Digital to Analog Converters - DAC 10-BIT QUAD I2C
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | LEAD FREE, MO-187BA, MSOP-10 |
| 针数 | 10 |
| 制造商包装代码 | RM-10 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大模拟输出电压 | 5.499 V |
| 最小模拟输出电压 | 0.001 V |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 最大线性误差 (EL) | 0.2441% |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大稳定时间 | 9 µs |
| 标称安定时间 (tstl) | 7 µs |
| 最大压摆率 | 0.9 mA |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| AD5315BRMZ-REEL | AD5325BRMZ-REEL7 | AD5325BRM-REEL7 | AD5325BRMZ-REEL | AD5315ARM-REEL7 | AD5315BRMZ-REEL7 | AD5325BRMZ | AD5315BRM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital to Analog Converters - DAC 10-BIT QUAD I2C | Digital to Analog Converters - DAC IC 12-BIT QUAD 8uS | Digital to Analog Converters - DAC IC 12-BIT QUAD 8uS | Digital to Analog Converters - DAC IC 12-BIT QUAD 8uS | Digital to Analog Converters - DAC 10-BIT QUAD I2C | Digital to Analog Converters - DAC 10-BIT QUAD I2C | Digital to Analog Converters - DAC IC 12-BIT QUAD 8uS | Digital to Analog Converters - DAC 10-BIT QUAD I2C |
| Brand Name | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | - | 不符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | LEAD FREE, MO-187BA, MSOP-10 | - | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | MO-187BA, MSOP-10 | LEAD FREE, MO-187BA, MSOP-10 | LEAD FREE, MO-187BA, MSOP-10 | MO-187BA, MSOP-10 |
| 针数 | 10 | - | 10 | 10 | 10 | 10 | 10 | 10 |
| 制造商包装代码 | RM-10 | - | RM-10 | RM-10 | RM-10 | RM-10 | RM-10 | RM-10 |
| Reach Compliance Code | compliant | - | not_compliant | compliant | not_compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输出电压 | 5.499 V | - | 5.499 V | 5.499 V | 5.499 V | 5.499 V | 5.499 V | 5.499 V |
| 最小模拟输出电压 | 0.001 V | - | 0.001 V | 0.001 V | 0.001 V | 0.001 V | 0.001 V | 0.001 V |
| 转换器类型 | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | - | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输入格式 | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 代码 | S-PDSO-G10 | - | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e3 | - | e0 | e3 | e0 | e3 | e3 | e0 |
| 长度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 最大线性误差 (EL) | 0.2441% | - | 0.2441% | 0.2441% | 0.3906% | 0.2441% | 0.2441% | 0.2441% |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 10 | - | 12 | 12 | 10 | 10 | 12 | 10 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | - | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 105 °C | - | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 | - | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 240 | 260 | 240 | 260 | 260 | 240 |
| 电源 | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大稳定时间 | 9 µs | - | 10 µs | 10 µs | 9 µs | 9 µs | 10 µs | 9 µs |
| 标称安定时间 (tstl) | 7 µs | - | 8 µs | 8 µs | 7 µs | 7 µs | 8 µs | 7 µs |
| 最大压摆率 | 0.9 mA | - | 0.9 mA | 0.9 mA | - | 0.9 mA | 0.9 mA | 0.9 mA |
| 标称供电电压 | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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