电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1100R220FLF

产品描述MELF Resistors CHP-1-100-R220-F-LF
产品类别无源元件   
文件大小437KB,共4页
制造商TT Electronics
下载文档 详细参数 全文预览

CHP1100R220FLF在线购买

供应商 器件名称 价格 最低购买 库存  
CHP1100R220FLF - - 点击查看 点击购买

CHP1100R220FLF概述

MELF Resistors CHP-1-100-R220-F-LF

CHP1100R220FLF规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
MELF Resistors
电阻
Resistance
220 mOhms
功率额定值
Power Rating
1 W
容差
Tolerance
1 %
温度系数
Temperature Coefficient
100 PPM / C
最小工作温度
Minimum Operating Temperature
- 55 C
电压额定值
Voltage Rating
350 V
直径
Diameter
2.01 mm
长度
Length
6.38 mm
系列
Packaging
Reel
产品
Product
MELF Resistors
类型
Type
Cylindrical High Power Surface Mount Metal Glaze Resistors
安装风格
Mounting Style
PCB Mount

文档预览

下载PDF文档
Resistors
Cylindrical High Power
Surface Mount Metal Glaze™
CHP
CHP Series
Surface Mount Metal Glaze
TM
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
Up to 2 watts
RoHS-compliant version available
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
AEC-Q200
150°C maximum operating temperature
Cylindrical High Power
Metal Glaze™
thick film element
fired at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
High
nickel barrier
temperature
Solder over
All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)
nickel barrier
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code
1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Maximum
m Change
Maximu
Change
As specified
Test Method
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.3
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
Test Method
Thermal Shock
Low Temperature Operation
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.5
(-65°C)
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Moisture Resistance
Exposure
Resistance to Bonding
High Temperature Exposure
±0.5% + 0.01 ohm
±1% for R>100K ohm
±1% for R>100KΩ
±0.5% +.01 Ω
MIL-R-55342H Par 3.12
MIL-PRF-55342H, §4.8.7
2.5 x
P x R
for 5 seconds
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
±1% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
Temperature Coefficient
Solderability
Life Test
Moisture Resistance
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.11
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
exert pull on chip contacts for 5 seconds
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
Solderability
Life Test
±1% +.01 Ω
IRC – defined
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
Chip mounted in center of 90mm long board, deflected 1mm so as to
(no mechanical damage)
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
95%
0.01 ohm
±1% +
minimum coverage
no mechanical damage
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC reserves the right to make changes in product specification
(no mechanical damage)
without notice or liability.
General Note
Terminal Adhesion
Strength (flex)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
IRC-defined
Device mounted in center of 90mm long board, deflected 1 mm to exert
pull on contacts for 5 seconds
General Note
• Facsimile: 361 992 3377 • Website: www.irctt.com
Telephone: 361 992 7900
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
CHP
BI Technologies
Series Issue March
Welwyn
3
IRC
2011 Sheet 1 of
A subsidiary of
TT electronics plc
http://www.ttelectronics.com/resistors
© TT Electronics plc
03.18
班库急招赴日嵌入式软件工程师和控制应用程序开发工程师
班库急招赴日嵌入式软件工程师和控制应用程序开发工程师 班库猎头!www.intebankhr.com现在急招赴日嵌入式软件工程师和控制应用程序开发工程师 具体职位如下: 1 嵌入式软件工程师 SEレベル ......
intebank 嵌入式系统
LSM6DSO iNEMO惯性模块PCB封装和代码
本帖最后由 littleshrimp 于 2019-5-22 08:31 编辑 STMicroelectronics LSM6DSO iNEMO惯性模块是一款系统级封装器件,配备3D数字加速度计和3D数字陀螺仪。LSM6DSO在高性能模式下提升性能(0. ......
littleshrimp MEMS传感器
数字时钟芯片(二)数字时钟的设计
文章节选自:《ARM Cortex-M0从这里开始》 作者:zhaojun_xf https://bbs.eeworld.com.cn/thread-324656-1-1.html 数字时钟芯片 数字时钟芯片的种类很多,市场上比较流行的有三线的DS1302、I ......
EEWORLD社区 NXP MCU
使用迅为IMX6ULL开发板第一个汇编实验(二)
9.4GPIO时钟 时钟 如果使用GPIO,我们必须要使能GPIO的时钟。i.MX6 ULL的每个外设的时钟可以独立的使能,我们可以关闭不使用的外设时钟,可以达到节能的目的。如果使用某个外设,我们必须要 ......
马佳徐徐 嵌入式系统
PCB设计怎么才能露出基板呢?
本帖最后由 飞海 于 2017-6-11 10:10 编辑 :)请教各位前辈,用AD在画PCB时,怎么才能让板子的某一个小区域内,比如一个半径5mm的圆形,露出基板,就是即没有铜,也没有油墨,也没有锡,要怎 ......
飞海 PCB设计
硬件实用手册
简??介:    这是一份网上由个人出品、维护并完全免费的硬件手册,其中收集了几乎一切与计算机有关的接插件的引脚说明,例如: 各种总线:ISA, EISA, PCI, VESA, CompactPCI, PCMCIA ......
feifei 测试/测量

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2666  813  2588  1800  2185  15  31  8  36  38 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved