CM1426
LCD and Camera EMI Filter
Array with ESD Protection
Product Description
The CM1426 is a family of pi−style EMI filter arrays with ESD
protection, which integrates four, six and eight filters (C−R−C) in a
Chip Scale Package with 0.50 mm pad pitch. The CM1426 has
component values of 8.5 pF
−
100
W
−
8.5 pF per channel. The
CM1426 has a cut−off frequency of 230 MHz and can be used in
applications where the data rates are as high as 92 Mbps. The parts
include avalanche−type ESD diodes on every pin that provide a very
high level of protection for sensitive electronic components against
possible ESD strikes. The ESD protection diodes safely dissipate ESD
strikes of
±8
kV, well beyond the maximum requirement of the
IEC61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater than
±15
kV.
These devices are particularly well−suited for portable electronics
(e.g. wireless handsets, PDAs, notebook computers) because of their
small package and easy−to−use pin assignments. In particular, the
CM1426 is ideal for EMI filtering and protecting data and control lines
for the I/O data ports, LCD display and camera interface in mobile
handsets.
The CM1426 incorporates
OptiGuardt
which results in improved
reliability at assembly. The CM1426 is available in a space−saving,
low−profile Chip Scale Package with RoHS compliant lead−free
finishing.
Features
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WLCSP10
CP SUFFIX
CASE 567BL
WLCSP15
CP SUFFIX
CASE 567BL
WLCSP20
CP SUFFIX
CASE 567BX
MARKING DIAGRAM
N264
CM1426−04
N266
CM1426−06
N268
CM1426−08
N264
N266
N268
= CM1426−04CP
= CM1426−06CP
= CM1426−08CP
ORDERING INFORMATION
Device
CM1426−04CP
Package
CSP−10
(Pb−Free)
Shipping
†
3500/Tape & Reel
•
Four, Six and Eight Channels of EMI Filtering with Integrated
•
•
•
•
•
•
•
ESD Protection
CM1426−06CP
CSP−15 3500/Tape & Reel
(Pb−Free)
0.5 mm Pitch, 10−Bump, 1.96 mm x 1.33 mm Footprint Chip
Scale Package (CM1426−04)
CM1426−08CP
CSP−20 3500/Tape & Reel
0.5 mm Pitch, 15−Bump, 2.96 mm x 1.33 mm Footprint Chip
(Pb−Free)
Scale Package (CM1426−06)
†For information on tape and reel specifications,
0.5 mm Pitch, 20−Bump, 3.96 mm x 1.33 mm Footprint Chip
including part orientation and tape sizes, please
Scale Package (CM1426−08)
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
Network
±8
kV ESD Protection on Each Channel
•
Greater than 20 dB Attenuation (Typical) at 1 GHz
(IEC 61000−4−2 Level 4, Contact Discharge)
•
OptiGuardtCoated
for Improved Reliability at
±15
kV ESD Protection on Each Channel (HBM)
Assembly
These Devices are Pb−Free and are RoHS Compliant
Applications
•
LCD and Camera Data Lines in Mobile Handsets
•
I/O Port Protection for Mobile Handsets, Notebook
Computers, PDAs, etc.
•
EMI Filtering for Data Ports in Cell Phones, PDAs or
Notebook Computers
•
Wireless Handsets
•
Handheld PCs/PDAs
•
LCD and Camera Modules
©
Semiconductor Components Industries, LLC, 2011
March, 2011
−
Rev. 3
1
Publication Order Number:
CM1426/D
CM1426
Table 1. PIN DESCRIPTIONS
Pin(s)
A1
A2
A3
A4
A5
A6
A7
A8
B1−B4
Name
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
GND
Description
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
Device Ground
Pin(s)
C1
C2
C3
C4
C5
C6
C7
C8
Name
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
Description
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
Rating
−65
to +150
100
500
Units
°C
mW
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
−40
to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
C
TOTAL
C
V
DIODE
I
LEAK
V
SIG
Resistance
Total Channel Capacitance
Capacitance C1
Standoff Voltage
Diode Leakage Current (reverse bias)
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
Dynamic Resistance
Positive
Negative
Cut−off Frequency
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
R = 100
W,
C = 17 pF
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
I
DIODE
= 10
mA
V
DIODE
= 3.3 V
I
LOAD
= 10 mA
I
LOAD
=
−10
mA
(Note 2)
5.6
−1.5
±15
±8
2.3
0.9
230
Parameter
Conditions
Min
80
13.6
6.8
Typ
100
17
8.5
6.0
0.1
6.8
−0.8
1
9.0
−0.4
Max
120
20.4
10.2
Units
W
pF
pF
V
mA
V
V
ESD
kV
R
DYN
W
f
C
MHz
1. T
A
= 25
°
C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
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