Atmel AT97SC3204
Trusted Platform Module LPC Interface
SUMMARY DATASHEET
Features
Fully compliant to the Trusted Computing Group (TCG) Trusted Platform Module
(TPM) version 1.2 specification
Compliant with TCG PC client-specific TPM Interface Specification (TIS) version 1.2
Single-chip, turnkey solution
Hardware asymmetric crypto engine
Atmel
®
AVR
®
RISC microprocessor
Internal EEPROM storage for RSA keys
33MHz Low Pin Count (LPC) bus for easy PC interface
Secure hardware and firmware design and chip layout
Internal, high-quality Random Number Generator (RNG) – FIPS 140-2 compliant
NV storage space for 1756 bytes of user defined data
3.3V supply voltage
28-lead thin TSSOP, 28-lead wide TSSOP, or 40-pad QFN packages
Offered in both commercial (0 to 70°C) and industrial (-40 to +85°C)
temperature ranges
Description
The Atmel AT97SC3204 is a fully integrated security module designed to be integrated
into personal computers and other embedded systems. It implements version 1.2 of the
Trusted Computing Group (TCG) specification for Trusted Platform Modules (TPM).
The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA
signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1
accelerator is 20μs per 64-byte block.
The chip communicates with the PC through the LPC interface. The TPM supports
SIRQ (for interrupts) and CLKRUN to permit clock stopping for power savings in mobile
computers.
This is a summary document.
The complete document is
available under NDA. For more
information, please contact
your local Atmel sales office.
Atmel-5295ES-TPM-AT97SC3204-LPC-Interface-Datasheet-Summary-032013
1.
Pin Configurations and Pinouts
Table 1-1.
Pin name
V
CC
SB3V
GND
LRESET#
LAD0
LAD1
LAD2
LAD3
LCLK
LFRAME#
CLKRUN#
LPCPD#
SERIRQ
GPIO-Express-00
TestI
TestBI
ATest
NC
NBO
Table 1-2.
Pinouts
28-pin TSSOP
4.4mm x 9.7mm Body
0.65mm Pitch
28-pin TSSOP
6.1mm x 9.7mm Body
0.65mm Pitch
40-pin QFN
6.0mm x 6.0mm Body
0.50mm Pitch
Pin Configurations
Function
3.3V Supply Voltage
Standby 3.3V Supply Voltage
Ground
PCI Reset Input Active Low
LPC Command, Address, Data Line Input/Output
LPC Command, Address, Data Line Input/Output
LPC Command, Address, Data Line Input/Output
LPC Command, Address, Data Line Input/Output
33MHz PCI Clock Input
LPC FRAME Input
PCI Clock Run Input/Output
LPC Power-Down Input
Serialized Interrupt Request Input/Output
GPIO assigned to TPM_NV_INDEX_GPIO_00
Test Input (Disabled)
Test Input (Disabled)
Atmel Test Pin
No Connect
Not Bounded Out
38 LPCPD#
37 SERIRQ
40 ATest
39 ATest
36 NBO
35 NBO
34 NBO
33 NBO
32 NBO
CLKRUN# 19
ATest
ATest
ATest
GND
SB3V
GPIO-Express-00
NC
TestI
TestBI
1
2
3
4
5
6
7
8
9
28 LPCPD#
27 SERIRQ
26 LAD0
25 GND
24 V
CC
23 LAD1
22 LFRAME#
21 LCLK
20 LAD2
19 V
CC
18 GND
17 LAD3
16 LRESET#
15 CLKRUN#
ATest
GND
SB3V
GPIO-Express-00
NC
TestI
TestBI
V
CC
GND
1
2
3
4
5
6
7
8
9
NBO 12
NBO 13
NBO 14
NBO 15
NBO 16
NBO 17
NBO 18
NBO 12
NBO 13
NBO 14
Atmel AT97SC3204 LPC Interface [SUMMARY DATASHEET]
Atmel-5295ES-TPM-AT97SC3204-LPC-Interface-Datasheet-Summary-032013
LRESET# 20
NBO 11
V
CC
10
GND 11
NBO 10
31 NBO
30 LAD0
29 GND
28 V
CC
27 LAD1
26 LFRAME#
25 LCLK
24 LAD2
23 V
CC
22 GND
21 LAD3
2
2.
Block Diagram
ROM
Program
EEPROM
Program
33MHz
LPC
Interface
AVR
8-bit RISC
CPU
SRAM
GPIO-Express-00
GPIO
RNG
EEPROM
Data
CRYPTO
Engine
Timer
Physical
Security
Circuitry
The TPM includes a hardware random number generator, including a FIPS-approved Pseudo Random Number
Generator that is used for key generation and TCG protocol functions. The RNG is also available to the system to
generate random numbers that may be needed during normal operation.
The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the standard
TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage this internal key
cache.
The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the chip.
In addition, Atmel provides the necessary device driver software for integration into certain operating systems, along with
BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and ODMs during initialization
and verification of the TPM during board assembly.
Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG Web
site located at
https://www.trustedcomputinggroup.org.
TPM features specific to PC Client platforms are specified in the
“TCG PC Client Specific TPM Interface Specification, Version 1.2”, also available on the TCG web site. Implementation
guidance for 32-bit PC platforms is outlined in the “TCG PC Client Specific Implementation Specification for Conventional
BIOS for TCG Version 1.2”, also available on the TCG website.
Atmel AT97SC3204 LPC Interface [SUMMARY DATASHEET]
Atmel-5295ES-TPM-AT97SC3204-LPC-Interface-Datasheet-Summary-032013
3
3.
Ordering Information
Atmel Ordering Code
AT97SC3204
(1)
AT97SC3204
(1)
Package
28X1 (28-pin thin TSSOP)
40ML1 (40-pin QFN)
Lead-free, RoHS
Operating Range
Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
Note:
1.
Please see the AT97SC3204 datasheet addendum for the complete catalog number ordering code.
Package Type
28X1
40ML1
28-lead, 4.4mm body width, Plastic Thin Shrink Small Outline (thin TSSOP)
40-pad 6.0 x 6.0x0.9mm body, 0.50mm pitch, Very-thin Quad Flat No Lead (VQFN)
Atmel AT97SC3204 LPC Interface [SUMMARY DATASHEET]
Atmel-5295ES-TPM-AT97SC3204-LPC-Interface-Datasheet-Summary-032013
4
4.
4.1
Package Drawings
28X1 — 28-lead Thin TSSOP
TOP VIEW
B
END VIEW
C
DETAIL 'A'
(12° REF)
D
14
1
S
R1
E1
C
L
R
(0°~8°)
E
L
d
0.20 C B A
2X N/2 TIPS
A
15
28
e
A2
D
C
A
SEE DETAIL "A"
(1.00 REF)
(12° REF)
d
0.10
C
28X b
A1
j n
0.10
m
C B A
SEATING
PLANE
SIDE VIEW
SYMBOL
A
A1
A2
b
c
D
COMMON DIMENSIONS
(UNIT OF MEASURE=MM)
MIN
-
0.05
0.85
0.19
0.09
9.60
NOM
-
-
0.90
-
-
9.70
6.40BSC
4.30
4.40
0.65 BSC
0.45
0.09
0.09
0.20
0.60
-
-
-
0.75
-
-
-
4.50
1
MAX
1.10
0.15
0.95
0.30
0.20
9.80
Note:
1. Refer to JEDEC drawing MO-153,variation AE
2. Dimension D does not include mold flash, protrusions or gate burrs. Mold
flash,protrusions or gate burrs shall not exceed 0.15mm per end. Dimension E1
does not include interlead flash or protrusion. Interlead flash or protrusion
shall not exceed 0.25mm per side.
3. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08mm total in excess of the "b" dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
E
E1
e
L
R
R1
S
TITLE
Package Drawing Contact:
packagedrawings@atmel.com
28X1, 28-lead, 4.4mm Body Width, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
TFL
DRAWING NO.
28X1
Atmel AT97SC3204 LPC Interface [SUMMARY DATASHEET]
Atmel-5295ES-TPM-AT97SC3204-LPC-Interface-Datasheet-Summary-032013
H
0.25
NOTE
2
1
7/8/2011
REV.
A
5
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