capacitance dual unidirectional high-speed surge protection components designed to
protect against faults caused by short circuits, AC power cross, induction and lightning
surges.
The TBU-DT series is a unidirectional TBU
®
device; the TBU
®
protector will trip in less
than 1
ms
when the current reaches the maximum value in one direction only, that is when
Pin 1 is positive in voltage with respect to Pin 2, and Pin 4 is positive with respect to Pin 3.
No current limiting exists in the opposite polarity, and the TBU
®
device appears as resis-
tive in nature. The reverse current should not exceed the maximum trigger current level of
the TBU
®
device. An external diode may be used to prevent reverse current in DC biased
applications.
The TBU
®
protector blocks surges and provides an effective barrier behind which sensitive
electronics will not be exposed to large voltages or currents during surge events. After the
surge, the TBU
®
device resets when the voltage across the TBU
®
device falls to the V
reset
level. The TBU
®
device will automatically reset on lines which have no DC bias or have
DC bias below Vreset (such as unpowered signal lines).
The TBU
®
device is provided in a surface mount DFN package and meets industry
standard requirements such as RoHS and Pb Free solder reflow profiles.
Line Side
1
2
Load Side
Line Side
4
3
Load Side
TBU
®
Device
Agency Listing
UL
File Number: E315805
Description
Absolute Maximum Ratings (@ T
A
= 25 °C Unless Otherwise Noted)
Symbol
V
imp
V
rms
T
op
T
stg
Parameter
Peak impulse voltage withstand with duration less than 10 ms
Continuous A.C. RMS voltage
Operating temperature range
Storage temperature range
Part Number
TBU-DT065-xxx-WH
TBU-DT085-xxx-WH
TBU-DT065-xxx-WH
TBU-DT085-xxx-WH
Value
650
850
300
425
-40 to +125
-65 to +150
Unit
V
V
°C
°C
Electrical Characteristics (@ T
A
= 25 °C Unless Otherwise Noted)
Symbol
I
trigger
Parameter
Current required for the device to go from operating state to
protected state
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 650 V
V
imp
= 850 V
V
imp
= 850 V
V
imp
= 850 V
V
imp
= 850 V
I
trigger
(min.) =
I
trigger
(min.) =
I
trigger
(min.) =
I
trigger
(min.) =
I
trigger
(min.) =
I
trigger
(min.) =
I
trigger
(min.) =
I
trigger
(min.) =
100 mA
200 mA
300 mA
500 mA
100 mA
200 mA
300 mA
500 mA
Part Number
TBU-DTxxx-100-WH
TBU-DTxxx-200-WH
TBU-DTxxx-300-WH
TBU-DTxxx-500-WH
TBU-DT065-100-WH
TBU-DT065-200-WH
TBU-DT065-300-WH
TBU-DT065-500-WH
TBU-DT085-100-WH
TBU-DT085-200-WH
TBU-DT085-300-WH
TBU-DT085-500-WH
-0.5
0.25
10
0.50
14
116
96
Min.
100
200
300
500
Typ.
150
300
450
750
8.5
5.6
4.6
4.0
10.3
7.4
6.5
5.8
Max.
200
400
600
1000
10.0
6.6
5.6
4.8
12.1
8.7
7.7
6.9
+0.5
1
1.00
18
Unit
mA
R
device
Series resistance of
the TBU
®
device
Ω
R
match
t
block
I
Q
V
reset
R
th(j-l)
R
th(j-l)
Package resistance matching of the TBU
®
device #1 - TBU
®
device #2
Time for the device to go from normal operating state to protected state
Current through the triggered TBU
®
device with 50 Vdc circuit voltage
Voltage below which the triggered TBU
®
device will transition to normal operating state
Junction to package pads - FR4 using recommended pad layout
Junction to package pads - FR4 using heat sink on board (6 cm
2
)
Ω
µs
mA
V
°C/W
°C/W
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-DT Series - TBU
®
High-Speed Protectors
Load Side
Line Side
OVP
Environmental Characteristics
Parameter
Moisture Sensitivity Level
ESD Classification (HBM)
Load Side
OVP
Line Side
Value
1
1B
TBU
Reference Application
™
Device
The TBU
®
device can be used to protect against excessive
voltage surges in transformer coupled equipment, as shown in
the figure below. The TBU
®
protector prevents any surges from
causing damage. An overvoltage protection device, such as an
MOV or GDT, may be used to provide additional overvoltage
protection if the surge voltage is likely to be above the maximum
rating of the TBU
®
device.
Basic TBU Operation
The TBU
®
device is a silicon-based, solid-state, resettable
device which is placed in series with a signal path. The TBU
®
device operates in approximately 1 µs - once line current
exceeds the TBU
®
device’s trigger
current I
trigger
. When
operated, the TBU
®
device will limit the current to less than the
I
trigger
value within the t
block
duration. If voltage above V
reset
is continuously sustained, the TBU
®
device will subsequently
reduce the current to a quiescent current level within a period of
time that is dependent upon the applied voltage.
After the surge, the TBU
®
device resets when the voltage
across the TBU
®
device falls to the V
reset
level. The TBU
®
device will automatically reset on lines which have no DC bias
or have DC bias below V
reset
(such as unpowered signal lines).
If the line has a normal DC bias above V
reset
, the voltage
across the TBU
®
device may not fall below V
reset
after the
surge. In such cases, special care needs to be taken to ensure
that the TBU
®
device will reset, otherwise an automatic or
manual power down will be required. Bourns application
engineers can provide further assistance.
1
2
Line
Side
OVP
OVP
Load
4
3
TBU
®
Device
Performance Graphs
V-I Characteristic - TBU-DT085-300-WH
(Pin 2-1 & Pin 3-4)
ITRIP
Typical Trigger Current vs. Temperature
1.8
Normalized Trip Current
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25 50
75 100 125 150
CURRENT
(100 mA/div.)
VRESET
VOLTAGE
(5 v/div.)
Junction Temperature (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-DT Series - TBU
®
High-Speed Protectors
Performance Graphs (Continued)
Power Derating Curve
3.0
2.5
Typical Resistance vs. Temperature
No additional PCB Cu (1 TBU
®
Protector)
0.5 sq. in. additional PCB CU (1 TBU
®
Protector)
No additional PCB Cu (2 TBU
®
Protectors)
0.5 sq. in. additional PCB CU (2 TBU
®
Protectors)
K
J
K
E
F
E
J
2.2
Normalized Resistance
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.70
(.028)
2.625
(.103)
1.15
(.045)
Total Max. Power (W)
2.0
1.5
1.0
A
B
C
N
3
2
1
0.5
0.0
H
3.55
(.140)
20
PIN 1
40
60
D
80
100
120
140
N
0.2
0.0
-75 -50 -25
0
25
50 75 100 125 150
TOP VIEW
Ambient Temperature (°C)
SIDE VIEW
BOTTOM VIEW
Junction Temperature (°C)
Reflow Profile
Profile Feature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-DT Series - TBU
®
High-Speed Protectors
3312 - 2 mm SMD Trimming Potentiometer
Product Dimensions
0.75
(.030)
5.00 ± 0.10
(.197 ± .004)
0.60
(.024)
3.05
(.120)
0.70
(.028)
5.00 ± 0.10
(.197 ± .004)
XXXXX
YWWLL
PIN 1 & BACKSIDE CHAMFER
A=
0.80 - 1.00
(.031 - .039)
SYMMETRY
0.35
(.014)
1.85
(.073)
C
0.25
PIN 1
(.010)
SEATING PLANE
A1 = 0.00 - 0.05
(.000 - .002)
DIMENSIONS:
MM
(INCHES)
TBU
®
High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defined by a solder mask
which matches the pad layout of the TBU
®
device in size and spac-
ing. It is recommended that they should be the same dimension as
the TBU
®
pads but if smaller solder pads are used, they should be
centered on the TBU
®
package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU
®
pad sizes
to ensure adequate clearance is maintained. The recommended
Recommended Pad Layout
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad
size. Extended copper areas beyond the solder pad significantly
improve the junction to ambient thermal resistance, resulting in
operation at lower junction temperatures with a corresponding
benefit of reliability. All pads should soldered to the PCB, includ-
ing pads marked as NC or NU but no electrical connection should
be made to these pads. For minimum parasitic capacitance, it is
recommended that signal, ground or power signals are not routed
beneath any pad.
