DUAL OP-AMP, 3000 uV OFFSET-MAX, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.003 µA |
| 25C 时的最大偏置电流 (IIB) | 0.002 µA |
| 标称共模抑制比 | 100 dB |
| 频率补偿 | NO |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 低-偏置 | NO |
| 低-失调 | NO |
| 微功率 | YES |
| 负供电电压上限 | -20 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 功率 | NO |
| 电源 | +-5/+-20 V |
| 可编程功率 | NO |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 4.191 mm |
| 最大压摆率 | 0.6 mA |
| 供电电压上限 | 20 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最小电压增益 | 25000 |
| 宽带 | NO |
| 宽度 | 7.62 mm |
| LH2108D/883B | LH2108A | LH2108AD/883B | LH2108AD | LH2108D | LH2108A/883B | |
|---|---|---|---|---|---|---|
| 描述 | DUAL OP-AMP, 3000 uV OFFSET-MAX, CDIP16 | DUAL OP-AMP, 1000 uV OFFSET-MAX, CDIP16 | DUAL OP-AMP, 1000 uV OFFSET-MAX, CDIP16 | DUAL OP-AMP, 1000 uV OFFSET-MAX, CDIP16 | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP16 | DUAL OP-AMP, 1000 uV OFFSET-MAX, CDIP16 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - |
| 零件包装代码 | DIP | - | DIP | DIP | DIP | - |
| 包装说明 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | - |
| 针数 | 16 | - | 16 | 16 | 16 | - |
| Reach Compliance Code | compli | - | unknow | unknow | unknow | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| 放大器类型 | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - |
| 架构 | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - |
| 最大平均偏置电流 (IIB) | 0.003 µA | - | 0.003 µA | 0.003 µA | 0.003 µA | - |
| 25C 时的最大偏置电流 (IIB) | 0.002 µA | - | 0.002 µA | 0.002 µA | 0.002 µA | - |
| 标称共模抑制比 | 100 dB | - | 110 dB | 110 dB | 100 dB | - |
| 频率补偿 | NO | - | NO | NO | NO | - |
| 最大输入失调电压 | 3000 µV | - | 1000 µV | 1000 µV | 3000 µV | - |
| JESD-30 代码 | R-CDIP-T16 | - | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | - |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | - |
| 低-偏置 | NO | - | NO | NO | NO | - |
| 低-失调 | NO | - | NO | NO | NO | - |
| 微功率 | YES | - | YES | YES | YES | - |
| 负供电电压上限 | -20 V | - | -20 V | -20 V | -20 V | - |
| 标称负供电电压 (Vsup) | -15 V | - | -15 V | -15 V | -15 V | - |
| 功能数量 | 2 | - | 2 | 2 | 2 | - |
| 端子数量 | 16 | - | 16 | 16 | 16 | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
| 封装代码 | DIP | - | DIP | DIP | DIP | - |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | DIP16,.3 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 功率 | NO | - | NO | NO | NO | - |
| 电源 | +-5/+-20 V | - | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | - |
| 可编程功率 | NO | - | NO | NO | NO | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 4.191 mm | - | 4.191 mm | 4.191 mm | 4.191 mm | - |
| 最大压摆率 | 0.6 mA | - | 0.6 mA | 0.6 mA | 0.6 mA | - |
| 供电电压上限 | 20 V | - | 20 V | 20 V | 20 V | - |
| 标称供电电压 (Vsup) | 15 V | - | 15 V | 15 V | 15 V | - |
| 表面贴装 | NO | - | NO | NO | NO | - |
| 技术 | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR | - |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 最小电压增益 | 25000 | - | 40000 | 40000 | 25000 | - |
| 宽带 | NO | - | NO | NO | NO | - |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | - |
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