电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AG-00-5361-C

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-B0202AG-00-5361-C在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AG-00-5361-C - - 点击查看 点击购买

WBC-B0202AG-00-5361-C概述

Resistor Networks & Arrays

WBC-B0202AG-00-5361-C规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
袖珍式瓦斯报警器
本帖最后由 jameswangsynnex 于 2015-3-3 19:57 编辑 ...
探路者 消费电子
USB ReadFile 出错怎么处理?
我用VC 写USB的应用程序时,发现用ReadFile 有时会出现1167的错误,大家有没有遇到这种情况?怎么处理呢?...
powerding 嵌入式系统
求助,电源电路分析
一个电源电路,请分析一下工作原理以及C3,R3,C4,VT1,VR1的作用,拜托老师帮帮忙。 此内容由EEWORLD论坛网友aacm原创,如需转载或用于商业用途需征得作者同意并注明出处 ...
aacm 电源技术
三段式描述串口发送程序
LIBRARY IEEE;USE IEEE.STD_LOGIC_1164.ALL;USE IEEE.STD_LOGIC_ARITH.ALL;USE IEEE.STD_LOGIC_UNSIGNED.ALL; --LIBRARY ALTERA;--USE ALTERA.MAXPLUS2.ALL; LIBRARY LPM;USE LPM.LPM_COMPONE ......
eeleader FPGA/CPLD
用c#实现windowmobile5的蓝牙打印功能,强人给个思路,谢谢
具体情况是这样的。要求用VS2005的C#编写一个window mobile5上的软件,要求实现这样的功能,用蓝牙连接一台同样有蓝牙功能的打印机,并打印该系统上指定的文件或内容。打印机是CMP-10BT http ......
davidlee2046 嵌入式系统
如果第三方代码有bug,修复之后大家伙怎么和原来的版本适配?
请教一下。大概情况是这样的,我们用了一个第三方的开源代码,里面有些bug,现在把它修复了,想请教大家的是,1、你们修复之后的代码是直接在第三方开源代码里改,还是 2、单独把修改文件拿出来 ......
freebsder 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2118  2344  2540  1260  9  5  18  43  1  11 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved