
■
■
2-line TVS diodes
Ultralow capacitance 0.6 pF typ.
1.0 x 0.8 mm package
0.4 mm pitch
Lead-free package
µQFN-4L
Benefits
■
■
■
■
Flow-through layout
Easy to implement
Low profile: 0.55mm height max
Very low PCB space: only 0.8 mm²
GND
Figure 1.
Configuration (top view)
Complies with following standards
■
I/O1
I/O2
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
NC
NC
Applications
Where transient over-voltage protection in ESD
sensitive equipment is required, such as:
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■
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Computers
Printers
Communication systems
Cellular phone handsets and accessories
Video equipment
Figure 2.
Application diagram
I/O2
NC
I/O1
Description
The USBULC6-2N4 is a monolithic application
specific discrete device dedicated to ESD
protection of high speed data buses.
The device is available in the µQFN-4L package.
Mini - USB Connector
USBULC6
-
2N4
September 2011
Doc ID 18332 Rev 1
NC
USB
Transceiver
1/10
www.st.com
10
Characteristics
USBULC6-2N4
1
Table 1.
Symbol
Characteristics
Absolute maximum ratings T
amb
= 25 °C
Parameter
ESD discharge IEC 61000-4-2, level 4
Contact discharge
Air discharge
Peak pulse current (8/20 µs)
Peak pulse power dissipation (8/20 µs)
Operating temperature range
Storage temperature range
Maximum lead temperature for soldering during 10 s
Value
Unit
V
PP
I
pp
P
pp
T
j
T
stg
T
L
12
15
4
50
-40 to + 150
-65 to +150
260
kV
A
W
°C
°C
°C
Table 2.
Symbol
V
BR
I
RM
C
V
CL
Electrical characteristics T
amb
= 25 °C, otherwise specified
Parameter
LV diode breakdown voltage
LV diode leakage current
LV diode input capacitance
LV diode clamping voltage
Test conditions
I
R
= 1 mA
V
RM
= 3 V
V
R
= 0 V, F= 240 MHz to 3 GHz
Any I/O pin to ground
I
PP
= 1 A, t
p
= 8/20 µs
Any I/O pin to ground
0.6
Min.
6
100
0.75
10
Typ.
Max.
Unit
V
nA
pF
V
Figure 3.
Junction capacitance versus frequency ( V
R
= 0 V, typical values)
1.00
C(pF)
F=1MHz – 3GHz
V
osc
=30mV
RMS
Vr=0V
T
j
=25 °C
A1/GND
A2/GND
0.75
0.50
0.25
F(MHz)
0.00
0
250
500
750 1000 1250 1500 1750 2000 2250 2500 2750 3000
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Doc ID 18332 Rev 1
USBULC6-2N4
Figure 4.
Characteristics
Variation of leakage current versus junction temperature (typical values)
100.00
I
R
(nA)
V
R
=V
RM=
3V
A1/GND
A2/GND
1.00
T
j
(°C)
0.01
25
50
75
100
125
150
Figure 5.
Attenuation measurement
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
300k
1M
3M
IO1
10M
30M
S21 (dB)
F (Hz)
100M 300M 1G
IO2
3G
Figure 6.
Eye diagram PCB only
400 mV amplitude, F = 480 Mbps
Figure 7.
Eye diagram PCB + USBULC6-2N4
400 mV amplitude, F = 480 Mbps
Doc ID 18332 Rev 1
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Ordering information scheme
USBULC6-2N4
Figure 8.
ESD response to IEC 61000-4-2
(+8 kV contact discharge) on one
output V
(OUT)
and one input V
(IN)
Figure 9.
ESD response to IEC 61000-4-2
(-8 kV contact discharge) on one
output V
(OUT)
and one input V
(IN)
20 V/div
20 V/div
20 ns/div
20 ns/div
2
Ordering information scheme
Figure 10. Ordering information scheme
USB
USB protection
Ultra low capacitance
Breakdown voltage
6=6V
Number of lines
2 = 2 lines
Package
N4 = µQFN-4L
ULC
6
–
2
N4
4/10
Doc ID 18332 Rev 1
USBULC6-2N4
Package information
3
Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Table 3.
µQFN-
4L
dimensions
Dimensions
Ref.
Millimeters
Min.
Typ.
0.50
0.02
0.20
0.80
0.6
0.40
1.00
0.20
0.20
0.20
Max.
0.55
0.05
0.25
0.85
0.65
0.45
1.05
0.25
0.23
0.25
Min.
Inches
Typ.
Max.
Side
view
A1
D
D2
e
A
A
A1
b
D
0.45
0.00
0.15
0.75
0.55
0.35
0.95
0.15
0.17
0.15
0.018 0.020 0.022
0.000 0.001 0.002
0.006 0.008 0.010
0.030 0.031 0.033
0.022 0.024 0.026
0.014 0.016 0.018
0.037 0.039 0.041
0.006 0.008 0.010
0.007 0.008 0.009
0.006 0.008 0.010
Bottom
view
E
L
b
k
E2
D2
e
E
E2
k
L
Figure 11. Footprint recommendations
(dimensions in mm)
0.4
Figure 12. Marking
0.4
0.2
1.4
0.6
0.2
Pin 1
1
0.6
Note:
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Doc ID 18332 Rev 1
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