Technical Data
4349
Effective January 2016
Supersedes November 2008
HCP0805
High current power inductors
Applications
•
•
•
•
•
•
Multi-phase regulators
Voltage Regulator Modules (VRMs)
Distributed power systems DC-DC converters
Desktop and server VRMs and EVRDs
Point-of-Load (POL) modules
Field Programmable Gate Array (FPGA) DC-DC
converters
Battery power systems
High current power supplies
Data networking and storage systems
•
•
•
Product description
•
•
•
•
•
•
High current carrying capacity
Magnetically shielded, low EMI
Frequency range up to 2MHz
Inductance range from 0.40uH to 2.2uH
Current range from 10 to 32 amps
7.9 x 7.6 mm footprint surface mount package
in a 5.0mm height
Iron powder core material
Halogen free, lead free, RoHS compliant
Environmental data
•
Storage temperature range (Component):
-40°C to +125°C
Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
Solder reflow temperature: J-STD-020D
compliant
•
•
•
•
Pb
HF
FREE
HALOGEN
Technical Data
4349
Effective January 2016
HCP0805
High current power inductors
Product specifications
OCL
1
(uH) ±20%
FLL
2
(uH) minimum
I
rms3
(amps)
I
sat4
(amps)
DCR (mΩ)
±6.0% @ 20°C
Part Number
6
K-factor
5
HCP0805-R40-R
HCP0805-R68-R
HCP0805-1R0-R
HCP0805-1R5-R
HCP0805-2R2-R
0.40
0.68
1.0
1.5
2.2
0.26
0.44
0.64
0.96
1.41
20
17.5
14.5
13.3
10
32
25
22
18
14
3.1
4.5
5.8
6.8
11.2
376
292
239
202
175
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc @ +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.10Vrms, @ Isat, @ +25°C
3. I
rms
: DC current for an approximate temperature rise of 40°C without core loss. Derating is neces-
sary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat
generating components will affect the temperature rise. It is recommended that the temperature
of the part not exceed 125°C under worst case operating conditions verified in the end application.
4. I
sat
: Peak current for approximately 20% rolloff @ +25°C
5. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p:(Gauss),
K: (K factor from table), L: (Inductance in μH),
∆I
(Peak to peak ripple current in Amps).
6. Part number definition: HCP0805-xxx-R
HCP0805 = Product code and size
XXX = Inductance value in uH, R = decimal point,
If no R is present then last character equals number of zeroes
-R suffix indicates RoHS compliant
Dimensions (mm)
Dimensions
Part marking:HCP0805, XXX= Inductance value in uH, R=decimal point,
If no R is present then last character equals number of zeros
wwllyy = date code, R = revision level
Tolerances are ±0.25 millimeters unless stated otherwise
PCB tolerances are ±0.1 millimeters unless stated otherwise
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
Part Number
A (mm)
B (mm)
HCP0805-R40-R
HCP0805-R68-R
HCP0805-1R0-R
HCP0805-1R5-R
HCP0805-2R2-R
1.3 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
0.8 ±0.2
1.70
1.50
1.50
1.50
1.20
2
www.eaton.com/elx
HCP0805
High current power inductors
Packaging information (mm)
Supplied in tape and reel packaging, 700 parts per 13” diameter reel.
Technical Data
4349
Effective January 2016
Temperature rise vs. total loss
60
50
Temperature Rise (°C)
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
Total Loss (W)
www.eaton.com/elx
3
Technical Data
4349
Effective January 2016
HCP0805
High current power inductors
Core loss vs B
p-p
100
1MHz
500kHz
300kHz
200kHz
100kHz
10
Core Loss (W)
1
0.1
0.01
0.001
100
1000
B
p-p
(Gauss)
10000
Inductance characteristics
% of OCL vs. % of Isat
110%
100%
90%
80%
% of OCL
70%
60%
50%
40%
30%
20%
10%
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
180%
200%
% of Isat
4
www.eaton.com/elx
HCP0805
High current power inductors
Solder reflow profile
Technical Data
4349
Effective January 2016
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2016 Eaton
All Rights Reserved
Printed in USA
Publication 4349 BU-MC16003
January 2016
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
