MC74VHC1GT50
Noninverting Buffer /
CMOS Logic Level Shifter
TTL−Compatible Inputs
The MC74VHC1GT50 is a single gate noninverting buffer
fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The device input is compatible with TTL−type input thresholds and
the output has a full 5 V CMOS level output swing. The input protection
circuitry on this device allows overvoltage tolerance on the input,
allowing the device to be used as a logic−level translator from 3 V
CMOS logic to 5 V CMOS Logic or from 1.8 V CMOS logic to 3 V
CMOS Logic while operating at the high−voltage power supply.
The MC74VHC1GT50 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1GT50 to be used to interface high voltage to
low voltage circuits. The output structures also provide protection
when V
CC
= 0 V. These input and output structures help prevent
device destruction caused by supply voltage − input/output voltage
mismatch, battery backup, hot insertion, etc.
Features
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MARKING
DIAGRAMS
5
1
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
1
5
VL M
G
G
M
5
5
1
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
VL
M
G
1
VL M
G
G
•
•
•
•
•
•
•
•
•
•
Designed for 1.65 V to 5.5 V
CC
Operation
High Speed: t
PD
= 3.5 ns (Typ) at V
CC
= 5 V
Low Power Dissipation: I
CC
= 1
mA
(Max) at T
A
= 25°C
TTL−Compatible Inputs: V
IL
= 0.8 V; V
IH
= 2.0 V, V
CC
= 5 V
CMOS−Compatible Outputs: V
OH
> 0.8 V
CC
; V
OL
< 0.1 V
CC
@Load
Power Down Protection Provided on Inputs and Outputs
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
Chip Complexity: FETs = 104; Equivalent Gates = 26
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•
These Devices are Pb−Free and are RoHS Compliant
NC
1
5
V
CC
PIN ASSIGNMENT
1
2
3
4
5
NC
IN A
GND
OUT Y
V
CC
IN A
2
L
H
FUNCTION TABLE
A Input
Y Output
L
H
GND
3
4
OUT Y
Figure 1. Pinout
(Top View)
IN A
1
OUT Y
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
©
Semiconductor Components Industries, LLC, 2015
1
October, 2015 − Rev. 16
Publication Order Number:
MC74VHC1GT50/D
MC74VHC1GT50
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
I
CC
P
D
q
JA
T
L
T
J
T
stg
V
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V
CC
and GND
Power dissipation in still air
Thermal resistance
Lead temperature, 1 mm from case for 10 secs
Junction temperature under bias
Storage temperature
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
Above V
CC
and Below GND at 125°C (Note 4)
SC−88A, TSOP−5
SC−88A, TSOP−5
V
OUT
< GND; V
OUT
> V
CC
V
CC
= 0
High or Low State
Characteristics
Value
−0.5 to +7.0
−0.5 to +7.0
−0.5 to 7.0
−0.5 to V
CC
+ 0.5
−20
+20
+25
+50
200
333
260
+150
−65 to +150
> 2000
> 200
N/A
±500
Unit
V
V
V
mA
mA
mA
mA
mW
°C/W
°C
°C
°C
V
I
Latchup
Latchup Performance
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
t
r
, t
f
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
V
CC
= 0
High or Low State
Characteristics
Min
1.65
0.0
0.0
0.0
−55
0
0
Max
5.5
5.5
5.5
V
CC
+125
100
20
Unit
V
V
V
°C
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
NORMALIZED FAILURE RATE
Junction
Temperature
°C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130
°
C
TJ = 100
°
C
TJ = 120
°
C
TJ = 110
°
C
TJ = 80
°
C
100
TIME, YEARS
TJ = 90
°
C
1
1
10
1000
Figure 3. Failure Rate vs. Time Junction Temperature
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MC74VHC1GT50
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol
V
IH
Parameter
Minimum
High−Level
Input Voltage
T
A
= 25°C
Min
0.50 V
CC
0.45 V
CC
1.4
2.0
2.0
0.10 V
CC
0.15 V
CC
0.53
0.8
0.8
V
CC
− 0.1
2.9
4.4
2.58
3.94
0.0
0.0
0.1
0.1
0.1
0.36
0.36
$0.1
3.0
4.5
T
A
≤
85°C
Max
Min
0.50 V
CC
0.45 V
CC
1.4
2.0
2.0
0.10 V
CC
0.15 V
CC
0.53
0.8
0.8
V
CC
− 0.1
2.9
4.4
2.48
3.80
0.1
0.1
0.1
0.44
0.44
$1.0
−55
≤
T
A
≤
125°C
Min
0.50 V
CC
0.45 V
CC
1.4
2.0
2.0
0.10 V
CC
0.15 V
CC
0.53
0.8
0.8
V
CC
− 0.1
2.9
4.4
V
2.34
3.66
0.1
0.1
0.1
V
0.52
0.52
$1.0
mA
V
V
V
Test Conditions
(V)
1.65 to 2.29
2.3 to 2.99
3.0
4.5
5.5
Typ
Max
Max
Unit
V
V
IL
Maximum
Low−Level
Input Voltage
1.65 to 2.29
2.3 to 2.99
3.0
4.5
5.5
V
OH
Minimum
High−Level
Output
Voltage
V
IN
= V
IH
I
OH
= −50
mA
V
IN
= V
IH
I
OH
= −4 mA
I
OH
= −8 mA
1.65 to 2.99
3.0
4.5
3.0
4.5
1.65 to 2.99
3.0
4.5
3.0
4.5
0 to
5.5
V
OL
Maximum
Low−Level
Output
Voltage
V
IN
= V
IL
I
OL
= 50
mA
V
IN
= V
IL
I
OL
= 4 mA
I
OL
= 8 mA
I
IN
Maximum
Input
Leakage
Current
Maximum
Quiescent
Supply
Current
Quiescent
Supply
Current
Output
Leakage
Current
V
IN
= 5.5 V or GND
I
CC
V
IN
= V
CC
or GND
5.5
1.0
20
40
mA
I
CCT
Input: V
IN
= 3.4 V
5.5
1.35
1.50
1.65
mA
I
OPD
V
OUT
= 5.5 V
0.0
0.5
5.0
10
mA
Î
Î Î
ÎÎ Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ ÎÎ Î ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎÎÎÎ Î
Î ÎÎ Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS
C
load
= 50 pF, Input t
r
= t
f
= 3.0 ns
T
A
= 25°C
Typ
T
A
≤
85°C
−55
≤
T
A
≤
125°C
Min
Max
Symbol
t
PLH
,
t
PHL
Parameter
Test Conditions
Min
Max
Min
Max
Unit
ns
ns
ns
Maximum
Propagation
Delay, Input A to Y
V
CC
= 1.8
±
0.15 V
V
CC
= 2.5
±
0.2 V
V
CC
= 3.3
±
0.3 V
V
CC
= 5.0
±
0.5 V
C
IN
Maximum Input
Capacitance
C
L
= 15 pF
16.6
13.3
19.5
10.0
13.5
6.7
7.7
10
18.0
14.5
22.0
22.0
17.5
25.5
13.0
17.5
8.5
9.5
10
pF
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
4.5
6.3
3.5
4.3
5
11.0
15.0
7.5
8.5
10
Typical @ 25°C, V
CC
= 5.0 V
C
PD
Power Dissipation Capacitance (Note 5)
12
pF
5. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
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3
MC74VHC1GT50
A
50%
GND
t
PLH
Y
50% V
CC
V
OL
t
PHL
V
OH
V
CC
Figure 4. Switching Waveforms
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
C
L
*
*Includes all probe and jig capacitance
Figure 5. Test Circuit
ORDERING INFORMATION
Device
M74VHC1GT50DFT1G
NLVVHC1GT50DFT1G*
M74VHC1GT50DFT2G
NLVVHC1GT50DFT2G*
M74VHC1GT50DTT1G
NLV74VHC1GT50DTT1G*
TSOP−5 / SOT−23 / SC−59
(Pb−Free)
SC−88A / SOT−353 / SC−70
(Pb−Free)
3000 / Tape & Reel
Package
Shipping
†
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74VHC1GT50
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
S
1
2
3
−B−
DIM
A
B
C
D
G
H
J
K
N
S
D
5 PL
0.2 (0.008)
M
B
M
N
J
C
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
---
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
---
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
H
K
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm
inches
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