RF Transceiver 802.11a/b/g World Band Transceiver
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
包装说明 | HVQCCN, |
Reach Compliance Code | compliant |
Factory Lead Time | 6 weeks |
Samacsys Confidence | |
Samacsys Status | Released |
Samacsys PartID | 600033 |
Samacsys Pin Count | 57 |
Samacsys Part Category | Integrated Circuit |
Samacsys Package Category | Other |
Samacsys Footprint Name | QFN50P800X800X80-57N |
Samacsys Released Date | 2017-01-11 21:24:41 |
Is Samacsys | N |
JESD-30 代码 | S-XQCC-N56 |
长度 | 8 mm |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 56 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
座面最大高度 | 0.8 mm |
标称供电电压 | 2.7 V |
表面贴装 | YES |
技术 | BICMOS |
电信集成电路类型 | SUPPORT CIRCUIT |
温度等级 | INDUSTRIAL |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8 mm |
Base Number Matches | 1 |
MAX2828ETN+T | MAX2828ETN | MAX2829ETN-TD | MAX2828ETN-TD | MAX2828ETN-D | MAX2829ETN+D | |
---|---|---|---|---|---|---|
描述 | RF Transceiver 802.11a/b/g World Band Transceiver | RF Transceiver | RF Transceiver | RF Transceiver 802.11a/b/g World Band Transceiver | RF Transceiver | RF Transceiver |
是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
包装说明 | HVQCCN, | 8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5 , TQFN-56 | 8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56 | 8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56 | 8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56 | HVQCCN, |
Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown |
JESD-30 代码 | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 | S-XQCC-N56 |
长度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 56 | 56 | 56 | 56 | 56 | 56 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
电信集成电路类型 | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
Is Samacsys | N | N | - | N | N | - |
Base Number Matches | 1 | 1 | - | 1 | 1 | - |
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