Thermal Resistance vs. Additional PCB Cu Area
120
3
4
Pad #
1
2
3
4
Pin Out
Line Side 1
Line Load 1
Line Load 2
Line Side 2
Thermal Resistance to Ambient (°C/W)
Pad Designation
100
Typical RTH (Power in 1 TBU
®
Device)
Typical RTH (Equal Power in Both TBU
®
Devices)
80
2
1
60
40
Dark grey areas show added PCB copper area for better
thermal resistance.
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Added Cu Area (Sq. In.)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-DT Series - TBU
®
High-Speed Protectors
3312 - 2 mm SMD Trimming Potentiometer
How to Order
Typical Part Marking
TBU - DT 065 - 500 - WH
Series
DT = Dual Uni-Series
Impulse Voltage Rating
065 = 650 V
085 = 850 V
Trigger Current
100 = 100 mA
200 = 200 mA
TBU Product
®
MANUFACTURER’S TRADEMARK
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
Package Suffix
H = DFN Package
300 = 300 mA
500 = 500 mA
XXXXX
YWWLL
PIN 1
5 DIGIT PRODUCT CODE:
• 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY:
T = TBU-DT SERIES
• 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE.
• 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT.
MANUFACTURING
DATE CODE:
• 1ST DIGIT INDICATES THE YEAR.
• 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER.
• 4TH & 5TH DIGITS INDICATE LOT CODE.
Packaging Specifications
P0
B
t
D
P2
E
A
D
C
F
N
W
XXXXX
YWWLL
B0
K0
R
A0
P
D1
EMBOSSMENT
G (MEASURED AT HUB)
The type of corner on carrier will vary at different assembly sites.
USER DIRECTION OF FEED
DIMENSIONS:
MM
(INCHES)
QUANTITY: 3000 PIECES PER REEL
Min.
326
(12.835)
Min.
5.15
(.203)
Min.
1.0
(.039)
Min.
11.7
(.461)
A0
A
Max.
330
(13.002)
Min.
1.5
(.059)
Min.
5.15
(.203)
Min.
7.9
(.311)
B0
B
Max.
2.5
(.098)
Min.
1.5
(.059)
Min.
3.8
(.150)
D
Min.
12.8
(.504)
Max.
1.6
(.063)
Max.
4.2
(.165)
C
Max.
13.5
(.531)
Min.
1.5
(.059)
Min.
1.95
(.077)
D1
Min.
20.2
(.795)
Max.
-
P2
Max.
2.05
(.081)
D
Max.
-
E
G
Ref.
16.5
(.650)
Max.
1.85
(.073)
Max.
0.5
(.020)
Min.
5.45
(.214)
Min.
0.25
(.010)
F
N
Ref.
102
(4.016)
max.
5.55
(.218)
Max.
0.35
(.014)
Max.
5.35
(.211)
Max.
1.2
(.047)
Max.
12.3
(.484)
Max.
5.35
(.211)
Max.
8.1
(.319)
MM
(INCHES)
Min.
1.65
(.065)
Min.
0
(0)
K0
P
P0
R
t
W
DIMENSIONS:
REV. 03/18
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
国际半导体设备材料产业协会（SEMI）昨（10）日公布半导体设备资本支出的年中预测报告（SEMI Capital Equipment Forecast），预估2012年全球半导体设备营收规模将达到423.8亿美元，2013年将成长至467.1亿美元。
受惠平板电脑、智慧型手机与行动装置等消费性电子商品亮丽表现，半导体设备的采购需求仍将持续。SEMI在报告中指出，2011年半...[详细]
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