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WBC-B0202AG-03-1821-F

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
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WBC-B0202AG-03-1821-F概述

Resistor Networks & Arrays

WBC-B0202AG-03-1821-F规格参数

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制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

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Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
近期在做一个温湿度传感器采集,用1602液晶显示,在网上找了一个程序,一直读不到数.
/*2015-11-15*/ #ifndef __TOU_H__ #define __TOU_H__ #include #include //#include //Keil library sbit d=P1^5; #define uint unsigned int #define uchar unsigned c ......
18811707971 DIY/开源硬件专区
谁知道这个问题啊
GPRS传输的都有哪些芯片 ...
hanwenli123 微控制器 MCU
关于在Wince6.0的Bootloader中实现SD卡下载image的问题
小弟正在将wince5.0升级到6.0,其中在Bootloader中要实现SD卡下载image。硬件平台是pxa270。 现在遇到一个奇怪的问题,5.0下完全OK的关于SD downlaod的代码,不做任何修改,移到6.0上,就是识 ......
lj1978 嵌入式系统
测试yaffs发现一个问题
在空闲空间比较小的情况下,比如根分区59MB,剩余4600kB, 拷贝一个4000kB的文件(剩余600kB)此时yaffs会报错, 再重启,就不行了,他就认为有很多坏块。 kernel 2.6.19 nand samsun ......
didi111 嵌入式系统
电磁兼容工程师设计大讲坛
很好的资料,值得推荐!96621...
shenqing PCB设计
使用stm32定时器做微小时间计时
stm32定时器最高可达72M,但是我发现定时器中断频率太高会影响其他程序运行,我想使精度最大,请问怎么办?有遇到类似情况的么? ...
dlcnight stm32/stm8

 
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