Bus Transceivers Octal Bidirectional Transceiver
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, SSOP20,.3 |
| 针数 | 20 |
| 制造商包装代码 | PYG20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Samacsys Description | SSOP 5.3 MM |
| 其他特性 | WITH DIRECTION CONTROL |
| 控制类型 | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | FCT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e3 |
| 长度 | 7.2 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 最大I（ol） | 0.064 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 4.6 ns |
| 传播延迟（tpd） | 4.6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 翻译 | N/A |
| 宽度 | 5.3 mm |
| 74FCT245ATPYG | 5962-9221403MRA | 54FCT245ATLB | 74FCT245ATQG8 | 5962-9221401MRA | 54FCT245ATDB | 54FCT245TLB | 74FCT245CTPGG | 5962-9221405M2A | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Transceivers Octal Bidirectional Transceiver | Bus Transceivers OCTAL TRANSCEIVER | Bus Transceivers Octal Bidirectional Transceiver | Bus Transceivers Octal Bidirectional Transceiver | Bus Transceivers OCYAL TRANSCEIVER | Bus Transceivers Octal Bidirectional Transceiver | Bus Transceivers Octal Bidirectional Transceiver | Bus Transceivers Octal Bidirectional Transceiver | Bus Transceivers OCTAL TRANSCEIVER |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 零件包装代码 | SSOP | CDIP | LCC | QSOP | CDIP | CDIP | LCC | TSSOP | LCC |
| 包装说明 | SSOP, SSOP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | SSOP, SSOP20,.25 | 0.300 INCH, CERDIP-20 | DIP, DIP20,.3 | LCC-20 | TSSOP, TSSOP20,.25 | QCCN, LCC20,.35SQ |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 制造商包装代码 | PYG20 | CD20 | LC20 | PCG20 | CD20 | CD20 | LC20 | PGG20 | LC20 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| 控制类型 | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDSO-G20 | R-GDIP-T20 | S-XQCC-N20 | R-PDSO-G20 | R-GDIP-T20 | R-GDIP-T20 | S-XQCC-N20 | R-PDSO-G20 | S-CQCC-N20 |
| JESD-609代码 | e3 | e0 | e0 | e3 | e0 | e0 | e0 | e3 | e0 |
| 长度 | 7.2 mm | 25.3365 mm | 8.89 mm | 8.6868 mm | 25.3365 mm | 25.3365 mm | 8.89 mm | 6.5 mm | 8.89 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 最大I（ol） | 0.064 A | 0.048 A | 0.048 A | 0.064 A | 0.048 A | 0.048 A | 0.048 A | 0.064 A | 0.048 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | SSOP | DIP | QCCN | SSOP | DIP | DIP | QCCN | TSSOP | QCCN |
| 封装等效代码 | SSOP20,.3 | DIP20,.3 | LCC20,.35SQ | SSOP20,.25 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | TSSOP20,.25 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 | 240 | 240 | 260 | 240 | 240 | 240 | 260 | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 4.6 ns | 4.9 ns | 4.9 ns | 4.6 ns | 7.5 ns | 4.9 ns | 7.5 ns | 4.1 ns | 4.5 ns |
| 传播延迟（tpd） | 4.6 ns | 4.9 ns | 4.9 ns | 4.6 ns | 7.5 ns | 4.9 ns | 7.5 ns | 4.1 ns | 4.5 ns |
| 认证状态 | Not Qualified | Qualified | Not Qualified | Not Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | Qualified |
| 座面最大高度 | 2 mm | 5.08 mm | 2.54 mm | 1.7272 mm | 5.08 mm | 5.08 mm | 2.54 mm | 1.2 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
| 端子面层 | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.65 mm | 2.54 mm | 1.27 mm | 0.635 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED |
| 翻译 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| 宽度 | 5.3 mm | 7.62 mm | 8.89 mm | 3.937 mm | 7.62 mm | 7.62 mm | 8.89 mm | 4.4 mm | 8.89 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
| 筛选级别 | - | MIL-STD-883 | MIL-STD-883 Class B | - | MIL-STD-883 | MIL-STD-883 Class B | MIL-STD-883 Class B | - | MIL-STD-883 |
| Base Number Matches | - | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
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