电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TAZH685K035CBMD0945

产品描述Tantalum Capacitors - Solid SMD
产品类别无源元件   
文件大小382KB,共14页
制造商AVX
下载文档 详细参数 全文预览

TAZH685K035CBMD0945在线购买

供应商 器件名称 价格 最低购买 库存  
TAZH685K035CBMD0945 - - 点击查看 点击购买

TAZH685K035CBMD0945概述

Tantalum Capacitors - Solid SMD

TAZH685K035CBMD0945规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
AVX
产品种类
Product Category
Tantalum Capacitors - Solid SMD
电容
Capacitance
6.8 uF
电压额定值 DC
Voltage Rating DC
35 VDC
容差
Tolerance
10 %
ESR1.3 Ohms
外壳代码 - in
Case Code - in
2815
外壳代码 - mm
Case Code - mm
7238
高度
Height
2.8 mm
制造商库存号
Mfr Case Code
H Case
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 125 C
长度
Length
7.24 mm
封装 / 箱体
Package / Case
2815 (7238 metric)
产品
Product
Tantalum Solid High Reliability
端接类型
Termination Style
SMD/SMT
类型
Type
Molded - E-Rel, COTS-Plus and Space Level
宽度
Width
3.81 mm
漏泄电流
Leakage Current
3 uA
电容-nF
Capacitance - nF
6800 nF
损耗因数 DF
Dissipation Factor DF
8
纹波电流
Ripple Current
0.34 A
单位重量
Unit Weight
0.012875 oz

文档预览

下载PDF文档
TAZ Series
CWR09 - MIL-PRF-55365/4
Established Reliability, COTS-Plus & Space Level
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF-
55365). In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MIL-
PRF-55365/4, and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or com-
pression bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
CASE DIMENSIONS:
Case
Length (L)
Width (W)
Height (H)
Code ±0.38 (0.015) ±0.38 (0.015) ±0.38 (0.015)
Term. Width (W
1
)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
3.30±0.13
(0.130±0.005)
2.67±0.13
(0.105±0.005)
3.68+0.13/-0.51
(0.145+0.005/-0.020)
1.0±0.10
(0.039±0.004)
millimeters (inches)
Term. Length (A)
+0.25/-0.13
(+0.010/-0.005)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
1.27 (0.050)
1.27 (0.050)
0.50 (0.020)
+0.30 (0.012)
-0.20 (0.008)
S min
0.38
(0.015)
1.65
(0.065)
2.92
(0.115)
1.65
(0.065)
2.92
(0.115)
3.43
(0.135)
3.56
(0.140)
4.06
(0.160)
0.71
(0.028)
Typical
Weight (g)
0.016
0.025
0.035
0.045
0.065
0.125
0.205
0.335
0.010
MARKING
(White marking on black body)
Polarity Stripe (+)
Capacitance Code
Rated Voltage
A
B
C
D
E
F
G
H
R
2.54 (0.100)
3.81 (0.150)
5.08 (0.200)
3.81 (0.150)
5.08 (0.200)
5.59 (0.220)
6.73 (0.265)
7.24 (0.285)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
2.54 (0.100)
2.54 (0.100)
3.43 (0.135)
2.79 (0.110)
3.81 (0.150)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.78 (0.070)
2.79 (0.110)
2.79 (0.110)
1.20 (0.047)
max
1.30 (0.051)
2.05 (0.081) +0.20 (0.008)
±0.20 (0.008) -0.10 (0.004)
CWR09 MIL-PRF-55365/4
CAPACITANCE AND RATED VOLTAGE, V
R
(VOLTAGE CODE) RANGE (LETTER DENOTES CASE SIZE)
Capacitance
μF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
4V (C)
6V (D)
10V (F)
Rated Voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
50V (N)
A
A
B
B
C
D
E
F
F
G
H
A
R
R
R
A
A/R
A
A/R
B
C
D
E
F
G
H
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
A
A
B
B
C
D
E
F
B
C
D
E
F
G
G
H
B
C
D
E
F
G
H
8
TMS320VC5509片内ADC采集
1. ADC采集比较简单,内部的10位的ADC,AIN0-AIN3的输入,主要是用的CSL的库函数#include <csl_adc.h> Uint32 adc_sample_value = 0; Uint16 samplestoraage={0,0}; unsigned ch ......
灞波儿奔 DSP 与 ARM 处理器
别小瞧负极电阻和负载电容,否则晶振会罢工
在硬件系统中,振荡电路担当着“系统脉搏”作用,需要在驱动能力、补偿电路、负载电容等方面下功夫。如果处理不当,晶体振荡器就发挥不到预期效果,甚至会发生不起振之类的“罢 ......
芯情观察猿 单片机
运放的速度指标Slew rate和Rise time的区别?
手头有NE5532、NE5534;还有OP07、OP27、OP37。 做激光测距,现在需要一个能做成跟随器的高速运放。 看了一些手册发现Slew rate和Rise time这两个指标应该是反映运放速度的。但不确定具体应该 ......
魔双月壁 模拟电子
【设计工具】MicroBlaze™ 支持实例之Xilkernel 实例
  本例详细描述了使用嵌入式开发套件实现的 Xilinx 嵌入式系统,展示了Microblaze 软处理器上的 Xilkernel 的特点。用于展示内核的硬件设计包含连到2个 XPS 定时器上的 MicroBlaze 处理器、UA ......
GONGHCU FPGA/CPLD
几本verilog的书大家看看啊(续)
1777817779还有一本夏宇闻的书因太大传不上想要和我联系书名是《Verilog数字系统设计教程【夏宇闻】.rar》...
zhangkai0215 FPGA/CPLD
电路求问
不知道电路图中 marking 3MS是什么器件? ...
Benedict 综合技术交流

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2233  2695  2576  1884  2749  35  48  33  46  34 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved