电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-R0202AS-03-2613-D

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-R0202AS-03-2613-D在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-R0202AS-03-2613-D - - 点击查看 点击购买

WBC-R0202AS-03-2613-D概述

Resistor Networks & Arrays

WBC-R0202AS-03-2613-D规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
lattice CPLD 内部分频问题 (急)
lattice 的芯片(1032E) 当外部输入一个信号为50HZ的方波信号 然后在芯片内部对其分频 可以吗?直接用逻辑门电路做的分频 但是输出的分频不正确是为什么呢?请各位帮下忙,在此先谢过....
烟花献世 FPGA/CPLD
向各位高手请教一个关于MSP430烧写程序的问题
我是第一次使用MSP430这个MCU,在烧写程序方面发现有两种烧写器。一种是一端接JATG口,另一端接在PC机上的并口,这种好像很便宜。另外一种是通过一个仿真盒接在PC的USB口,这种好像贵些。 请问 ......
小威 微控制器 MCU
【AN-1138应用笔记】LINB DLL编程指南
简介 本应用笔记说明LINBWSD.dll库提供的库函数。针对集成电池传感器,可以利用这些函数创建一个USB至LIN下载器。 115163 115164...
EEWORLD社区 ADI 工业技术
MSP430G2553 #define OUTMOD
#define OUTMOD_0 (0*0x20u) /* PWM output mode: 0 - output only */ #define OUTMOD_1 (1*0x20u) /* PWM output mode: 1 - set */ #define OUTMOD_2 (2 ......
寒雪剑91 微控制器 MCU
我宣布:分别一月,我回来啦!顺便和大家讨论一个问题。
首先向大家说声新年快乐,元宵节快乐哈! 昨天晚上到的学校。早晨刚打开电脑,就迫不及待地来坛子了!好久没有这样的感觉了! 来就看到SOSO姐对我的关心啊,我心里真是暖呼呼的,:loveliness: ......
zqzq501311 聊聊、笑笑、闹闹
对于工作也只能尽最大努力,至于领导心里怎么想我们也不去琢磨了
领导太多,工作累!...
eeleader 工作这点儿事

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 388  1455  1280  2439  1328  40  50  53  43  24 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved